Authors List | Microwave Journal

Home » Authors

Authors (sorted by last name)

Richard Mumford, Microwave Journal International Editor, Connects with HUBER+SUHNER; Radiall; and Rosenberger

:

: Frank Cavallaro, CEO, A2 Global

2

2(Pi)-LABS GmbH Bochum, Germany

29(Pi)-LABS GmbH Bochum, Germany

2J Antenna

3

3D Glass Solutions

3D Smith Chart Tools S.R.L.

3GPP

3H Communication Systems, Irvine, Calif.

4

4RF Communications

5

7

7Layers

A

A Mediavilla, A. Tazon, J.A. Pereda, M. Lazaro, C. Pantaleon, I. Santamaria

A. Bessemoulin, W. Marsetz, Y. Baeyens, R. Osorio, H. Massler, A. Hulsmann and M. Schlechtweg

A. Edwards, C. Park, S. Singhal, Q. Martin, K.J. Linthicum and I.C. Kizilyalli, Nitronex Corp.

A. Goñi, J. del Pino, O. Medina, S.L. Khemchandani and A. Hernández, Universidad de Las Palmas de Gran Canaria

A. Hedden, Combat Capabilities Development Command, Army Research Laboratory, Adelphi, Md.

A. Kotyukov, A. Nikonov, A. Zaslavskiy and Yu. Ivanov, Morion Inc., St. Petersburg, Russia

A. Kotyukov, Y. Ivanov and A. Nikonov, Morion Inc., Russia

A. Lázaro, M.C. Maya and L. Pradell

A. LeFevre, Thales Communications & Security SA; F. Magne, Bluwan Ltd.

A. Liero, O. Bengtsson and W. Heinrich, Ferdinand-Braun-Institut, Leibniz-Institut fur Hochstfrequenztechnik

A. Nešić, I. Radnovicć, Z. Mićić and S. Jovanović, IMTEL Institute, Belgrade, Serbia

A. Petosa and A. Ittipiboon, Communications Research Centre Canada

A. Shoory, A. Smorgonskiy, and F. Vega, Swiss Federal Institute of Technology, Lausanne

A. Wolf and S. Garrison, Kansas City National Security Campus, Kansas City, Mo.

A. Zamanifekri and Roberto Gaddi, Cavendish Kinetics BV, The Netherlands

A.E. Ashtiani, T. Gokdemir, G. Passiopoulos, A.A. Rezazadeh, S. Nam and I.D. Robertson

A.H. Feingold, R.L. Wahlers, P. Amstutz, C. Huang, S.J. Stein and J. Mazzochette

A.M. Peláez-Pérez, J.I. Alonso and P. Almorox-González, Universidad Politécnica de Madrid, Madrid, Spain; J. González-Martín, Indra Sistemas S.A., Tor

A.P. Venguer, J.L. Medina, R.A. Chávez, A. Velázquez and A. Zamudio, CICESE Research Center; G.N. Il’in, Special Astrophysics Observatory

A.P.S. (Paul) Khanna, Phase Matrix Inc.

A.P.S. Khanna, NI Microwave Components, Santa Clara, Calif.

A.S. Virdee and B.S. Virdee

A.T. Mobashsher, M.T. Islam and N. Misran, Universiti Kebangsaan Malaysia, Bangi, Selangor, Malaysia

A.T. Wall

A.T. Wall Co.

A*STAR Institute of Microelectronics

A1 Microwave Ltd.

AABroadband

AAI Test & Training

Aaronia AG, Strickscheid, Germany

Abaco Systems

Abby Monaco, CID. Product and Marketing Mgr. at Intercept Technology Inc

Abdelnasser A. Eldek, Jackson State University

Abdelnasser A. Eldek, Jackson State University, Jackson, MS

Abderraouf Methlouthi Olivier Rouaud and Lionel Boillereaux

Abdullah Eroglu, Purdue University, Fort Wayne, IN

Abhay Samant, Hiller Measurements

Abhay Samant, Tanim Taher and Ian Wong, National Instruments, Austin, Texas

Abhishek Kapoor, Analog Devices Inc. Norwood, Mass.

Abhishek Tiwari, Babak Memarzadeh, Honglei Chen and George Mencoff, MathWorks

Abhishek Tiwari, Giorgia Zucchelli, Leif Hille, Sourabh Joshi, MathWorks

Abhishek Tiwari, product marketing and Vijayendra Kumar, product marketing

Abhishek Tiwari, Sara James and Landan Rubenstein, MathWorks

Abhishek Tiwari, Shashank Kulkarni, and Sourabh Joshi, MathWorks

ABI Research

ABI Research

Abigail Eisenklam Qorvo, Inc. and Vanderbilt University, Charles Trantanella Qorvo, Inc.

Abilis Systems

Abinash Sinha, Reiner Stuhlfauth and Fernando Schmitt, Rohde & Schwarz, Munich, Germany

ABIresearch®

Abolfazl Azari

Abracon Corp.

ACB

Accel Instruments, Irvine, Calif.

Accel-RF

Accel-RF Instruments Corp., San Diego, Calif.

Acceleware

Accellera

ACCO Semiconductor, Inc.,

Accumet Engineering Inc.

Ace Antenna Co.

AceAxis

Acentury, Richmond Hill, Ontario

ACG Research

Active Spectrum

Adam Baddeley

Adaura Technologies, Roseville, Calif.

Adel Barakat, Ahmed Allam and Adel B. Abdel-Rahman, Egypt-Japan University of Science and Technology

Adel Kouki, Fakher Sboui and Lassaad Latrach, University of Tunis El Manar, Tunis, Tunisia

ADI

Adrian O’Connor, CEO, Benetel

Adrian Sutinjo and Edwin Tung, Murandi Communications Ltd.

Advanced Linear Devices Inc.

Advanced Microwave Technologies Inc., ADVANTECH

Advanced Switch Technology

Advanced Test Equipment Rental

Advantage Electronic Product Development

Advantech Wireless

Advantech, Advanced Microwave Technologies Inc.

Advantest America Measuring Solutions Inc, Edison, NJ

Advantest Corp.

AEM Inc.

Aeris Communications

Aeroflex

Aeroflex / Metelics, Londonderry, NH

Aeroflex / Weinschel, Frederick, MD

Aeroflex and Centro de Tecnología de las Comunicaciones

Aeroflex Comstron

Aeroflex Holding Corp.

Aeroflex Inc.

Aeroflex Limited

Aeroflex Ltd.

F. Rodriguez-Morales, S. Gogineni, F. Ahmed, C. Carabajal, A. Paden, C. Leuschen, J. Paden and J. Li, University of Kansas, Lawrence, Kan.; W. Fields, Cobham/ Aeroflex Metelics, Sunnyvale, Calif.; J. Vaughan, Los Alamos National Laboratory, Albuquerque, New Mexico

Aeroflex Test Solutions

Aeroflex Test Solutions, Instruments Division

Aeroflex-KDI Integrated Products

Aeroflex-Metelics

Aeroflex/7 layers

Aeroflex/Inmet

Aeroflex/Inmet, Ann Arbor, MI

Aeroflex/Metelics

Aeroflex/Weinschel Inc.

AeroVironment Inc.

Aethercomm

Aethercomm Imc.

Aethercomm Inc., Carlsbad, CA

Aethercomm Inc., San Marcos, CA

Aethercomm, Inc.

AFP

Afshin S. Daryoush, Kai Wei, Tianchi Sun and Li Zhang, Drexel University, Philadelphia, Pa., USA

Afshin S. Daryoush, Tianchi Sun and Nicholas Bromhead, Drexel University

Afshin S. Daryoush, Tianchi Sun, Kai Wei and Francis T. Pantano, Drexel University, Philadelphia, Pa.

Afshin S. Daryoush(1), Ajay Poddar(2), Tianchi Sun(1), and Ulrich L. Rohde(2), Drexel University(1); Synergy Microwave(2)

AFT Microwave GmbH

Agfa

Agile Microwave Technology Inc.

Agilent

Agilent EEsof

Agilent EEsof EDA

Agilent EEsof EDA Santa Rosa, CA

Agilent EEsof EDA, Santa Clara, CA

Agilent Technologies

Agilent Technologies Inc. and NXP Semiconductors

Agilent Technologies Inc., Santa Clara, CA

Agilent Technologies Inc., Santa Clara, CA

Agilent Technologies Inc., Santa Clara, CA

Agilent Technologies Inc., Santa Clara, CA

Agilent Technologies/Lime Microsystems

Agilent Technoologies

Agilent White Paper

AHAM

Ahmed Toaha Mobashsher1,2 and Rabah W. Aldhaheri1, King Abdulaziz University1, Jeddah, Saudi Arabia The University of Queensland2, Brisbane, Australia

Ahmet Sertbas, Istanbul University

David Aichele, Akoustis Technologies

AIM UK

Aimeric Bisognin, University Nice-Sophia Antipolis and ST Microelectronics

Air Force Research Laboratory SBIR

Airbiquity Inc.

Airbus Defence and Space

Airbus Group

Airbus Military

Ajay K. Poddar and Ulrich L. Rohde, Synergy Microwave Corp., Paterson, N.J.

Ajay K. Poddar and Ulrich L. Rohde, Synergy Microwave Corporation, USA

Ajay K. Poddar and Ulrich L. Rohde, Synergy Microwave, N.J., U.S.

Ajay K. Poddar, Synergy Microwave Corporation, Paterson, N.J., U.S.

Ajay K. Poddar, Synergy Microwave, Paterson, N.J.

Ajit Pai, FCC Chairman

Akash Systems Inc., San Francisco, Calif.

Aki Nakatani and Lawrence Williams, Ansoft Corp.

Akoustis

Alain Michel

Alain Michel, Ansoft LLC

Alain Michel, Erwan Lecomte, ANSYS

Alan J. Fenn, MIT Lincoln Laboratory

Alan Jenkins, Tyco Electronics, M/A-COM Products

Alan Lindner, StratEdge Corp.

Alan Noll

Alan Salari, Quaxys LLC, Vienna, Va.

Alan Thompson and Martin Thompson, Eureco Technologies Ltd., Ryde, Isle of Wight, U.K.

Alan Victor and Walter Nagy, Nitronex Corp., Durham, NC

Alastair Upton and Ian Gresham, Anokiwave, Billerica, MA

Alastair Upton and Victor Steel RFMD Inc. Greensboro, NC

Albert J. Klappenberger and William B. Lurie

Albert Jerng, RFIC 2012 General Chairman

Alberto Asensio, José Luis Serrano, Javier Gismero and Alvaro Blanco Universidad Politécnica de Madrid, Department of Signals Systems and Radiocommuni

Alberto Asensio, Jose Luis Serrano, Javier Gismero and Alvaro Blanco, Universidad Politecnica de Madrid

Albrecht Telecommunications GmbH, Hunenberg, Switzerland

Alcatel

Alcatel Alenia Space

Alcatel Lucent

Alcatel Telecom Radio, Space & Defense Division

Alcatel-Lucent

Alcatel-Lucent and EADS (DS)

Alcatel-Lucent/Indra

Alejandro Buritica, National Instruments, Austin, Texas

Alereon Inc.

Alessandro Scannavini, Lars J. Foged, Meryam Abou El Anouar, Nicolas Gross, John Estrada

Alex Blenkinsop, Saint-Gobain, Merrimack, N.H.

Alex D. Lapidus

Alex D. Lapidus and Chris Rossiter, L3 Communications Narda Microwave-West

Alex D. Lapidus; L3 Communications Narda-West; Folsom, CA

Alex Lapidus, L-3 Communications, Narda Microwave-West

Alexander Chenakin Phase Matrix Inc. San Jose, CA

Alexander Chenakin, Micro Lambda Wireless Inc., Fremont, Calif.

Alexander Chenakin, Phase Matrix Inc., San Jose, CA

Alexander Chenakin, Phase Matrix/National Instruments

Alexander Chenakin, Suresh Ojha and Sadashiv Phadnis, Anritsu Company, Morgan Hill, Calif.

Alexander Chenakin, Vice President, Phase Matrix Signal Sources

Alexander E. Braun

Alexander Yarovoy

Alexandra Foley, COMSOL Inc., Burlington, MA

Alexandre Manchec, Yann Clavet, Eric Rius, Abbas Elmostrah, Elliptika

Alexis Allegra and Michael Spinali, RADX Technologies, San Diego, Calif.; David Carey, Wilkes University, Wilkes-Barre, Pa.

Alfonso J. Zozaya, Eduard Bertran, Alberti and Jordi Berenguer-Sau

Alfred Grayzel, Planar Monolithics Industries Inc.

Ali A. Rezazadeh, EuMIC 2011 Conference Chair

Ali Abuelma’atti

Ali Darwish

Ali M.T. Abuelma'atti and Ian Thayne, University of Glasgow, Glasgow, Scotland; Muhammad Taher Abuelma'atti, King Fahd University of Petroleum and Min

Ali Zamanian

Alice Ford-Hutchinson, Product Manager, Acceleware Corp.

ALifecom

Aline Friedrich and Bernd Geck, Leibniz Universitat Hannover; Malte Fengler, LPKF Laser & Electronics AG

Allan R. Scott

Allen Chien

Allen Henley, Agilent Technologies Inc.

Allen Katz

Alliance for Wireless Power (A4WP)

Alpha Industries

Alpha Industries Inc.

Alpha Micro Wireless

Alpine Investors

Alta Devices

Altair

Altair Development S.A. (Pty) Ltd.

Altair Engineering Inc., Troy, Mich.

Altair Semiconductor

Altair/FEKO, Troy, Mi.

Altaria Services

Altice

Altis Semiconductor

Altium Ltd.

Altum RF

Alvarion Technologies

Amalfi Semiconductor Inc.

Amanda MacArthur, Mequoda.com

Amarpal (Paul) Khanna, National Instruments, Santa Clara, Calif.

AMCAD

AMCAD Engineering

AMCAD Engineering, Limoges, France

Amcom Communications

Ameer Taimour Khan, Muhammad Ali Riaz, Humayun Shahid and Yasar Amin, University of Engineering and Technology, Taxila, Pakistan

AMERGINT Technologies, Colorado Springs, Colo., Abaco Systems, Huntsville, Ala.

America II Electronics Inc.

American Microwave Corp.

American Standard Circuits

American Technical Ceramics

AMETEK

AMETEK Inc.

AMETEK NSI-MI Technologies

Amina Otmani, Naima Benmostefa and Bouchra Rahali, University of Tlemcen, Algeria

Amir Effendy Muhammad-Afifi and Widad Ismail, Universiti Sains, Pulau Pinang, Malaysia; Jit Singh Mandeep, Universiti Kebangsaan, Darul Ehsan, Malaysi

Amirhossein Ghaderi and Saeed Roshani, Islamic Azad University

Amit Bahl, Sierra Circuits, Sunnyvale, Calif.

Amit Gulhane, Assistant Manager, and Tejaswi Singh, Analyst, A&D Group at MarketsandMarkets

Amit Rawal, Monash University, Clayton, Victoria, Australia

Amitava Ghosh, Nokia Bell Labs, Arlington Heights, Ill.

Amitava Ghosh, Rapeepat Ratasuk and Anil M. Rao, Nokia Bell Labs, Naperville, Ill.

AML Communications

AML Communications Inc.

AMO/SUSS MicroTec

Amolak Singh Badesha; Agilent Technologies, EEsof, Santa Rosa, CA

Amp’ed RF Inc.

Amphenol Connex

Amphenol Industrial Global Operations

Amphenol Invotec Ltd.

Amphenol RF, Danbury, Conn.

Amphenol RF, Danbury, CT

Ampleon and RFMW

Ampleon, Nijmegen, Netherlands

Amplical Corp., Whippany, N.J.

Amplidyne Inc.

Amplifier Research

Amplifier Solutions Corp.

Amplifier Technology

AmpliTech and PMI

AmpliTech Inc.

ams AG

ANADIGICS

ANADIGICS Inc.

Analod Devices

Analog Devices

Analog Devices

Analog Devices

Analog Devices Inc.

Analog Devices Inc., Norwood, Mass.

Analog Devices Inc., Norwood, Mass.

Analog Devices Inc., Norwood, Mass.

Analog Devices, Inc., Wilmington, Mass.

Analog Devices, Norwood, Mass.

Analogic Corporation

Analysys Mason

AnaPico

AnaPico AG

AnaPico AG, Glattbrugg, Switzerland

AnaPico AG, Zurich, Switzerland

AnaPico AG, Zurich, Switzerland

AnaPico Inc., Zurich, Switzerland

Anapico Ltd.

AnaPico Ltd., Glattbrugg, Switzerland, BNC, San Rafael, Calif.

AnaPico Ltd., Zurich, Switzerland

AnaPico Ltd., Zurich, Switzerland; Berkeley Nucleonics, San Rafael, Calif.

AnaPico of Switzerland

Anaren

Anaren Inc., East Syracuse, NY

Anaren Inc., Syracuse, N.Y.

Anaren Microwave Inc.

Anaren Microwave Inc., E. Syracuse, NY

Anaren, Syracuse, NY

Anatech Electronics

Anatoli Stein and Lauri Viitas (measurements performed by Vasily Morozov, Software by Alexey Egorov and Alexander Bolotov)

Ancortek Inc., Fairfax, Va.

Song Chengtian, Beijing Institute of Technology, Beijing, China Zhang Xiangjun, Zhou Li and Ma Xiaoping China University of Mining and Technology, Xuzhou, China

and University of Wisconsin-Madison(2)

Kristen Anderson

Anderson Power Products®

Andrea Arias-Purdue and Petra Rowell, Teledyne Technologies, Thousand Oaks, Calif.

Andreas Barchanski, CST AG, Germany, Jens Krämer, Pietro Luzzi, Festo AG, Germany

Andreas Gronefeld, Ingenieurbüro Gronefeld, Germany

Andreas Roessler and Sandra Merkel, Rohde & Schwarz, Munich, Germany

Andreas Roessler, Rohde & Schwarz, Munich, Germany

Andreas Rossler and Meik Kottkamp, Rohde & Schwarz, Munich, Germany

Andrei Grebennikov

Andrei Grebennikov, Alcatel-Lucent, Dublin, Ireland

Andrei Grebennikov, M/A-COM Eurotec Operations

Andrei Grebennikov, M/A-COM Eurotec Operations, Cork, Ireland

Andrei Müller, Dan C. Dascalu, IMT-Bucharest; Pablo Soto, Vicente E. Boria, University Politécnica de Valencia

Andrej Rumiantsev and Jean-Pierre Teyssier, 2018 Spring ARFTG Technical Program Committee Co-Chairs

Andrej Rumiantsev, Toe Naing Swe, MPI Corp., Hsinchu, Taiwan; Andreas Henkel, Rohde & Schwarz, Munich, Germany

Andrej Rumiantzev and Kooho Jung, MPI Corp., Hsinchu, Taiwan

Andrew

Andrew Corp.

Andrew Edwards, Bernard Geller and Isik C. Kizilyalli, Nitronex Corp.

Andrew Gibson, General Chairman of EuMW 2016; Ivar Bazzy, President, Horizon House Publications

Andrew Gorevoy, Micran, Tomsk, Russia

Andrew Laundrie, Eravant, formerly Sage Millimeter Inc., Torrance, Calif.

Andrew Laundrie, Eravant, Torrance, Calif.

Andrew Laundrie, Eravant, Torrance, Calif.

Andrew Nuttall, Skylo Technologies, Mountain View, Calif.

Andrew Solutions

Andrew Solutions Inc.

Andrew Ware

Andrew®

Andrew®

Andrey V. Grebennikov

Andria Elliott, Corporate Content Manager at National Instruments

Andrzej Sawicki, Ericsson AB

Andy Botka, Agilent Technologies Inc.

Andy Singer

Andy Singer, Radio Waves Inc.

Aniket Roy, Stratview Research, Detroit, Mich.

Anil Kollipara, Spirent Communications

Anite plc

Anite, part of Keysight Technologies

Anoison

Anoison

Anokiwave

Anokiwave (now Qorvo)

Anokiwave Inc., San Diego, Calif.

Anouk Hubrechsen and Teun van den Biggelaar, ANTENNEX B.V., Eindhoven, The Netherlands

Anritsu Co.

Anritsu Co., Morgan Hill, CA

Anritsu Co., Morgan Hill, Calif.

Anritsu Company

Anritsu Corp. and SATIMO

Anritsu Corp., Morgan Hill, Calif.

Anritsu Corp./Emite

Anritsu Corporation

Anritsu White Paper

Anritsu Wiltron Co.

Anritsu, Morgan Hill, Calif.

Anritsu, Morgan Hill, Calif.

Anritsu/Verios

Ansoft

Ansoft Corp.

Ansoft Corp., Pittsburgh, PA

Ansoft Corporation

Ansoft, Pittsburgh, PA

ANSYS

ANSYS Inc.

ANSYS Inc., Pittsburgh, Pa.

ANSYS, Canonsburg, Pa.

Ansys, Inc., Canonsburg, Pa.

Antenova

Antenova Ltd.

Anthony Beasley and Walter Brisken, National Radio Astronomy Observatory, Charlottesville, Va.

Anthony Collins, Harpinder Matharu and Ehab Mohsen, Xilinx Inc., San Jose, Calif.

Anthony Sweeney, Endwave Corp., San Jose, CA

Antoine Bonnabel and Cédric Malaquin, Yole Développement (Yole), Lyon, France

Antoine Rabany

Antonio Ciccomancini Scogna, CST of America, Framingham, MA; Jianmin Zhang, CISCO Systems, San Jose, CA

Antonio Mendes and Augusto Moita de Deus, CeFEMA, Instituto Superior Técnico, Universidade de Lisboa, Lisboa, Portugal

Antti Manninen, VTT, Finland

Anurag Bhargava, ISRO

APA Wireless

Aparna M.A, Kings Research, Dubai, UAE

APEI

API Technologies

API Technologies Corp.

API Technologies, Weinschel, Frederick, Md.

APLAC Solutions Corp.

APLAC Solutions Inc.

APLAC Solutions Oy

Application Brief, California Eastern Labs (CEL)

Application Note

Application Note, Anatech Electronics

Application Note, Anritsu

Application Note, Focus Microwave

Application note, Micro-Coax

Applied Engineering Products (AEP)

Applied Radar Inc.

Applied Research Associates Inc.

Applied Wave Research

Applied Wave Research (AWR)

Applied Wave Research Inc.

Applied Wave Research Inc. (AWR)

AR

AR Electronic Conversion Poster

AR Europe

AR Modular

AR Modular RF

AR RF/Microwave Instrumentation

AR RF/Microwave Instrumentation

AR RF/Microwave Instrumentation

AR RF/Microwave Instrumentation

AR RF/Microwave Instrumentation

AR RF/Microwave Instrumentation

AR RF/Microwave Instrumentation, Application Note

AR RF/Microwave Instrumentation, Souderton, PA

AR Worldwide

AR Worldwide – Modular RF, Bothell, WA

AR Worldwide Modular RF

AR Worldwide RF/Microwave Instrumentation

Arbe Robotics, Tel Aviv-Yafo, Israel

ARC International

ARC Technologies

Archie W. Straiton & Charles W. Tolbert

Ardent Concepts Inc., Hampton, N.H.

Arkivator Telecom

Arlon

Arlon Inc.

Arlon, Materials for Electronics Division

ARMMS

ARMMS RF & Microwave Society

ARMMS RF and Microwave Society

Arne Jacob, General Chairman of EuMW 2017; Ivar Bazzy, President, Horizon House Publications

Arralis

Arralis Technologies, Swindon, U.K.

Arrow Electronics, Inc.

Arrow RF & Power

Arrowhead Global Solutions

Art Aguayo, Rogers Corp., Chandler, Ariz.

Art Schaldenbrand, Cadence Design Systems, San Jose, Calif.

ART-Fi

Artech House Inc.

Artem Saakian

Arthur Pini, Independent Consultant; Greg Tate and Oliver Rovini, Spectrum GmbH, Grosshansdorf, Germany

Arvind Kumar, Vellore Institute of Technology, Vellore, India

ASC Signal Corp.

ASDReports

Aselsan

Ashish Chaudhari and David Squires, National Instruments, Austin, Texas

Ashkan Mashhour

Ashkan Mashhour and Assaad Borjak

Ashkan Mashhour, William Domino, Norman Beamish

Ashraf Sheri and Arnold S. de Beer

Ashraf Sheria and Arnold S. de Beerb

Ashutosh Kedar, Defence Research & Development Organization, Bangalore, India

Ashutosh Kedar, Electronics & Radar Development Establishment (LRDE), Bangalore, India

Ashwin Prasad, National Instruments

ASIC North Inc.

Asif Anwar, Director at Strategy Analytics

Asif Anwar, Director, Strategy Analytics

Asif Anwar, Program Director, Strategy Analytics

Asif Anwar, Strategy Analytics, London, UK

Asif Anwar, Strategy Analytics, Newton, Mass.

Asif Anwar, TechInsights, Milton Keynes, England

Aspen Electronics

Assaad Borjak and Taoufik Bourdi

Astrium

Astrium Services/Thales Alenia Space

Astrodyne Corp.

Astrodyne TDI

Astrolab

Astronics Test Systems Inc.

AT&T Inc.

AT4 wireless

ATE Systems

Atlanta Micro, Inc.

AtlanTecRF, Braintree, Essex, UK

AtlanTecRF, Braintree, U.K.

Atlantic Microwave Ltd.

Atmel® Corp.

ATW Companies

Augusto Panella

Auriga Measurement Systems LLC, Lowell, MA

Auriga Microwave

Auriga Microwave

Aurora Andújar, José L. Leiva, Fractus Antennas

Autoliv, Inc.

Autotalks

AUVSI

Avago

Avago Technologies

Avago Technologies Inc.; San Jose, CA

Avago Technologies, San Jose, CA

Avanti Communications Group

Averna

Avi Brillant

Aviat Networks

Aviat Networks Inc.

Aviel Electronics

Avik Santra, Ismail Nasr and Julie Kim, Infineon Technologies

Avishtech, LLC San Jose, Calif.

Aviv Ronai CMO, Ceragon Networks, Ltd.

Aviv Ronai, Chief Marketing Officer, Ceragon Networks

Aviv Ronai, CMO, Ceragon Networks Ltd.

Aviv Ronai, Ron Nadiv and Tsachi Rosenhouse

Avtar S. Virdee and Bal S. Virdee

Avu Brilliant and David Pezo

AVX Corp., Fountain Inn, S.C.

AWR

AWR and Anritsu Co.

AWR and Rohde & Schwarz

AWR Corp.

AWR Corp., El Segundo, CA

AWR Corp.and Antenna Magus

AWR Group, NI, El Segundo, Calif.

AWR, A National Instruments Company

AWR® Corp.

AWR® Corp. and LFoundry GmbH

AWT Global

Axell Wireless

AXIe Consortium

Aymen Ghorbel, Ezgi Dogmus and Poshun Chiu, Yole Intelligence, Lyon, France

Azimuth Systems, Acton, Mass.

B

B. Buchin and R. Leschhorn, Rohde & Schwarz GmbH

B. Come, R. Ness, S. Donnay, L. Van der Perre, W. Eberle, P. Wambacq, M. Engels, I. Bolsens

B. Debaillie, B. Come, W. Eberle, S. Donnay and H. Minami

B. Eged, R. Fiengo, F. Persia and S. Thompson, National Instruments, Austin, TX

B. Gellar, B. Thaler, A. Fathy M.J. Liberatore, H.D. Chen, G. Ayers, V. Pendrick and Y. Narayan

B. Guillaume, J. Mabire, P. Maurin, D. Reffet, F. Chirol and E.K. Polzer

B. Kaltalioglu, H. Takahashi, A. B. Alothman Alterkawi and C. Vockenberger, AT&S, Leoben, Austria

B. Kapilevich

B.D. Shank, J.A. Heilman and A.J. Dahm

B.S. Virdee

BAE Systems Microelectronics Center, Nashua, N.H.

Baidu

Baker IDI

Baljit Chandhoke, Microchip Technology, Chandler, Ariz.

Ball Aerospace

Ball Aerospace & Technologies Corp.

Bantam Instruments

Bao Lu, Xi Gong, Jin Ling and Hong Wei Yuan, Xidian University, Xi’an, China

Bar-Giora Goldberg

Barney Arntz

Barry Alcorn, Agilent Technologies, Inc.

Barry Industries Inc.

Barry Trimmer, Thales Defence Mission Systems Business, Redhill, UK

Basel F. Azzam

BC Systems

Beceem Communications

Beecham Research

Ben Pawling, Harris CapRock and Keith Olds, Harris Government Communications

Ben Thomas and Jackie Johnson; RFMD, Greensboro, NC

Ben Thomas, Qorvo

Benchmark

Ryan Benech

Bengt Svensson, Goran Snygg and Per Holmberg

Benjamin Annino, Analog Devices, Wilmington, Mass.

Benjamin Annino, Analog Devices, Wilmington, Mass.

Benjamin Dannan, Diversey, Inc.

Benjamin Fernald and Greg Gonzales, NI, Austin, Tex.

Benjamin McMahon, BAE Systems, Nashua, N.H.

Benjamin Walter and Fuanki Bavedila, V-Micro SAS, Villeneuve d’Ascq, France

Benoit Derat, Bastian Balk and Jose M. Fortes, Rohde & Schwarz, Munich, Germany

Benoît Derat, Corbett Rowell, Adam Tankielun and Sebastian Schmitz, Rohde & Schwarz, Munich, Germany

Benoit Derat, Mert Celik and Sebastian Schmitz, Rohde & Schwarz, Munich, Germany

Benqing Guo, Shiquan An, No.38 Research Institute of CETC; Guoning Yang, Qualcomm Atheros Co. Ltd.

Benson D. Evans, PhD

Benson D. Evans, PhD, Managing Director, www.rfjobstoday.com

BeRex, Inc.

Berkeley Nucleonics Corp., San Rafael, Calif.

Berkeley Nucleonics Corporation, San Rafael, Calif.

Berkeley Nucleonics Corporation, San Rafael, Calif.

Berkeley Varitronics Systems Inc.

Bernard Prkic’, DragonWave, Ottawa, Canada

Bernd Heinemann and Alexander Fox, IHP, Frankfurt, Germany

Bertalan Eged, Raffaele Fiengo and David A. Hall, National Instruments, Austin, Texas

Bertan Bakkaloglu, RFIC 2015 General Chair; Albert Wang, Technical Program Chair; Kevin Kobayashi, Technical Program Co-Chair

Bertram Arbesser-Rastburg, General Chairman, EuMW 2012; Ivar Bazzy, President, Horizon House Publications

Bertrand Parvais and Hao Yu, imec, Leuven, Belgium

BeSpoon

BethelTronix Inc. (BTI)

BFi OPTiLAS

Bhawani Shankar

Bilal Habib, Muhammad Shoaib Arif and Mujahid Mohsin, National University of Sciences and Technology, Islamabad, Pakistan

Bill

Bill Anklam, Victor Grothen and Doug Olney, Agilent Technologies, Santa Clara, CA

Bill Goumas and Peter Forth, Ampleon, Nijmegen, The Netherlands and Smithfield, R.I.

Bill Jennewein

Bill Linstrom, Jackson Barnard and Jane Rogan, VIDA Products, Rohnert Park, Calif.

Bill Linstrom, Ron Parrott and Allen Sweet, VIDA Products, Rohnert Park, Calif.

Bill McKenney, Analog Devices, Wilmington, Mass.

Bill Oldfield

Bill Pribble and Yueying Liu, Wolfspeed, Durham, N.C.

Bill Reid, National Instruments, Austin, TX

Bill Rosas, Signal Microwave USA, Tempe, Ariz.

Bill Rosas, Southwest Microwave

Bill Rosas, Southwest Microwave Inc.

Bin Song, Songbai He, Jun Peng, Wenman Zou, University of Electronic Science and Technology of China, Chengdu

Bin Yu, Kang Yang and Guangli Yang, Shanghai University, Shanghai, China

Bing Li and Jing-Song Hong, University of Electronic Science and Technology of China, Chengdu, China

Binqi Yang, Zhiqiang Yu, Jianyi Zhou and Yunyang Dong, State Key Laboratory of Millimeter Waves, Southeast University, Nanjing, China

Bird Technologies

BJG Electronics Inc.

BL Microwave

Marleah Blades

Blighter Surveillance Systems

Bliley Technologies

Bliley Technologies Inc., Erie, Pa.

Blu Wireless Technology

Blue Cell Technology

Bluetest

Bo Marr and Bill Dower, Epirus, Hawthorne, Calif.

Bob Buxton, Boonton Electronics, Parsippany, N.J.

Bob Buxton, Boonton Electronics, Parsippany, N.J.

Bob Koupal, Marshall Wang and Cory Edelman

Bob McLaughlin and Kipp Schoen, Picosecond Pulse Labs (PSPL)

Bob Muro, Pentek Inc.

Bob Stern, Keysight Technologies Inc., formerly Agilent Technologies electronic measurement business, Santa Rosa, Calif.

Bob Thiele and Stan Hardin, Dynawave Cable Inc., Haverhill, MA

Bob VanBuskirk

Boeing

Boeing Defence Australia

Bogdan Sadowski, Harris Stratex Networks Inc.

Bonding Source

Bonding Source

Boonton

Boonton, Parsippany, N.J.

Boram Lee and Sungtek Kahng, University of Incheon

Boris Aleiner, boris_aleiner@hotmail.com, Nijmegen, The Netherlands

Boris Aleiner, Motorola

Boris Aleiner, Nijmegen, The Netherlands

Boris Aleiner, Petra Solar, South Plainfield, NJ

Boris Sheyer

Boston Micro Foundation

Brad Cole and Roy Zohrabian, ATE Systems, N. Billerica, Mass.

Brad Frieden, Keysight Technologies Inc., Santa Rosa, Calif.

Bradley K. Benton

Brandon Malatest, Per Vices, Toronto, Canada

Brendon McHugh

Brendon McHugh, Per Vices, Toronto, Canada

Brent Campbell, Marketing Communications Specialist

Brent Dietz, Brent's Musings

Brent Dietz, Brent's Musings

Brett Chermansky, JFW Industries Inc., Indianapolis, IN

Brian Avenell, National Instruments Corp., Austin, TX

Brian Battaglia

Brian Battaglia, Dave Rice, Phuong Le and Mike Purchine, HVVi Semiconductor

Brian Cheng

Brian Coaker and Tony Challis, e2v

Brian Coaker, e2v Technologies Ltd., Chelmsford, Essex, UK

Brian D. Battaglia, Integra Technologies, El Segundo, CA

Brian D. Battaglia, Jeff Burger and John Titizian

Brian Drozd and William T. Joines, Duke University

Brian Floyd, Osama Shana’a and Donald Y.C. Lie, RFIC2021 General Chairs

Brian Heater, TechCrunch

Brian S. Collins

Brian Walker, Copper Mountain Technologies, Indianapolis, Ind.

Brian Walker, Copper Mountain Technologies, Indianapolis, Ind.

BridgeWave Communications

Broadband Antenna Tracking Systems and DragonWave Inc.

Broadband Wireless

Broadcom

Brock J. LaMeres and T.S. Kalkur

Bror Peterson and David Schnaufer, Qorvo, Greensboro, N.C.

Bror Peterson, Qorvo, Greensboro, NC

Bruce A. Kopp, Elizabeth A. Ouellette and Amy J. Billups

Bruce Hemp and Peter Stroet, Linear Technology Corp., Milpitas, Calif.

Bruce Marks, Mini-Circuits

Bruce P. Mahler

Bruno Pattan, Federal Communications Commission

Brush Ceramic Products Inc.

Brush Engineered Materials Inc.

Bryan Goldstein, General Manager Aerospace and Defense, Analog Devices

Bryan Walker, JFW Industries, Inc., Indianapolis, Ind.

BSC Filters Ltd., York, England

BTI Systems and DragonWave

Bud Noren, Agile Materials & Technologies

Burak Tasci, Vocational School of Technical Sciences, Firat University, Elazig,Turkey

Burak Taşcı, Vocational School of Technical Sciences Firat University, Elazig,Turkiye

Business Wire

BUSINESSWIRE

by Brendan P. Rivers, Attleboro, MA

By David Strand, Strand Marketing Inc.

by Doug Allen, Telecommunications® Online

by Ek Heng, Asia-Pacific Correspondent, Telecommunications® Online

By Jack Daniels, EastBridge Partners LLC, Brookline, MA

By Jun Lee, Skyworks Solutions, Inc.

by Kendrick Struthers-Watson, Telecommunications® Online

By Melissa Drozdowski, Social Media Evangelist, Interprose Public Relations

By Raghu Das, CEO, IDTechEx

Byung-Jun Jang

Byung-Jun Jang, In-Bok Yom and Moon-Que Lee

Byung-Jun Jang, In-Bok Yom and Seong-Pal Lee

C

C-MAC MicroTechnology

C. Fulton, R. Palmer, M. Yeary, J. Salazar and H. Sigmarsson, University of Oklahoma, Advanced Radar Research Center, Norman, Okla.

C. Oakley, Michigan State University, East Lansing, Mich.

C. Quemada, H. Solar and G. Bistué, Centro de Estudios e Investigaciones Técnicas de Gipuzkoa San Sebastián, Spain <br>J. de No and I. Sancho,Escuela

C. Tsironis and N. Misljenovic, Focus Microwaves

C.B. Dietrich, Jr., R.M. Barts, W.L. Stutzman, W.A. Davis

C.L. Wei, B.F. Jia, Z.J. Zhu and M.C. Tang, University of Electronic Science and Technology of China, Chengdu, China

C.S. Whelan, P.F. Marsh, W.E. Hoke, S.M. Lardizabal, R. Leoni III, K.C. Hwang and T.E. Kazior

C.Y. Su, S.J. Chang, L.P. Chen, Y.P. Ho, G.W. Huang, D.C. Lin, B.M. Tseng, H.Y. Lee, J.F. Kuan, Y.M. Deng, K.A. Wen, C.Y. Chang

CableLabs

Cadence

Cadence

Cadence

Cadence | AWR

Cadence Design Systems

Cadence Design Systems Inc., San Jose, Calif.

Cadence Design Systems, Inc., San Jose, Calif.

Cadence, El Segundo, Calif.

Cadence, San Jose, Calif.

CAES

Caixia Chen, Manh Anh Do, Kiat Seng Yeo, Chirn Chye Boon and Wei Meng Lim, Nanyang Technological University

Calex Mfg. Co. Inc.

California Eastern Laboratories

California Eastern Laboratories

Cambium Networks

Cambium Networks

Cambridge Broadband Networks

Cambridge Broadband Networks Ltd.

Cambridge Consultants

Cambridge Instruments

Cambridge Pixel

Cameron Foley-Molivinsky, Times Microwave Systems, Mesa, Ariz.

Cameron Sheth

Camille Cox, President, OnRamp Communications

Camstar Systems Inc.

Canalys

CAP Wireless

CAP Wireless Inc. Newbury Park, CA

CAP Wireless Inc., Newbury Park, CA

Capella Intelligent Subsystems Inc.

CapRock Government Solutions

Carbonics Inc.

Carissa Sipp, Texas Instruments, Dallas, Texas

Carl De Ranter and Khaled Khalaf, Pharrowtech

Carl Falcon, AMI Semiconductor

Carl L. Everett, Bell Helicopter Textron Inc.

Carl Sheffres, Horizon House Publications, Inc.

Carl Sheffres, Horizon House Publications, Inc.

Carl Sheffres, Microwave Journal Publisher

Carl Sheffres, Publisher

Carl Sheffres, Publisher, <i>Microwave Journal</i>

Carl Sheffres, Publisher, Microwave Journal

Carl Sheffres, Publisher, Microwave Journal

Carlisle Companies Inc.

Carlisle Interconnect Technologies, St. Augustine, Fla.

Carlisle Interconnect Technologies/ECS

Carlo Bencivenni, Abolfazl Haddadi, Abbas Vosoogh and Marcus Hasselblad Gapwaves AB, Göteborg, Sweden

Carlo Bencivenni, Thomas Emanuelsson and Magnus Gustafsson, Gapwaves AB, Gothenburg, Sweden

Carlo Kopp, Monash University

Carlos Calvo and Matthew Pilotte Analog Devices Inc. Norwood, MA

Carlos Fuentes

Carlos Fuentes, Gigatronics Incorporated

Carlson Wireless

Carlson Wireless Technologies

Carmel Instruments LLC, Campbell, Calif.

Carmine De Martino and Marco Spirito, Technische Universiteit Delft, The Netherlands

Carnegie Institution for Science

Carol L. Kory

Carousel Industries

CASAGRAS project

Cascade

Cascade Microtech

Cascade Microtech Inc.

CASSIDIAN

Cassidian/Frequentis Nachrichtentechnik GmbH

Jessy Cavazos

Cavendish Kinetics

CEA-Leti

Cecil Deisch, Tellabs Operations

Cecil W. Deisch, Tellabs

Cédric Malaquin and Antoine Bonnabel, Yole Développement

Cees Links, Qorvo, Greensboro, N.C.

CEITEC

CEL

Celcite

Celiant Corp.

Cellphone-Mate

CEMWorks, Winnipeg, Canada

CENOS, Riga, Latvia

Centellax

Centerline Technologies LLC

Ceragon

Ceragon Networks

Ceragon Networks Ltd

Ceragon Networks Ltd.

Cernex Inc.

CernexWave, San Jose, Calif.

CETECOM

CEYEAR

Ceyear, U.S. Distributors: TopDogTest and Custom-Cal Globaltech

Chalmers

Chalmers University of Technology

Champion Technologies Inc.

Chandra Hackenbruch, Analog Devices

Changhua Wan, Senior Member, IEEE and Jian-X. Zheng, Member, IEEE

Changhyeong Lee, Heejun Park and Sungtek Kahng, Incheon National University, Incheon, South Korea

Channel Microwave

Channel Microwave Corp.

Nicolas Chantier

Charles Baylis University of South Florida Tampa, FL; Lawrence Dunleavy University of South Florida and Modelithics Inc.Tampa, FL; William Clausen Mod

Charles Baylis, Lawrence Dunleavy and William Clausen

Charles Blackwood

Charles D. McCarrick

Charles Dietlein, Spectragem LLC, Bethesda, Md.

Charles Greene, Powercast Corporation, Pittsburgh, Pa.

Charles H. Cox III and Edward I. Ackerman, Photonic Systems Inc., Billerica, Mass.

Charles J. Trantanella and Paul Blount, Custom MMIC, Westford, Mass.

Charles R. Buffer and Per O. Risman

Charles Schroeder, NI, Austin, Texas

Charles Trantanella and Michael Megan, Custom MMIC, Chelmsford, Mass.

Charles Trantanella and Michael Megan, Custom MMIC, Chelmsford, Mass.

Charles Trantanella, Retired from Custom MMIC, Westford, Mass.

Charles Tumbaga, Anritsu Co.

Charles Tumbaga, Anritsu, Morgan Hill, Calif.

Charles Tumbaga, Anritsu, Morgan Hill, Calif.

Charles Walker, Conference Chair

Charles Wright, Chief Scientist, Azimuth Systems

Charlie Jackson

Chelton Microwave Corp.

Chemring Group/Roke Manor Research

Chemring Technology Solutions

Chen Zhu, Jianyi Zhou and Yanwei Wang

Zhiqun Cheng

Cheng-Chi Yen and Huey-Ru Chuang

Cheng-Chi Yen, Huey-Ru Chuang

Cheng-Ying Hsu, Chu-Yu Chen and Chuang Hao Huang, Shu-Te University

Cheng-yuan Liu, Ying-song Li, Tao Jang (also affiliated with Harbin Institute of Technology) and Xiao-dong Yang, Harbin Engineering University, Harbi

Chengdu D Fine Technology Co. Ltd.

Chengjie Su, ZongXi Tang, Biao Zhang and YunQiu Wu, University of Electronic Science and Technology of China, Chengdu

Cheuk-fai Chow, Department of Science and Environmental Studies, The Education University of Hong Kong, Hong Kong

Chi-Chang Lin, Yu-Jui Chang and Huey-Ru Chuang, National Cheng Kung University

Chia Song Wu, Hsien-Chin Chiu, Yi-Feng Lin

Chia-Shih Cheng, Hsien-Chin Chiu, Shao-Wei Lin and Jeffrey S. Fu Chang Gung UniversityTao-Yuan, Taiwan, ROC

Chia-Song Wu and Hsing-Chung Liu, Vanung University, Taiwan, ROC; Hsien-Chin Chiu and Yi-Feng Lin, Chang Gung University, Taiwan, ROC

Chia-Song Wu and Hsing-Chung Liu, Vanung University; Hsien-Chin Chiu and Wei-Hsien Lee, Chang Gung University

Chia-Song Wu, Vanung University; Hsien-Chin Chiu, Chang Gung University

Chien-Cheng Wei, Chin-Ta Fan, Ta-Hsiang Chiang, Ming-Kuen Chiu and Shao-Pin Ru Tong Hsing Electronic Industries Ltd.Taipei Hsien, Taiwan

Chien-Cheng Wei, Chin-Ta Fan, Ta-Hsiang Chiang, Ming-Kuen Chiu and Shao-Pin Ru, Tong Hsing Electronic Industries Ltd.Taipei Hsien, Taiwan

Chien-Cheng Wei, Hsien-Chin Chiu and Wu-Shiung Feng, Chang Gung University

Chin-Chun Meng and Tzung-Han Wu, National Chiao Tung University

Chin-Leong Lim, Avago Technologies, Penang, Malaysia

China Mobile

China Mobile Research Institute and SkyCross

Ruofan DaiI,II,III, Yunlong ZhengI,II, Shichang ZouI,III, Weiran KongIII, Chinese Academy of SciencesI, University of Chinese Academy of SciencesII, Shanghai Huahong Grace Semiconductor Manufacturing III

Chipcon AS

Choice Communications

Shiwei Zhao, Chongqing University of Posts and Telecommunications, Chongqing, China University of Electronic Science and Technology of China, Chengdu, China

Chow-Yen-Desmond Sim, Feng Chia University, Taichung, Taiwan

Chris Aden

Chris Brinton, Matthew Wharton and Allen Katz, The College of New Jersey

Chris DeMartino, Hugo Morales and Larry Dunleavy, Modelithics Inc., Tampa, Fla.

Chris DeMartino, Modelithics Inc., Tampa, Fla.

Chris G. Morton and Chris M. Snowden

Chris Hults, Jim Stack, and M. Jeffrey Barney

Chris Loberg, Tektronix, Beaverton, OR

Chris Marshall and Bill Murphy, Richardson Electronics Ltd., LaFox, IL

Chris O'Connor

Chris Petrole

Chris Rehorn, Agilent Technologies Inc.

Chris Snow, Telecom Engine

Chris Thompson, Mercury Systems, Andover, Mass.

Chris Tojeira, Pentek Inc., Upper Saddle River, N.J.

Chris W. Liu, Morten Damgaard, Broadcom Corporation

Chris Walker, European Antennas Ltd.

Christer Stoij, Sivers IMA AB, Kista, Sweden

Christian Bachmann and Minyoung Song, imec, Leuven, Belgium

Christian Bachmann, Amirashkan Farsaei and Chris Marshall, imec, Leuven, Belgium

Christian Bean, Patrick Roblin, Vakur Ertuk and Roberto Rojas

Christian Rye Iversen

Christina Geßner; Rohde & Schwarz, Munich, Germany

Christoph Hausl, Julian Emmert, Manuel Mielke, Benjamin Mehlhorn and Corbett Rowell, Rohde & Schwarz, Munich, Germany

Christophe Didier, Eric Butaud and Sylvain Ballandras, Soitec, France

Christopher Marki

Christopher Penney and Yong Wang, Remcom Inc.

Christopher Penny, REMCOM Inc.

Christopher Snowden General Chairman, EuMW 2006; Charles A. Ayotte Horizon House Publications Inc.

Christopher T. Rodenbeck and Kai Chang, Texas A&M University; John Aubin, ORBIT/FR Inc.

Christopher T. Rodenbeck and Richard T. Knudson, Sandia National Laboratories, Albuquerque, NM

Christopher Tutt, Carlisle Interconnect Technologies

Christos Tsironis, Apostolos Samelis and Klaus Buehring

Chu-Yu Chen and Cheng-Ying Hsu

Chu-Yu Chen and Li-Mei Tu

Chu-Yu Chen, Li-Mei Tu

Chuck Swift and Les Besser

Chuck Swift with Bob Eisenhart

Chuck Wheatley

Chun-Ping Ge and Yong-Qin Liu, Weinan Normal University, Weinan, China

Chung-I G. Hsu Da-Yeh University Changhua, Taiwan, ROC, Ching-Her Lee and He-Kai Jhuang National Changhua University of Education Changhua, Taiwan, RO

Chunlan Qin, Keysight Technologies, Santa Rosa, Calif.

Chunlei Wang, Christopher T. Rodenbeck and Kai Chang, Matthew R. Coutant

Chunming Liu, Heng Xioa, Fu Li, Qiang Wu

Ciao Wireless

Ciena

Cinch Connectivity Solutions, Waseca, Minn.

Cirexx International Inc.

CirQon Technologies Corp.

Claes Beckman and Ulrik Wahlberg

Clara E. Centeno-Calero, SV Microwave Inc.

Claude M. Weil and Roger B. Marks

ClearCount Medical Solutions

Cliff Rowland, Virginia Diodes, Charlottesville, Va.

Clifford Fung, MEMS Industry Group

CMC Wireless Components

CML Microcircuits

CNBC

Coaxial Components Corp./Coaxicom

Cobham

Cobham Advanced Electronic Solutions

Cobham Antenna Systems

Cobham Antenna Systems (Microwave Antennas)

Cobham Antenna Systems, Microwave Antennas

Cobham Antennas

Cobham AvComm

Cobham plc

Cobham SATCOM

Cobham Sensor Systems

Cobham Tactical Communications and Surveillance

Cobham Technical Services

Cobham Wireless

Julien Cochard

Codan Ltd.

Cohda Wireless

Coherent Solutions Ltd.

Cohort

Coilcraft

Coilcraft CPS

Colby Hobart Fortify, Boston, Mass.

Colby Hobart, Fortify

Colin Warwick, Signal Integrity Product Manager, Agilent EEsof EDA

Colonial Assembly and Design LLC

Colonial Assembly and Design LLC

COM DEV International Ltd

COM DEV Ltd.

COM DEV USA LLC

Comchip Technology Corp.

CommAgility, A Wireless Telecom Group Company, Loughborough, U.K.

CommAgility, Loughborough, U.K.

CommQuest

CommScope

CommScope

CommScope Inc.

Communication Power Corp. (CPC), Hauppauge, N.Y.

Communication Solutions Inc.

Communications & Power Industries

Communications & Power Industries

Communications & Power Industries (CPI) LLC, Palo Alto, Calif.

Communications & Power Industries Canada Inc. (CPI Canada)

Communications & Power Industries Canada Inc. (CPI)

Communications & Power Industries Inc.

Communications & Power Industries LLC

Communications & Power Industries LLC, Beverly Microwave Division

Company ABC

Compass Technology Group, Alpharetta, Ga.

Compiled by Richard Mumford, Microwave Journal International Editor

Component Distributors Inc.

COMPRION

Computer Simulation Technology

Computer Simulation Technology (CST), Darmstadt, Germany

Computer Simulation Technology AG

COMSAT RSI, Anghel Laboratories

Comsearch

COMSOL

COMSOL Inc., Burlington, Mass.

COMSOL, Inc., Burlington, Mass.

Comtech PST, Melville, N.Y.

Comtech Systems, Inc.

Comtech Telecommunications

Comtech Telecommunications Corp

Comtech Telecommunications Corp.

Comtech Xicom Technology

ConcealFab

Conduct RF

ConductRF

ConductRF, Methuen, Mass.

Cong Wang, Won-Sang Lee and Nam-Young Kim Kwangwoon University, Seoul, Korea, NanoENS Co. Ltd., Gyeonggi, Korea

Connects with HUBER+SUHNER; Radiall; and Rosenberger

Constant Wave, Colorado Springs, CO

Contributions by Altair, ANSYS, Cadence/AWR, Keysight and MathWorks

Contributions from: Akoustis Technologies, OnScale, Resonant

Copper Mountain Technologies

Copper Mountain Technologies, Indianapolis, In.

Copper Mountain Technologies, Indianapolis, Md.

Cor Schepens and Roberto Gaddi, Cavendish Kinetics

Corbett Rowell, Benoit Derat and Adrián Cardalda García, Rohde & Schwarz, Munich, Germany

Corbett Rowell, Rohde & Schwarz, Munich, Germany

Cornelius Mayaka, Yonghui Shu and Dhanraj Doshi, Eravant, Inc., Torrance, Calif.

Cornell Dubilier

Corning Gilbert

Ulrich Rohde1,2, Ajay Poddar1,2 and D. Sundararajan3, Brandenburgische Technische Universitat1, Cottbus, Germany; Synergy Microwave Corp.2, Paterson, NJ; SJCET3, Palghar, India

Coupling Wave Solutions S.A.

CPI Aerostructures Inc.

CPI Beverly Microwave Division

CPI Electron Device Business

CPI International Inc.

Craig Blanchette and Rich Rochford, BAE Systems, Nashua, N.H.

Craig Hendricks, Anritsu Company, Morgan Hill, Calif.

Craig Moore and Bruce Kopp

Craig Sapashe, Gary Breed, Jim Culver, Mike Hallman and Larry Dunleavy, WAMICON Steering Committee

Craig Wall, Agilent Technologies Inc., Santa Clara, CA

Crane

Crane Aerospace & Electronics

Crane Aerospace & Electronics Microwave Solutions

Crane Aerospace & Electronics Power Solutions

Crane Aerospace & Electronics, Microwave Systems, Beverly, MA

Crane Aerospace and Electronics Group

Crane Aerospace and Electronics, West Caldwell, N.J.

Crane Co.

Cranfield University Knowledge Transfer Partnership

Credowan Ltd., Chichester, UK

Cree

Cree Inc.

Cree Inc., Research Triangle Park, NC

Cree Research

Cree RF

Creowave

CRFS

CRFS

Cross Border Technologies

Crystal RFI Solutions LLC

Crystek

Crystek Corp.

Crystek Crystals

Crystek Microwave

CSR

CSR and SiRF

CST - Computer Simulation Technology

CST GmbH

CST of America

CST of America Inc.

CST of America, Framingham, MA

CST of America, Wellesley Hills, MA

CTIA - The Wireless Association

CTS

CTS Corp. and Valpey Fisher Corp.

CTS Corp., Elkhart, Ind.

CTS Electronic Components, Inc., Hopkinton, MA

CTT Inc.

Cubic Corporation

Cui Yuxing, Fu Xingchang, Mo Jianghui, Hu Zhifu and He Dawei, Hebei Semiconductor Research Institute

Cuming Microwave Corp.

Curtis Industries

Cushcraft Corp.

Custom Interconnects, LLC

Custom Microwave Components Inc., Fremont, Calif.

Custom MMIC

Custom MMIC, Chelmsford, Mass.

Custom MMIC, Chelmsford, Mass.

Cypress Semiconductor Corp.

Cypress Semiconductor Corp. and Oscium

Cyril Buey and Cédric Malaquin, Yole Intelligence, part of Yole Group, Lyon-Villeurbanne, France

Cyril Luxey, University Nice-Sophia Antipolis and Institut Universitaire de France

Cyril Noger, Anritsu S.A., Villebon-sur-Yvette, France

D

D. Babic, University of Zagreb

D. Djebouri, Space Techniques National Centre;

D. Kaddour, J.D. Arnould and P. Ferrari, ESISAR, Valence, France

D. Packiaraj, M. Ramesh and A.T. Kalghatgi, Bharat Electronics Ltd., Bangalore, India

D.L.S. Electronic Systems Inc.

D.M. Dowthwaite, K.D. Newsome, M.B. Edwards, I.C. Davis and B.M. Coaker, e2v, Chelmsford, UK

D.R. Huang, H.R. Chuang National Cheng Kung University Tainan, Taiwan, ROC, Y.K. Chu Himax Technologies, Tainan, Taiwan and C.L. Lu Kun Shan Universit

D.R. Lang

D3

Daa Sheen Technology Co. Ltd.

Daico Industries Inc., Carson, Calif.

DaisyRS Inc., San Jose, CA

Dale Robinette, Peregrine Semiconductor Inc. San Diego, CA

Dalian Dalicap Technology Co., Ltd.,

Damian Gotch, Filtronic Defence Ltd.

Dan Massé, Associate Technical Editor

Dan Aubertin, Agilent Technologies

Dan Aubertin, Agilent Technologies Inc.

Dan Birch, Fairview Microwave

Dan Birch, Pasternack, Irvine, Calif.

Dan Massé, Associate Technical Editor

Dan Nehring - VP of Engineering, Valpey Fisher Corporation.

Dan Nehring, VP, Engineering, Valpey Fisher Corp.

Dana Cohen Mizrahi, Product Marketing Manager at Sony Semiconductor Israel

Dana Whitlow, Analog Devices

Danaher

Daniel Barnett, Teledyne Storm Microwave, Woodridge, Ill.

Daniel Faria, Lawrence Dunleavy and Terje Svensen

Daniel Gandhi, Christopher Lyons

Daniel I. Amey, Samuel J. Horwitz, Stephen Sekel, Jeff Powell and Brian Durwood

Daniel Kehrer and Deepak Bachu, Infineon Technologies AG, Munich, Germany

Daniel Lam, Advantest, San Jose, Calif.

Daniel M. Dobkin Enigmatics Sunnyvale, CA, Steven M. Weigand WJ Communications Inc. San Jose, CA

DANIEL M. DOBKIN, Enigmatics, Sunnyvale, CA., STEVEN M. WEIGAND, WJ Communications Inc., San Jose, CA

Daniel M. Dobkin, Steven M. Weigand and Nathan Iye

Daniel Schaubert, University of Massachusetts; Jennifer Bernhard, University of Illinois; Robert Mailloux, US Air Force Research Laboratory; W. Devere

Daniel Swanson, DGS Associates LLC

Daniel Swanson, DGS Associates, Boulder, Colo.

Danielle Vanhoenacker-Janvier, EMC 2010 Chair

Danilo Manstretta, RFIC 2024 General Chair, University of Pavia, Pavia, Italy

Danny Polidi and Mike Crist, Raytheon Company, Waltham, Mass.

Daotong Li, Yonghong Zhang, Jing Ai, Kaijun Song and Y. Fan, University of Electronic Science and Technology of China, Chengdu, China

Darby Davis, Gel-Pak, a Division of Delphon, Hayward, Calif.

Darcy Poulin, SiGe Semiconductor

Darcy Poulin, SiGe Semiconductor Inc.

Daren McClearnon, EEsof EDA, Keysight Technologies, Santa Rosa, Calif.

Daren McClearnon, Keysight Technologies, Santa Rosa, Calif.

Daren McClearnon, Keysight Technologies, Santa Rosa, Calif.

Darioush Agahi, William Domino and Nooshin Vakilian

DARPA

DARPA

Darren McCarthy and Steffen Heuel, Rohde & Schwarz, Munich, Germany

Darren McCarthy, Rohde & Schwarz, Beaverton, OR

Darren McCarthy, Tektronix and Wally Arceneaux, Mesuro

Darren McCarthy, Tektronix Inc.

Darren McCarthy, Tektronix Inc., Beaverton, OR

Darren McCarthy, Tektronix, Beaverton, OR

Darren McCarthy, Tektronix, Beverton, OR

Darren Miles and George Bollendorf Empower RF Systems, Inglewood, Calif.

Darren Miles and George Bollendorf, Empower RF Systems, Inglewood, Calif.

Darren Tipton, Rohde & Schwarz, Munich, Germany

Dassault Systèmes

Dassault Systèmes SIMULIA

Data Patterns Group

Datang Telecom Technology

Datum Inc.

Dave Blackham and Ken Wong, Agilent Technologies Inc.

Dave Giles, A-T Solutions; and Sean Thompson, National Instruments

Dave Russell, HXI/Renaissance

Dave Strand, Strand Marketing

Dave Vondran

Dave Whipple, Agilent Technologies

Dave Whipple, Agilent Technologies Inc.

Dave White

David (Da Wei) Vye, Microwave Journal Editor

David A. Hairfield, Phillip D. Harvey, Yvonne L. Krayer and Troy S. Voytko

David A. Hall, Haydn Nelson and Guillaume Pailloncy, National Instruments (NI), Austin, TX

David A. Hall, National Instruments, Austin, Texas

David A. Hall, National Instruments, Austin, TX

David A. Hall, National Instruments, Austin, TX; Janne Roos, AWR – APLAC Division, Espoo, Finland

David A. Hall, National Instruments, Austin, TX; Steve Narciso and Jared Richard, Agilent Technologies Inc., Santa Clara, CA; Edited by David Vye, Mic

Walter Strickler, Anritsu Corp.; Greg Jue, Keysight Technologies; David A. Hall, National Instruments; Reiner Stuhlfauth and Corbett Rowell, Rohde & Schwarz

David Ballo

David Blackham, 85th ARFTG General Chair

David Broadbent, National Instruments, Austin, TX

David Brown, Phonon Corp., Simsbury, Conn.

David Critelli, Times Microwave Systems

David Crook

David Cruickshank, TransTech Inc.

David Cutrer, CEO, Kumu Networks

David Danzilio and Dennis Williams, WIN Semiconductors Corp., Taoyuan City, Taiwan

David Danzillio, WIN Semiconductors, Taoyuan City, Taiwan

David E. Kelly and Kelly Mekechuk

David Farkas, Nxbeam Inc.

David Farr and Bill Henderson, Haigh-Farr, Bedford, NH

David Freeborough, Cambridge Consultants, Cambridge, U.K.

David Halchin and Michael Golio

David Haskin

David Howett, Michael P. Busse, Microwave Products Group; David Rawlinson, BSC

David J. Vondran, OML Inc., Morgan Hill, CA

David Johns and Patrick DeRoy, CST of America, Framingham, MA

David Johns, VP, Electromagnetic Engineering, Flomerics Inc.

David K. Barton

David K. Walker, Dylan F. Williams, Allen Padilla, Uwe Arz, Hartmut Grabinski

David Kiesling, Times Microwave Systems, Wallingford, Conn.

David Lester

David Light, Anthony Faraci and Joe Fjelstad

David M. Jacobson, Andrew J.W. Ogilvy and Alan G. Leatham, Sandvick Osprey Ltd. Neath, UK

David M. Klymyshyn and Surinder Kumar

David Manela and Alan Avidan

David Michael, Abdulkadir Olayinka Abudlbaki, Federal University of Technology, Minna Minna, Nigeria

David Ngo, RFIC 2011 General Chairman

David Owen

David P. Menzer, Auriga Measurement Systems LLC

David Park, Optimal+

David R. Spielman

David R. Vizard, Farran Technology Ltd. Ballincollig, Co. Cork, Ireland

David Robbins and Moeness G. Amin

David Root

David Shively

David Silvius, Director of Strategic Marketing, Richardson RFPD

David Slack, Times Microwave Systems, Wallingford, Conn.

David Slack, Times Microwave Systems, Wallingford, Conn.

David Strand, CEO & Brand Director, Strand Marketing Inc.

David Sumi, Airvine Scientific, Inc. Santa Clara, Calif.

David Vondran

David Vye

David Vye - Editor, Microwave Journal

David Vye and John Dunn, NI AWR Group; Dan Swanson, DGS Associates; Jim Assurian and Ray Hashemi, Reactel Inc.; Philip Jobson, Design Consultant

David Vye and Patrick Hindle, Microwave Journal

David Vye, AWR Group, National Instruments, El Segundo, Calif.

David Vye, Director of Technical Marketing, NI/AWR

David Vye, Editor

David Vye, Editor, Microwave Journal

David Vye, Editor, Microwave Journal; Leonard Pelletier, Freescale Semiconductor; Steven Theeuwen, NXP Semiconductors; Dave Aichele, RFMD; Ray Crampto

David Vye, Microwave Journal

David Vye, Microwave Journal Editor

David Vye, MWJ Editor

David Vye, Richard Mumford and Patrick Hindle, Microwave Journal Editors

David Vye, Sean Kim, Soung Ho Myoung, Jason Yun and Charlie Jeung, Ansoft Corp. Pittsburgh, PA

David Vye, technical editor

David Vye, Technical Editor Microwave Journal

David Vye, Technical Editor, Microwave Journal

David W. Corman, Anokiwave Inc., San Diego, Calif.

David W. Corman, Anokiwave Inc.; Peter Moosbrugger, Ball Aerospace; Gabriel M. Rebeiz, University of California

David W. Porterfield, Jr, Ph.D., Micro Harmonics Corporation

David W. Porterfield, Jr., Micro Harmonics Corp., Fincastle, Va.

Davide Brizzolara, ERTICO - ITS Europe, Belgium

Daying Quan, Huan Jian, Xiaoyu Hou and Xiaoping Jin, China Jiliang University, Hangzhou, China

dB Control Corp., Fremont, Calif.

dB Control Inc.

dBm Corp.

DCM Industries Inc.

Arnold S. de Beerb

Arnold S. de Beerb

Carl De Ranter

Dean Priddy, CFO

Debabani Choudhury, Connected Future Summit Committee Member

Debatosh Guha, University of Calcutta, India; Yahia M.M. Antar, Royal Military College of Canada Kingston, Ontario, Canada; P. Béland and M. Roper, Sp

Debra L. Seifert, Managing Partner, Debra Seifert Communications LLC

Debra Seifert

DecaWave

Delcross Technologies

DelfMEMS

Dell'Oro Group

Delphi Components Inc.

Delta Electronics Manufacturing Corp., Beverly, Mass.

Delta Electronics Mfg. Corp.

Delta Microwave, Oxnard, Calif.

Delta-Sigma Inc., Riverside, Calif.

Denis Barataud and Christian Person, EuMW 2019 General Co-Chairs

Dennis Colin

Dennis Friday

Department of Defense

Derek Campbell, Gopinath Gampala, Martin Vogel and C.J. Reddy, Altair Engineering Inc., Hampton, Virginia

Derek Skousen, MI Technologies; Charlie Orlenius, Bluetest

Derek Smith

DesignArt Networks

DesignCon

DesignCon 2011

Deutsche Telekom and Ericsson

Deutsche Telekom, T-Mobile & Telit Communications

DEV Systemtechnik

Devin Morris, Roos Instruments, Santa Clara, Calif.

DfR Solutions

Dialogic

Dialogic Inc.

Diamond Antenna & Microwave Corp.

Diamond Antenna Europe BVBA

Diamond Liu, Yan Liang and David Shin, SynMatrix Technologies Inc., Richmond, Canada

Diamond Microwave

Diana Gamzina and Richard Kowalczyk, Elve, Inc., Davis, Calif.

Diane Kees, Micro Harmonics, Fincastle, Va.

Didier Belot, José Luis González Jiménez, Eric Mercier, Jean-Baptiste Doré, CEA-Leti, Grenoble, France

Diego Caratelli, Ali Al-Rawi, James Song and David Favreau, The Antenna Company, Eindhoven, Netherlands

Dielectric Communications

Dielectric Laboratories

Dielectric Laboratories Inc.

Dielectric Laboratories Inc. (DLI)

Dielectric Laboratories, Inc., A Knowles Precision Devices Brand, Cazenovia, N.Y.

Dieter Pelz

Dilek Barlas, Gregory Henderson, Xiandong Zhang, Matthias Bopp and Andreas Schuppen

Dima A. Smolyansky and Steven D. Corey

Dima Feldman

Jenn DiMarco

diminuSys

diminuSys, Irvine, CA

Dimov Stojce Ilcev, Durban University of Technology, Durban, South Africa

Dimov Stojce Ilcev, University of Johannesburg, Johannesburg, South Africa

Dimov Stojce Ilcev, University of Johannesburg, Johannesburg, South Africa

Dimov Stojce Ilcev, University of Johannesburg, Johannesburg, South Africa

Dingqing LU, Agilent Technologies, Santa Clara, CA

Dingqing Lu, Keysight Technologies, Santa Rosa, Calif.

Dipti Chheda, Keysight Technologies, Santa Rosa, Calif.

DiTom Microwave, Fresno, Calif.

Divaydeep Sikri and Rajanik Mark Jayasuriya, SatixFy UK Ltd., Farnborough, U.K.

Diversified Technologies Inc.

Diversified Technologies, Inc.

DKN Research

Dominic Clancy and Evert van Veldhuizen

Dominique Schreurs, ARFTG Conference Chair

Dominique Schreurs, Marco Spirito, Mauro Marchetti and Dennis Lewis

Dominique Schreurs, President and 2018 Spring ARFTG Conference Chair;

Don Dingee, STRATISET, Canyon Lake, Texas

Don Dingee, STRATISET, San Antonio, Texas

Don Dingee, STRATISET, San Antonio, Texas

Don Krause, NDK

Don Metzger

Don Metzger, Constant Wave

Donald Y.C. Lie, RFIC 2023 General Chair, Texas Tech University, Lubbock, Texas

Li-Jian Zhang, Seong-Gon Choi, Bireng-Chearl Ahn and Jae-Hoon Bang, Chungbuk National University, Cheongju City, South Korea; Dong-Hyun Kim and Young-Tae Choi, NARO Space Center, Korea Aerospace Research Institute

Mincheol Seo, Inoh Jung, Jeongbae Jeon, Hyungchul Kim, Junghyun Ham, Hwiseob Lee, Cheon-Seok Park and Youngoo Yang, Sungkyunkwan University, Suwon, Korea; Dong-Zo Kim, Ki Young Kim, Samsung Advanced Institute of Technology, Yongin, Korea

Dongke Zhang and Fuqiang Liu, School of Electronics and Information, Tongji University;

Dongze Li, Institute of Microelectronics Chinese Academy of Sciences, Beijing, China University of Chinese Academy of Sciences, Beijing, China

Donn Harvey

Donna Vigneri, NXP RF Group, Tempe, Ariz.

Doodle Labs

Dorine Gurney, Tektronix, Beaverton, Ore.; Fanny Mlinarsky, octoScope, Littleton, Mass.

Dorothy Crenshaw, Crenshaw Communications

Doug Allen

Doug Allen, Telecom Engine

Doug Allen, Telecommunications

Doug Carlson, MACOM

Doug Jorgesen and Christopher Marki, Marki Microwave, Morgan Hill, Calif.

Doug Jorgesen, Marki Microwave, Morgan Hill, Calif.

Doug Reed, Spirent Communications

Dover

Dow

Dow-Key Microwave Corp., Ventura, Calif.

Dow-Key Microwave Corp., Ventura, Calif.

Dr. A. Uhlir, Jr.

Dr. Alfred Grayzel, Gorwara & Associates International, Inc.

Dr. Ali Abuelmaatti RFMD (UK)

Dr. Anil Kumar Singh and Dr. S. Christopher

Dr. Daniel Faircloth, Nullspace, Inc., Irvine, Calif.

Dr. David Johns V.P. Electromagnetic Engineering Flomerics Inc.

Dr. David Root

Dr. Don Goodeve, SixArms/RadioCode Inc., British Columbia, Canada

Dr. Don Metzger, Constant Wave

Dr. Florian Ramian, Rohde & Schwarz

Dr. ing. Marco Lisi, European Space Agency ESTEC, Noordwijk, The Netherlands

Dr. John Howard, Rana Barsbai and Steve Jalil, Electromagnetic Technology Industries, Inc., Boonton, N.J.

Dr. John M. Osepchuk

Dr. Jonthan Wells

Dr. Lin Sun

Dr. Mike Heimlich

Dr. N. Gunavathi, National Institute of Technology, Tamil Nadu, India

Dr. Purna Subedi, 3H Communications Systems Inc., Irvine, Calif.

Dr. Robert Aigner, Director - R&D Acoustic Technologies, TriQuint Semiconductor

Dr. Robert Aigner, Director, R&D Acoustic Technologies, TriQuint Semiconductor

Dr. Steffen Heuel, Rohde & Schwarz, Munich, Germany

Dr. Taro Eichler, Rohde & Schwarz, Munich, Germany

Dr. Ulrich L. Rohde, Universität der Bundeswehr München, Munich, Germany

Drago Kostevc and Joze Mlakar

DragonWave

DragonWave Inc.

Drone Aviation Corporation

Dror Regev, Tower Semiconductor

DRS Signal Solutions, Germantown, Md.

DRS Technologies, Inc., Germantown, Md.

DS Instruments

dSPACE GmbH, Paderborn, Germany

Ducommun Inc.

Ducommun Inc., Carson, Calif.

Dudy Cohen, Ceragon Networks, Tel Aviv, Israel

Duncan Bosworth and Gary Wenger, Analog Devices Inc., Norwood, Mass.

Duncan Bosworth, Analog Devices Inc., Norwood, Mass.

Duncan Pilgrim, Peregrine Semiconductor

Ian Dunn, Mercury Computer Systems

DuPont Circuit & Packaging Materials

DuPont Electronics & Imaging

DuPont Microcircuit Materials

DuPont Polymers and Electronic Materials

Durjoy Roy Rishi Bankim, Chandra College, Naihati, West Bengal, India

DV

Dwayne

Dylan McGrath, Keysight Technologies, Santa Rosa, Calif.

Dylan Stinson, Tektronix, Beaverton, Ore.

DYMAX Corp.

Dynamic Spectrum Alliance

Dynawave Inc.

E

E. Augendre, CEA-LETI and Université Alpes Grenoble, Grenoble, France

E. Chen, D. Heo, J. Laskar, D. Bien

E. Conner

E. Géron and J. Lewiner, Ecole Supérieure de Physique et de Chimie Industrielle

E. Hernández, R. Berenguer, J. Aguilera and J. Ibarguren Centro de Estudios e Investigaciones Técnicas de Gipuzkoa (CEIT);I. Gutierrez, Tecnun, Univer

E. James Crescenzi, Jr. amd Walter A. Strifler

E. Rius, C. Quendo, A. Manchec, Y. Clavet, C. Person and J.F. Favennec LEST-UMR CNRS no. 6165, Brest, France, G. Jarthon, O. Bosch, J.C. Cayrou, P. Mo

E.F. Knott, A.W. Reed and P.S.P. Wei

E.M. DomÌnguez, R.F. Tigrek, M. Ruggiano, G. Lellouch and W. de Heij, Thales Nederland B.V.; D. Bockstal; Agilent Technologies Inc.; P. van Genderen I

e2v

e2v Group

e2v technologies

e2v technologies (UK) Ltd.

e2v/SP Devices

EADS

EADS and Astrium

EADS Defence & Security

EADS Defence & Security/Alcatel-Lucent

EADS North America Test and Services

Eagleware Corp.

Eamon Nash

Eamon Nash, Analog Devices

Earl Lum, EJL Wireless Research LLC, Half Moon Bay, Calif.

Earl Lum, EJL Wireless Research, Salem, N.H.

Earl Lum, EJL Wireless Research, Salem, N.H.

Earl Lum, EJL Wireless Research, Salem, N.H.

Earl Lum, EJL Wireless Research, Salem, N.H.

Earl Lum, EJL Wireless Research, Salem, N.H.

Earl McCune

East Coast Microwave Inc.

Eastern OptX

EB

EB (Elektrobit), Oulu, Finland

EB, Elektrobit Corp.

Echodyne Corp.

EchoStar Mobile Ltd. (EML)

Eclipse MDI, San Jose, Calif.

Economist Intelligence Unit (EIU)

ECT

Ed Liang, MCV Microwave, San Diego, Calif.; T. K. Wu, FSS & Antenna Consulting, Rancho Palos Verdes, Calif.

Ed Petruzzelli, EchoStar, Englewood, Colo.; Peter Lampel, Rohde & Schwarz, Munich, Germany

EDA Consortium

EDI CON

Edited by: Patrick Hindle, Microwave Journal Editor; Contributions from: Rohde & Schwarz, Keysight Technologies and Aaronia AG

Eduardo Nunez van Eyl, Nikolas Athanasopoulos, Daniela Raddino and Rania Morsi, Rohde & Schwarz, Munich, Germany

Edward C. Liang, MCV Microwave, San Diego, Calif.

EDX Wireless

eesy-ic

efabless corporation

Efficient Power Conversion (EPC)

Efield

egc

EiC Corp.

Eid Alsabbagh, Haoyang Yu and Kevin Gallagher, TriQuint Semiconductor

Eiji Mochida, Sumitomo Electric Industries Ltd.

EJL Wireless Research

Ek Heng, Asia-Pacific Correspondent

Elanix Inc.

Elbit Systems Ltd.

Elcom Technologies Inc.

Elcoteq

Electro Plate Circuitry

Electro Rent Corp.

Electro Rent Europe

Electro Technik Industries Inc.

Electro-Metrics

Electromagnetic Technologies Industries, Inc.

Electronic Assembly Manufacturing Inc.

Electronic Assembly Manufacturing Inc.

Yong Fang, Baoqing Zeng, Xiaoyun Zhao and Jun Dong, University of Electronic Science and Technology of China; Hai Zhang, Nanchang Institute of Technology, China

electronica

electronica 2010

Electropages

Elektrobit

Elektrobit Corp.

Elektrobit Ltd.

Element Six

element14

Eli Brookner, Raytheon Co.

Eli Brookner, Raytheon Co. (Retired)

Eli Conner

Elisra

Elisra Electronic Systems Ltd., Microwave Division Bene Beraq, Israel

Elite RF, Hoffman Estates, Ill.

Ellen Ferraro and Drew Ganter

Ellen Modock

Elma Electronic Inc.

ELVA-1

ELVA-1

EM Research

EM Research Inc.

EM Software & Systems

EM Software & Systems-SA (Pty) Ltd., Stellenbosch, South Africa

EM Software and Systems GmbH

EM Solutions

Emanuel Kolta and Tim Hatt, GSMA Intelligence, London, U.K.

eMarketer

Emblation Microwave

Emblation Microwave Alloa, Scotland, UK

Emblation Microwave, Alloa, Scotland, UK

EMC Technology

EMC Technology Inc.

Emerson & Cuming Microwave Products

Emerson Network Power

Emerson Network Power Connectivity Solutions

Emhiser Research Inc.

EMITE

EMITE Ing

EMITE Ing, Murcia, Spain

Emmy Johnson, Sky Light Research, Scottsdale, Ariz.

Empower

Empower RF Systems Inc.

Empower RF Systems, Inglewood, Calif.

EMS SATCOM

EMS Technologies

EMS Technologies Inc.

EMSCAN, Calgary, Alberta, Canada

EMSS

EMV

Endicott Interconnect Technologies Inc.

Endwave

Endwave Corp.

Energy Micro

Engalco

Enoch R. Yeh, Chandra R. Bhat and Robert W. Heath, Jr., The University of Texas at Austin, Austin, Texas

Enrico Lia, European Space Agency, Noordwijk, The Netherlands

ENS Microwave LLC

EnSilica

Enterprise IoT Insights

Entropic Communications Inc.

Environmental Stress Systems Inc. (ESS)

eong-Sik Yang, Jong-Hwan Lee and Kyung-Whan Yeom

EPCOS

Epec Engineered Technologies

Epic Communications

Epic Communications Inc.

Eran Agmon, Pacific Grove Consulting

ERANGTEK

Eravant

Eravant, formerly Sage Millimeter Inc., Torrance, Calif.

Eravant, formerly Sage Millimeter Inc., Torrance, Calif.

Eravant, formerly Sage Millimeter Inc., Torrance, Calif.

Eravant, formerly Sage Millimeter Inc., Torrance, Calif.

Eravant, formerly SAGE Millimeter, Torrance, Calif.

Eravant, Torrance, Calif.

Eric Black, Alex Katko and Andjela Ilic-Savoia, Pivotal Commware, Kirkland, Wash.

Eric Desbonnets and Christophe Didier, Soitec, Bernin, France

Eric Drucker, Agilent Technologies, Santa Clara, CA

Eric Higham, Microwave Journal

Eric Higham, Strategy Analaytics, Boston, Mass.

Eric Higham, Strategy Analytics

Eric Higham, Strategy Analytics, Needham, Mass.

Eric Higham, Strategy Analytics, Newton, Mass.

Eric Higham, Technical Editor

Eric Jacquet, Jean-Pierre Bardon and Olivier Bignon

Eric P. Nichols, AlasKit Educational and Scientific Resources

Eric Starkloff, NI Executive Vice President of Global Sales and Marketing

Ericsson

Ericsson Components, RF Power Products

Ericsson RF Power Products

Erik Boch and Julius Kusuma, Facebook Connectivity, Menlo Park, Calif.

Erik Boch, CTO & VP Engineering Dragonwave, Inc.

Erik Boch, Dragonwave Inc.

Erik Boch, Dragonwave, Inc.

Erik Luther, CesiumAstro, Austin, Texas

Erik Ojefors, Sivers Semiconductors AB, Kista, Sweden

Erkan Acar, Analog Devices, Wilmington, Mass.

Ernest Rejman

Ervin J. Nalos, General Electric Co.

Erwin A. Ulbrich, Jr. and Dan Bryden

ERZIA Technologies

ERZIA Technologies of America

ERZIA Technologies, Santander, Spain

Escape

Escape Communications Inc.

ESIA

Steve Dudkiewicz, Gary Simpson and Giampiero Esposito, Maury Microwave Corp.; Mauro Marchetti, Anteverta-mw; Marc Vanden Bossche, National Instruments

Essad Tahan

Andrei A. Muller, Institute of Telecommunications and Multimedia Applications; Esther Sanabria-Codesal, Universitat Politècnica de València, Applied Mathematics Department, Spain

eSurface Technologies

Eta Devices, Inc.

Etenna Corp.

Ethertronics Inc.

ETL Systems

ETS-Lindgren

ETS-Lindgren L.P.

ETSI

Ettus Research

EuMW

Euroconsult

Eurofighter/Selex Galileo

Europa Worldwide Logistics

European Defence Agency

European Southern Observatory (ESO)

European Space Agency

European Space Agency (ESA)

European Standardization Organizations (ESO)

European Telecommunications Standards Institute

Eutelsat

Evans Capacitor Co.

everything RF

Exa¨el Alexander, Temex

Exalt Communications

Exceed Microwave, Torrance, Calif.

Excerpted from “History of Wireless” Tapan K. Sarkar, Robert J. Mailloux, Arthur A. Oliner, Magdalena Salazar-Palma and Dipak L. Sengupta

Exelis Inc.

EXFO

EXFO, Montreal, Canada

EXFO, Québec, Canada

Exodus Advanced Communications, Las Vegas, Nev.

Exodus Advanced Communications, Las Vegas, Nev.

Exodus Dynamics, Poway, Calif.

EXPWAY

Exxelia

Eyelit Inc.

EZ Form Cable, Hamden, Conn.

Ezgi Dogmus, PhD, Power & Wireless Division, Yole Développement

F

F. Alimenti, G. Stopponi, V. Palazzari, P. Placidi, L. Roselli and A. Scorzoni, University of Perugia; P. Ciampolini, University of Parma

F. Allibert, L. Andia, Y. Morandini and C. Veytizou, Soitec, Bernin, France

F. Amrani, M. Trabelsi and R. Aksas, Telecommunication Laboratory of ENP Algiers, Algeria, A. Azrar, University of Shamed Bouguarra Boumrdes, Algeria

F. Ditore and R. Cutler , Agilent Technologies Inc., Santa Clara, CA; S. Jennis, PrismTech, Boston, MA

F. Ejeckam, D. Francis, F. Faili, F. Lowe, J. Wilman, T. Mollart, J. Dodson, D. Twitchen and B. Bolliger, Element Six Technologies

F. Mohd-Yasin and M.K. Khaw, Multimedia University; M.B.I. Reaz, International Islamic University Malaysia

F. Mohd-Yasin, M.K. Khaw and F. Choong, Multimedia University; M.B.I. Reaz, International Islamic University Malaysia

F. Mohd-Yasin, M.K. Khaw and M.B.I. Reaz Multimedia University Cyberjaya, Malaysia

F. Mohd-Yasin, M.K. Khaw and M.B.I. Reaz, Multimedia University, Cyberjaya, Malaysia

F. Robert, R. Leblanc, J. Moron, A. Gasmi, N. Santos and M. Rocchi, OMMIC, Limeil-Brévannes, France

F. Rodriguez-Morales, C. Carabajal, A. Paden and C. Leuschen, Center for Remote Sensing of Ice Sheets, University of Kansas, Lawrence, Kan.

F. Salah-Belkhodja, Djillali Liabes University, Algeria

F.J. Ortega-Gonzalez, J.M. Pardo-Martin, A. Gimeno-Martin and C.B. Peces, Universidad Politécnica de Madrid

F&K Delvotec Inc.

Fa-Lin Liu University of Science and Technology of China, Hefei, China

Sheng Zhang, Hai-Ting Wang, Yi-Kang Zhang and Hai Liu, China University of Mining and Technology; Fa-Lin Liu, University of Science and Technology of China

Fabrisonic LLC

Fadhel M. Ghannouchi and Abbas Mohammadi

Fadhel M. Ghannouchi, University of Calgary

Fairchild Semiconductor

Fairchild Semiconductor Corp.

Fairview Microwave

Fairview Microwave, Lewisville, Texas

Falcon

Farran Technology Ltd., Cork, Ireland

Farran Technology, Cork, Ireland; Copper Mountain Technologies, Indianapolis, Ind.

Farrukh Arslan, PhD Purdue University

Fastback Networks

Fastrax

Federal Armed Forces University Munich, Germany

Fei Zhang, Lina Shi and Chengfang Li

Fei Zhang, Lina Shi and Chengfang Li, Wuhan University

FEKO

ANSYS, Canonsburg, Pa.; CST – Computer Simulation Technology, Darmstadt, Germany; FEKO (Altair Development), South Africa; Keysight EEsof EDA, Santa Rosa, Calif; NI, Austin, TX

Felix Ejeckam, Ty Mitchell, Kris Kong and Paul Saunier, Akash Systems Inc., San Francisco, Calif.

Femto Forum

Fenglong Hao, Changjian Tao, Chuan Jin, First Research Institute of The Ministry of Public Security, Beijing 100048, People’s Republic of China

Ferdinand Gerhardes, Anritsu GmbH; Peter Knott, Fraunhofer Institute

Ferdinando Iucolano, STMicroelectronics, Catania, Italy

Ferdo Ivanek

Ferenc & Christopher Marki, Ph.D.

Ferenc Marki

Ferro Electronic Materials

FiberTower

FierceWireless

FilResearch

Filtronic Broadband Limited

Filtronic Compound Semiconductors

Filtronic Compound Semiconductors Ltd.

Filtronic plc

Filtronic, Sedgefield, U.K.

FIME

Finmeccanica

Finmeccanica – Selex ES

Firas Mohammed Ali Al-Raie

FIRST RF Corp., Boulder, CO

BEN PAWLING Harris CapRock, Melbourne, FL KEITH OLDS Harris Government Communications, Melbourne, FL

Flann Microwave

Flann Microwave, Bodmin, U.K.

Flexiguide

Flirtey

Flomerics

Flomerics EM LOB

Flora Paganelli, Galen Watts and Karen O’Neil, Green Bank Observatory, W. Va.

Florian Krug and Jean Wilwert

Florida RF Labs

Florida RF Labs Inc

Florida RF Labs Inc.

Florida RF Labs/EMC Technology

Fluke Networks

Focus Display Solutions

Focus Microwaves Corp.

Focus Microwaves Inc.

Focus Microwaves, Inc.

Focus Microwaves, Saint-Laurent, QC, Canada

Forbes

Fordahl–FOQ Group

FormFactor Inc.

Fortify

Fortify

Fortify, Boston, Mass.

Forward Concepts

Fox Electronics

Fractal Antenna Systems, Inc.

Fractus Antennas

Fractus SA

Francesco Soldovieri IREA-CNR, Naples, Italy, Giancarlo Prisco and Adriana Brancaccio Second University of Naples, Italy; Giovanni Leone, University o

Francesco Soldovieri, IREA-CNR, Naples, Italy Giancarlo Prisco, Second University of Naples, Italy Raffaele Persico, IBAM-CNR, Lecce, Italy Hara

Francisco Javier Ortega Gonzalez, Jose Luis Jimenez Martin and Alberto Asensio Lopez

Francisco Javier Ortega-González and Jose Manuel Pardo-Martín, Universidad Politécnica de Madrid, Grupo de Ingenieria de Radio GIRA, Madrid, Spain

Francisco Javier Ortega-González, Universidad Politécnica de Madrid

Franck Nicholls and Jose Fernandez Villasenor, M.D., NXP Semiconductors, Chandler, Ariz.

Franco Di Paolo

Franco Sechi and Marina Bujatti

Frank Amoroso

Frank Baberg

Frank Bashore

Frank Bashore, <I>Microwave Journal</I> staff

Frank Bashore, Microwave Journal staff

Frank van Vliet, EuMW 2020, General Chair

Frank Xiaohui Li and Greg Corsetto

Frank Zavosh and James T. Aberle

Frank Zavosh, Mike Thomas, Chris Thron, Tracy Hall, Daniel Artusi, David Anderson, David Ngo and David Runton

Frank-Werner Thümmler and Thilo Bednorz, Rohde & Schwarz

Frank-Werner Thümmler, Rohde & Schwarz, Munich, Germany

Franz Hirtenfelder and Stephen Murray, CST – Computer Simulation Technology

Fraunhofer Institute for Applied Solid State Physics IAF

Fred Bonn

Fred Gardiol and Yves Fournier

Fred Hull, San-tron Inc., Ipswich, MA

Fred Hull, San-tron Inc., Ipswich, Mass.

Fred Schindler, Dennis Rosenauer, John Nielsen, Tom Raschko and Rich Nichols, Anlotek Ltd., London, U.K.

Fred Schindler, General Chairman, 2006 Radio and Wireless Symposium

Fred Schindler, John Nielsen, Dennis Rosenauer and Tom Raschko, Anlotek Ltd.

Fred Schindler, Virender Sadhir, Brian Robbins, David Guo and Jerry Paradis, RF Micro Devices, Greensboro, NC, Billerica, MA

Frédéric Aniel, EuMIC 2010 Chairman

Frederic Roger, Scintera Networks, Sunnyvale, CA

Freescale

Freescale Semiconducteurs S.A.S.

Freescale Semiconductor Inc.

Freescale Semiconductor, Austin, TX

Freescale Semiconductor, RF Division

Freescale Semiconductor, RF Division Tempe, AZ

Freescale Semiconductor, Tempe, Ariz.

Dave Frizelle

Frontlynk Technologies Inc.

Frost & Sullivan

FSY Microwave Inc.

Fu-Ling Lin, Shin-Fu Chen and Huey-Ru Chuang

Fujitsu Laboratories Ltd.

Fujitsu Limited

Fujitsu Microelectronics America Inc.

Fujitsu Semiconductor America Inc.

Fujitsu Semiconductor America Inc., Sunnyvale, CA

Fujitsu Semiconductor Europe

Fujitsu Semiconductor Limited

FUJITSU TEN

Full Spectrum

Future Market Insights

G

G. Cottard, ANTEM, Saint-Maur-des-Fosses, France; Y. Arien, Emerson & Cuming MWP

G. Hau, T.B. Nishimura, and N. Iwata

G. Klaric Felic, R. J. Evans, Hoa Thai Duong, Hoang Viet Le, J. Li and E. Skafidas, University of Melbourne

G. S. Karthikeya, BMS College of Engineering, Bangalore, India

G. S. Karthikeya, Department of ECE, BMS College of Engineering, Bengaluru, India

G. Samuel Dow, Jeff Yang, Kuo-Hsiang Yen, Robert Matreci, Eric Spotted-Elk, Stephen Pettis and Long Trinh

G. Soundarya and Dr. N. Gunavathi, National Institute of Technology, Trichy, Tamil Nadu, India

G. Soundarya and N. Gunavathi, Dept. of Electronics & Communication Engineering, National Institute of Technology, Tiruchirappalli, Tamil Nadu, India

G.A. Sadowy, A.C. Berkun, W. Chun, E. Im, S.L. Durden

G.T. Microwave Inc.

GaAs Code Ltd.

Gaas Labs LLC

GaAsTEK, a unit of ITT Industries

Gabriele Devita, EnSilica, Oxfordshire, U.K.

Gaëtan Prigent, Nathalie Raveu, Olivier Pigaglio and Henri Baudrand

Gaëtan Prigent, Nathalie Raveu, Olivier Pigaglio, Henri Baudrand

Galtronics Corporation Ltd.

GaN Systems

Gang Liu, Fuqi Mu, Yongqing Leng, Yang Li and Xinli Cui

Gang Liu, Fuqi Mu, Yongqing Leng, Yang Li and Xinli Cui, Institute of Microelectronics Chinese Academy & Univ. of Chinese Academy of Sciences

Gang Zhang, Weinan Normal University, Weinan, China

Gareth Lloyd, Rohde & Schwarz, Munich, Germany

Gary Giust, JitterLabs, Milpitas, Calif.; Doug Jorgesen, Marki Microwave, Morgan Hill, Calif.

Gary Lerude, Editor, Microwave Journal

Gary Lerude, Microwave Journal Editor

Gary Lerude, Microwave Journal Technical Editor

Gary Lerude, Microwave Journal, Norwood, Mass

Gary Lerude, Patrick Hindle and Jennifer DiMarco, Microwave Journal Editors

Gary Simpson, Maury Microwave Corp.

Gary Simpson, Maury Microwave, Ontario, CA; David Ballo, Agilent Technologies Inc., Santa Rosa, CA

Gary Zhang and Zhihao Zhang, Guangdong University of Technology, Guangzhou, China Synergy Innovation Institution of GDUT, HY, Heyuan, China

Gauss Instruments

GAUSS INSTRUMENTS GmbH

Gavin Smith and Nathan Glaza, NXP Semiconductors, Chandler, Ariz.

Gavin T. Watkins, Toshiba Research Europe Limited

Gavin Watkins and Stephen Wang, Toshiba Research Europe Ltd., UK

Gayle Collins

Gayle Collins and David W. Runton, RF Micro Devices

Gayle Collins, Nuvotronics, Durham, N.C.

GBI Research

GE Global Research

Geensoft

Geert Carchon, B. Nauwelaers, K.U. Leuven, P. Pieters, K. Vaesen, W. DeRaedt, E. Beyne

Gel-Pak, Hayward, Calif.

General Dynamics

General Dynamics

Geneviève Baudoin, EuWiT 2010 Conference Chair

Genstar Capital

Genstar Capital

Gent Paparisto and David Vye, National Instruments, Austin, Texas

GenXComm

Geoffroy Lerosey, Greenerwave, Paris, France

Geonho Jang and Sungtek Kahng, University of Incheon, Incheon, Korea

George Choquette, Senior Vice President, Hughes

George D. Vendelin, Vendelin Engineering; José Carlos Pedro and Pedro Miguel Cabral, Universitário de Santiago

George F. Brown, Jr., Blue Canyon Partners Inc.

George Karalias, Rochester Electronics

Georges Roussy, Bernard Dichtel and Haykel Chaabane

Georgi S. Kirov, Technical University of Varna, Bulgaria; Hristo D. Hristov and Rodolfo Feick, Universidad Técnica Federico Santa Maria, Valparaiso, C

Georgia Institute of Technology

Georgia Tech Research Institute

Gerald Womer and John Lewis, Micro-Coax, Pottstown, Pa.

Gerard Wimpenny, CTO, Nujira

Gerhard A. Hofbauer

Gerhard A. Hofbauer, Institut für Nachrichtentechnik und Wellenausbreitung

Gerhard P. Fettweis, TU Dresden, Dresden, Germany

German Torregrosa-Penalva, Alberto Asensio-Lopez, Jaime Lluch-Ladron de Guevara and Francisco Javier Ortega-Gonzalez

Kerri Germani

Geyer Electronic America Inc.

Steve Dudkiewicz, Marc Schulze Tenberge and Giampiero Esposito, Maury Microwave Corp., Ontario, Calif.; Travis Barbieri, Freescale Semiconductor, Phoenix, Ariz.

Giga-tronics

Giga-tronics Inc.

GigaLane

GigOptix

GigOptix Inc.

GigPeak

GIL Technologies

Gilat Satellite Networks Ltd.

Gilles Dambrine, General Chair, EuMW 2010; Ivar Bazzy, President, Horizon House Publications

Giorgos E. Stratakos, Paul Bougas and Kostas Gotsis

Giuseppe Macchiarella, Politecnico di Milano; Alberto Bovatti, FOREM S.r.l.

Giuseppe Pelosi, Department of Information Engineering, University of Florence

Giuseppe Pelosi, University of Florence

Giuseppe Vacca Bari Polytechnic Bari, Italy

Glen Fields, Director, Aerospace and Defense, MACOM, Lowell, MA

Global mobile Suppliers Association

Global Semiconductor Alliance

Global Test Solutions

Global VSAT Forum (GVF)

GLOBALFOUNDRIES

Globe Newswire

Globecomm Systems Inc.

Go Long Wireless

Goo-Young Jung and Tae-Yeoul Yun, Hanyan University

Google

Gopinath Gampala and C.J. Reddy, EM Software & Systems Inc.; Oliver Stabler and Thomas Hager, AWE Communications GmbH

Gopinath Gampala, Martin Vogel and C. J. Reddy, Altair Engineering Inc., Hampton Va.

Gopinath Gampala, Rohit Sammeta and C.J. Reddy, EM Software & Systems Inc., Hampton VA

Udi Gordon

Gordon Barber and Ted Hebron of Laird Connectivity

Gordon Reichard

Gordon Vinther, Ardent Concepts Inc., Seabrook, NH

Government Technology

Gowanda Components Group

Gowanda Electronics

Gowrish Basavarajappa, IIT Roorkee, Uttarakhand, India

Grace Remillard, University of Massachusetts-Lowell, Lowell, Mass.

GradConn

Graham Riley, Agilent EEsof EDA, West Lake Village, CA

Graham Teague, Business Development Manager EMEA, TriQuint Semiconductor GmbH.

Granite River Labs

Graphics for Jenn

Greenray Industries Inc.

Greg Adams and Kong S. Luen

Greg Friesen

Greg Jue and Brad Frieden, Agilent Technologies Inc., Santa Clara, CA

Greg Jue, Agilent Technologies Inc.

Greg Jue, Agilent Technologies, Santa Clara, CA; Thomas Dippon, Agilent Technologies, Boeblingen, Germany

Greg Jue, Keysight Technologies Inc., Santa Rosa, Calif.

Greg Jue, Keysight Technologies, Santa Rosa, Calif.

Greg Jue, Keysight Technologies, Santa Rosa, Calif.

Greg Peters, Agilent Technologies Inc., Santa Clara, CA

Greg Ramon, QinetiQ North America

Greg Skidmore, Jamie Infantalino, Jim Stack, Remcom

Gregg Peters, Keysight Technologies Inc., Santa Rosa, Calif.

Gregory L. Amorese, Agilent Technologies Inc. Santa Rosa, CA

GSMA

GSMA

Guang Yang, Wei Liu and Falin Liu, University of Science and Technology of China

Guangping Xie, Zongxi Tang, Biao Zhang and Xin Cao, University of Electronic Science and Technology of China

Guerrilla RF Inc.

Guerrilla RF, Greensboro, N.C.

Guillaume Ducournau, General Chair, University of Lille, IEMN-CNRS, France

Guillaume Pailloncy, Frans Verbeyst and Marc Vanden Bossche, NMDG NV, Bornem, Belgium

Günter Pfeifer and Benoit Derat Rohde & Schwarz, Munich, Germany

Gunter Vorlop

Cantianci Guo

Guoan Wu, Chao Guo, Qinfen Xu and Wenguang Li, Huazhong University of Science and Technology, Wuhan, China

Guohua Liu, Yijun Lin, Cantianci Guo and Zhiqun Cheng, Hangzhou Dianzi University

Guru Subramanyam, University of Dayton, Dayton, Ohio

Gustavo Lopez-Risueno and Jose I. Alonso

Guy Purchon, Bryan Harbor and Tom McConnell

Guy Sene, President of Agilent Technologies' Electronic Measurement Group

Guzik Technical Enterprises, Mountain View, Calif.

GVD Corporation

H

H. García-Vázquez, Sunil L. Khemchandani, J. Arias-Pérez and J. del Pino, University of Las Palmas de Gran Canaria Spain

H. M. Talasila, F. R. Morales and J. Paden, Center for Remote Sensing of Ice Sheets, University of Kansas, Lawrence, Kan.

H. Shigematsu, M. Sato, T. Hirose and Y. Watanabe

H. Thust, K.H. Drue, J. Muller, T. Thelemann, T. Tuschick, J. Chilo, C. Golovanov, F. Ndagijimana

H.C. Chiu, C.S. Cheng, C.C. Wei, Y.J. Shih and S.W. Lin, Chang Gung University; F.T. Chien, Feng Chia University

H.D. Hristov and R. Feick, Universidad Técnica Federico Santa María, Valparaíso, Chile, R.J. Urumov and G.S. Kirov, Technical University of Varna, Bul

H.R. Chuang, C.C. Lin and Y.C. Kan, National Cheng Kung University

H.R. Chuang, S.W. Kuo, C.C. Lin and L.C. Kuo National Cheng Kung University Tainan, Taiwan, ROC

H.T. Lin, Y.K. Chu and H.R. Chuang, National Cheng Kung University

Hadi Aliakbarian

Hai-wen Liu, Institute of Optics and Electronics; Zhiguo Shi, Zhejiang University; R.H. Knoechel, Kiel University; K.F. Schuenemann, Technische Univer

Haigh-Farr Inc.

Haim Spiegel, Keysight Technologies, Santa Rosa, Calif.

Haiwen Liu, Chinese Academy of Sciences, Chengdu, China; Xiaohua Li, University of Electronic Science and Technology of China, Chengdu, China

Haiwen Liu, East China Jiaotong University, Nanchang, China; Fu Tong, Chinese Academy of Sciences, Chengdu, China

Haiwen Liu, Jiuhuai Lei, Yulong Zhao and Wenyuan Xu, East China Jiaotong University, Nanchang, China

Haiwen Liu, Xiaomei Wang, Yulong Zhao, Yan Wang, Baoping Ren, Jiuhuai Lei and Shan Wang, East China Jiaotong University, Nanchang, China

Haiwen Liu, Yan Wang, Jiuhuai Lei, Shen Li and Xiaomei Wang, East China of Jiaotong University, Nanchang, China

Haki Cebi, Skyworks Solutions Inc., Woburn, MA

Hala Elsadek, Electronics Research Institute

Haleakala Research & Development, Inc.

Mike Hallman

Halran Howe

Hamed M. Sanogo, Analog Devices, Wilmington, Mass.

Hammam Shakhtour, Dirk Heberling, Institute of High Frequency Technology (IHF); Karam Noujeim, Anritsu

Han-Jun Wu, Chao Pang, Yu-Xin Cui, Rui-Feng Cao and Lin Li Zhejiang, Sci-Tech University, Hangzhou 310018, China

Hannu Tenhunen, Royal Institute of Technology (KTH), Stockholm, Sweden

Hans Mollee, Steven O'Shea, Paul Wilson and Korne Vennema

Hans O Johansson, Sivers Ima, Kista, Sweden

Hans-Ulrich Nickel, SPINNER GmbH, Munich, Germany

Harlan Howe

Harlan Howe Jr. and Richard Mumford

Harlan Howe Jr., Editor Microwave Journal

Harlan Howe Jr., Richard Mumford, Michael Puttré

Harlan Howe, Jr.

Harlan Howe, Jr. – Editor, Microwave Journal, Richard Mumford – European Editor, Microwave Journal, Michael Puttré – Editor-in-Chief, Journal of Elect

Harlan Howe, Jr. Editor, Microwave Journal

Harlan Howe, Jr., <i>Microwave Journal</i> Editor

Harlan Howe, Jr., Editor, <I>Microwave Journal</I>

Harlan Howe, Jr., Editor, Microwave Journal

Harlan Howe, Jr., Microwave Journal

Harlan Howe, Jr., Microwave Journal staff

Harmon Banning, W.L. Gore & Associates

Harris Corp.

Harris Stratex Networks

Harris Stratex Networks Inc.

Harry Chapell, Retired Professional Engineer

Harvey Kaylie, Mini-Circuits, Brooklyn, N.Y.

Harvey Lehpamer

Harvey Lehpamer, HL Telecom Consulting, San Diego, CA

Gerry Harvey, OnScale

HASCO, Inc., Moorpark, Calif.

He-Kai Jhuang and Ching-Her Lee, National Changhua University of Education; Po-Min Hu and Chung-I G. Hsu, Da-Yeh University

He-Xiu Xu, Guang-Ming Wang, Jian-Gang Liang and Tian-Peng Li, Missile Institute of Air Force Engineering University, Sanyuan, China

Heather Bota, Acceleware Corp.

Hector J. De Los Santos, Randy J. Richards

Hee Yong Hwang and Sang-won Yun, Sogang University

Hee-Yong Hwang, Sang-Won Yun and Joong-Sung Chung

GUANG YANG, WEI LIU AND FALIN LIU University of Science and Technology of China, Hefei, China SHENG ZHANG China University of Mining and Technology, Xuzhou, China

HEI Inc.

Heidi Barnes, Jeff Most and Mike Resso, Keysight Technologies, Santa Rosa, Calif.

Heinrich Daembkes, EADS Defence Electronics

Helen Duncan, MWE Media Ltd., U.K.

Helen Duncan, MWE Media Ltd., U.K.

Helen Duncan, MWE Media Ltd., U.K.

Helen Duncan, MWE Media, Ltd.

Helen Duncan, MWE Media, Ltd., U.K.

Helen Duncan, MWE Media, U.K.

Helen Mills, Agilent Technologies Inc.

Helen Wright

Henrik Morkner and Alfred Riddle, M/A-COM Technology Solutions, Lowell, MA

Henry Wojtunik

Heraeus Inc.

Herbert Schmitt, Rohde & Schwarz, Munich, Germany

Herbert Zirath

Herley Industries Inc.

Herley Industries Inc.</

Herotek

Hervé Aubert, General Chairman, EuMW 2015; Ivar Bazzy, President, Horizon House Publications

Sherry Hess

Hesse & Knipps

Hesse Mechatronics Inc.

Hetvi Patel, Kevin Kellog, Hugo Morales and Larry Dunleavy, Modelithics Inc.; Rob Jones and Paul Head, Raytheon

Heuermann

Heuermann and Rosenberger

Heungjae Choi and Yongchae Jeong, Chonbuk National University; J.S. Kenney, Georgia Institute of Technology; Chul Dong Kim, Sewon Teletech Inc.

Hewlett Packard Co.

Hewlett-Packard Co.

High Speed Interconnects

Patrick Hindle

HIRAI

Hirai SK Corp.

Hirose

Hirose Electric Co. Ltd.

Hiroyuki Maehara, Agilent Technologies Inc., Santa Clara, CA

Hiroyuki Maehara, Mark E. Hanni, Nader Srouji and Dara Sariaslani Keysight Technologies Inc., Santa Rosa, Calif.

Hittite

Hittite Microwave Corp.

Hittite Microwave Corp. Chelmsford, MA

Hittite Microwave Corp., Chelmsford, MA

Hittite Microwave Corp., Chelmsford, MA

Hittite Microwave Corporation

Hittite Microwave Inc.

Holger H. Meinel and Juergen Dickmann, Daimler AG, Stuttgart, Germany

Holger Schwarz, Narda Safety Test Solutions, Pfullingen, Germany

Holger Schwarz, Narda STS, Pfullingen, Germany

Holzworth

Holzworth Instrumentation Inc., Boulder, Colo.

Holzworth Instrumentation, Boulder, CO

Holzworth Instrumentation, Boulder, Colo.

Homayoun Ghani, Toshiba America Electronic Components Inc., Irvine, CA

Homayoun Nikookar

Honeywell

Honeywell, Solid State Electronics Center

Hong-Seop Lee and Hee-Yong Hwang, Kangwon National University

Hongbo Sun, Guosui Liu, Hong Gu, Weimin Su

Hongcheng Yang, Pandeng Wang, Wenyi Zhang, Cuiling Zhang, Cunlin Zhang, Bo Su and Jingsuo He

Hongfei Yao, Jun Hu, Muhammad Asif and Feng Yang, Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China

Honglei Chen and Rick Gentile, MathWorks, Natick, Mass.

Hoon Hwangbo, Sung-Chan Jung, Youngoo Yang, Cheon-Seok Park, Byung-Sung Kim and Wansoo Nah,

Hope Microelectronics Ltd.

Horizon House Publications

Horizon House, Exhibition Management Company

Houman Zarrinkoub, MathWorks, Natick, Mass.

How-Siang Yap, Agilent

Mike Howard

Howard Hausman

Howard Hausman, MITEQ Inc.

HP EEsof

Hristo D. Hristov, Walter Grote and Rodolfo Feick, Universidad Téchnica Federico Santa María, Valparaiso, Chile

HRL

HRL Laboratories

HRL Laboratories LLC

Hsin-Chih Kuo, Chu-Yun Yang and Huey-Ru Chuang, National Cheng Kung University, Tainan, Taiwan, China

Huang Liang Technologies Co. Ltd.

Huawei

Huber + Suhner AG

Huber+Suhner

HUBER+SUHNER AG

HUBER+SUHNER AG, Herisau, Switzerland

Huber+Suhner and Rosenberger

Huber+Suhner Cube Optics

HUBER+SUHNER, Herisau, Switzerland

HUBER+SUHNER/SPINNER

Hudong Chang, Bing Sun and Honggang Liu, Institute of Microelectronics Chinese Academy of Sciences, Beijing, China

Huey-Ru Chuang, Liang-Chen Kuo, Chi-Chang Lin and Wen-Tzu Chen

Hugh R. Nudd

Hughes Network Systems LLC

Hugo Dinis and Paulo Mendes, University of Minho, Braga, Portugal

Hugo Morales(2), Chris DeMartino(2) and Isabella Bedford (2), Modelithics Inc.(2), Tampa, Fla.

Dennis Hurst

Hussam Ayad and Jalal Jomaah, EDST, Lebanese University, Beirut, Lebanon

HVS Technologies Inc

HVVi Semiconductors

HVVi Semiconductors Inc.

Hwee Yng Yeo, Keysight Technologies, Santa Rosa, Calif.

Hyeong Tae Jeong, Chul Dong Kim and Ik Soo Chang, Sogang University

Hyeonjin Lee and Yeongseog Lim

Hyeonjin Lee, Dongkang College; Jinwoo Jung and Yeongseog Lim

Hyok-Jae Song and Marek E. Bialkowski

HYPERLABS INC., Louisville, Colo.

HYPERLABS, Beaverton, Ore.

Hyun-Chul Go and Yong-Woong Jang; Hankook Antenna Co. Ltd., Keukdong College

Hyun-Chul Go, Hankook Antenna Co. Yong-Woong Jang, Keukdong College

Hyun-Min Park, Kye-Ik Jeon, Songheol Hong

Hyunchul Ku, Wangmyong Woo, J. Stevenson Kenney

Hyung Joun Yoo and Ji-Hoon Kim, Information and Communications University (ICU)

Hyungchul Kim, Hanjin Cho, Min-Su Kim, Mincheol Seo, Junghyun Ham, Cheon-Seok Park and Youngoo Yang, Sungkyunkwan University

Hyungoo Yoon, Myongji College and Byung-Jun Jang, Kookmin University, Seoul, Korea

Hyunsoo Kim and Sungtek Kahng, University of Incheon, Incheon, Korea

I

I-Q Analog, San Diego, Calif.

I-Tseng Tang, National University of Tainan

I. Tseng Tang, National University of Tainan; Ding-Bing Lin, Institute of Computer and Communication; Tzu-Hao Lu, Industrial Technology Research Insti

Iain Morris

Iain Morris, Telecommunications Magazine

Ian Burke, Menlo Microsystems Inc., Irvine, Calif.

Ian Collins and Kazim Peker, Analog Devices Inc., Norwood, Mass.

Ian Doyle, Bourns Electronics Inc.

Ian Dunn, Spectrum Control, Fairview, Pa.

Ian Gresham, Rob McMorrow, David Corman and Nitin Jain, Anokiwave Inc., San Diego, Calif.

Ian Hunter, General Chair, EuMW 2011; Ivar Bazzy, President, Horizon House Publications

Ian Wylie and Gerard Wimpenny, Nujira Ltd., Cambridge, UK; Dave McIntosh, KCB Signal Solutions LLC, Shirley, MA

IBM

Ibrahim Fortas, Department of Electrical Engineering, University of Boumerdes, Algeria

Ibrahim Haroun, Senior Member, IEEE Research Scientist/ RF Systems Developer (retired), Canada

IC Foundry Almanac

iCana, New Taipei City, Taiwan

Icron

IDC

IDirect Government Technologies, Herndon, VA

IDT

IDTechEx

IEE

IEEE

IEEE Antennas and Propagation Society

IEEE Communications Society (ComSoc)

IEEE IMS/MTT-S 2010 Women in Microwaves

IEEE Microwave Theory and Techniques Society (MTT-S)

IEEE-IEDM

IFEN

IFI

IFR Americas Inc.

IFR Sustems Inc.

IFR Systems Inc.

Ignacio Llamas-Garro, Centre Tecnolgic de Telecomunicacions de Catalunya, Barcelona, Spain

Ignacio Montiel-Sanchez, European Defence Agency (EDA), Belgium

Ignatz Eisele, Center for Integrated Sensor Systems, Universität der Bundeswehr, Munich, Germany, Fraunhofer EMFT, Munich, Germany

Igor Abramzon and Vadim Tapkov, Magic Xtal Ltd., Omsk, Russia

Ihn S. Kim, Chisung Jo and Yongin Han

Ihn S. Kim, Key Jeong, Jae Kwon Jeong

IHP

IHP–Leibniz-Institut für innovative Mikroelektronik/Ferdinand-Braun-Institut

IHS

IHS iSuppli

IHS Technology

II-VI Inc.

IKE Micro/Bonding Source

imec

imec Holst Centre

IMS

IMS 2009

IMS 2010

IMS 2011

IMS 2014

IMS Connector Systems

IMS Research

IMS2009

IMS2010

IMSAR

IMST GmbH, Kamp-Lintfort, Germany

IMST, Kamp-Lintfort, Germany

In Ho Kang, Shi Wei Shan, Xu Guang Wang and Young Yun, Korea Maritime University; Ji Hoon Kim and Chul Soon Park, Information and Communications Unive

In-Ho and Xin Guan, Korea Maritime University, Busan, South Korea

In-ho Kang and Haiyan Xu, National Korea Maritime University

In-Ho Kang and Jin-San Park, Korea Maritime University

In-ho Kang, Joo-yeon Kim

In-ho Kang, Xuguang Wang, Young Yun and Hongchao Zhang

In-ho Kang, Xuguang Wang, Young Yun, Hongchao Zhang

In-Phase Technologies

In-Phase Technologies, Bordentown, N.J.

In-Stat

In-Stat Research

Peraso Inc.

Incyte Inc.

Inder J. Bahl

Inder J. Bahl and Mark Dayton, Tyco Electronics, M/A-COM Products

Inder J. Bahl, M/A-COM

Inder J. Bahl, M/A-COM Inc.

indie Semiconductor, Aliso Viejo, Calif.

Indium Corp.

Indium Corporation

Indra

Indra Ghosh, Jan Buchholz, Horst Fischer, Ulrich Altmann, Jörg Berben, Jonas Lehmke, Ulrich Lewark

Infineon and Nokia

Infineon Technologies

Infineon Technologies AG

Infineon Technologies AG, Munich, Germany

Infineon Technologies AG, Neubiberg, Germany

Infineon Technologies and Golden Gate Capital

Infineon Technologies, El Segundo, Calif.

Infineon Technologies, Morgan Hill, Calif.

Infineon Technologies, RF Power Products

Infineon/Nokia

Infinite Electronics

Infinite RF Holdings Inc.

Infolytica Corp

Infonetics

Information Systems Laboratories, Inc., San Diego, Calif.

Ingrid De Wolf, Piotr Czarnecki, Anne Jourdain, Robert Modlinski and

INGUN Prüfmittelbau GmbH, Konstanz, Germany

INGUN USA Inc., Lake Wylie, S.C.

Inmarsat

Inmet Corp.

Innovative Integration, Camarillo, Calif.

Innovative Micro Technology Inc.

Innovative Power Products

Inphi Corp.

iNRCORE

INSIDE Contactless

Insight SIP

Inspower Co., Ltd.

Instec LLC

Wang Xi, Muhammad Asif, Tong Zhihang and Jin Zhi, Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China; University of Chinese Academy of Sciences, Beijing, China

Institution of Engineering and Technology

Instruments For Industry

Insulated Wire Inc., Bayport, N.Y.

Insulated Wire Inc., Microwave Products Division, Bethel, Conn.

Insulectro

Integra

Integra Technologies

Integra Technologies Inc.

Integra Technologies Inc. El Segundo, CA

Integra Technologies Inc., El Segundo, CA

Integral Systems

Integral Systems Inc.

Integrated Device Technology Inc., San Jose, Calif.

Integrated Device Technology, Inc. (IDT)

INTEGRATED Engineering Software

INTEGRATED Engineering Software, Winnipeg, MB, Canada

Integrated Microwave Corp.

Integrated Microwave Technologies

Intel

Intelek

J.R. Guerci, Guerci Consulting LLC; T. Driscoll, R. Hannigan, S. Ebadi and C. Tegreene, Intellectual Ventures; and D.E. Smith, Duke University

Intelliconnect (Europe) Ltd.

Intelsat S.A.

Inter-Continental Microwave

Inter-Continental Microwave (ICM)

Intercept Technology Inc.

Intercept Technology, Inc.

Interlligent

International M2M Council (IMC)

International Manufacturing Services Inc

International Manufacturing Services Inc.

International Manufacturing Services Inc. (IMS)

International Microwave Power Institute

International Microwave Symposium

International Telecommunication Union

International Telemetering Conference

International Wireless Communication Expo (IWCE)

International Wireless Communication Expo (IWCE)

inTest Corp.

inTEST Thermal Solutions

Introduction by Peter Staecker, Chairman, 1991 MTT-S Boston Symposium; Compiled by David Vye

ip.access

IPDiA

IPDiA

IQD

IQD Frequency Products Ltd.

IQE

IQE plc

IQLP LLC

Iridium Communications Inc.

Irma Swain, Communications Manager

iRobot

iRobot

Isaac Mendelson and David Bernstein

Isaac Mendelson, ElectroMagneticCareers.com

Isaac Mendelson, ElectroMagneticCareers.com and David Germond, Cleared Executive Search

ISCO International

Ismael Molina, Alba Würth Elektronik eiSos GmbH & Co. KG

Ismail Nasr, Infineon Technologies, Neubiberg, Germany

Isola Group

Isola Group S.a.r.l.

Isola USA Corp.

Isolink Inc.

iSuppli Corp.

iTerra Communications

ITS Electronics

ITS Electronics Inc.

ITT Corp.

ITT Corp.'s Microwave Systems

ITT Exelis

ITT Industries Inc.

ITT Interconnect Solutions

ITT Microwave Systems

Ivan Boshnakov, Ametek Compliance Test Solutions, Reinach, Switzerland

Ivan Boshnakov, Microwave Design Engineer

Ivan Koshurinov

Ivanov Yuri, Nikonov Arkady and Knyazeva Elvira, Morion Inc., St. Petersburg, Russia

Ivar Bazzy, President, Horizon House Publications

IWCE Expo

IXYS Corp.

IZT GmbH

J

J. Anguera, A. Andújar and C. Puente, Fractus Antennas, Sant Cugat del Vallés, Barcelona, Spain

J. Anguera, A. Andújar, J.L. Leiva, C. Puente, R. Arribas, Y. Cobo

J. Brunning and R. Rayit, SARAS Technology, Leeds, U.K.

J. Capwell, T. Weller, D. Markell and L. Dunleavy, Modelithics Inc.

J. Cheng, S. Li, B. Han and J. Gao, East China Normal UniversityShanghai, PR China; X. Yao, Semiconductor Manufacturing International Corp., Shanghai,

J. L. Allen

J. Laskar, S. Pinel, D. Dawn, S. Sarkar, B. Perumana and P. Sen, Georgia Institute of Technology, Atlanta, GA

J. McDaniel, Advanced Radar Research Center, University of Oklahoma, Norman, OK

J. McDaniel, Advanced Radar Research Center, University of Oklahoma, Norman, Okla.

J. Randy Fenton

J. Rodriguez-Tellez

J. Rodriguez-Tellez, N.T. Ali and K.A. Mezher, Etisalat College of Engineering; T. Fernandez, A. Mediavilla, A. Tazon and G. Rafael, Universidad de Ca

J. Rodriguez-Tellez, T. Fernandez, A. Mediavilla and A. Tazon

J. Staudinger

J. Wareberg, D. Kennedy, S. Schmidt

J. Wayde Allen

J. Zhou, S. Ming, J. Zhao, C. Ming and L. Zhang Southeast University Nanjing, China

J.A. Tirado-Méndez and H. Jardón-Aguilar, Center for Research and Advanced Studies, IPN; E.A. Andrade-González and M. Reyes-Ayala, Metropolitan Autono

J.Brunning and R. Rayit SARAS Technology, Leeds, U.K.

J.E. Mueller, U. Gerlach, G.L. Madonna, M. Pfost, R. Schultheis and P. Zwicknagl

J.H. Flemming, R. Cook, S. Sibbet, C.F. Schmidt, K. Dunn and J. Gouker, 3D Glass Solutions Inc., Albuquerque, NM

J.J. Yu and S.T. Chew

J.K. McKinney, IMS2010 General Chairman

J.L. Smith

J.M. Cairon, A. Tazon, T. Fernandez, C. Navarro, A. Mediavilla and J. Rodriguez-Tellez

J.M. Huang, (also affiliated with State Key Laboratory of Information Photonics and Optical Communications); H.Z. Zhu, H. Guo, and K. Han, Beijing Uni

J.P. Bridge, Accent Optical Technologies Inc.

J.P. Lanteri and D.J. Carlson, M/A-COM Inc., Lowell, MA

J.S. Kenney and A. Leke

J.S. Mandeep and H. Abdullah, Universiti Kebangsaan Malaysia Selangor, Malaysia; Nitesh Ram, Universiti Sains Malaysia Pulau, Pinang, Malaysia

Jacek Pierzchlewski and Torben Larsen, Aalborg University

Jack Daniels, EastBridge Partners LLC, Brookline, MA

Jack Pollock

Jacket Micro Devices Inc. (JMD)

Jackie Johnson, RFMD, Greensboro, NC

Jackson Labs Technologies Inc.

Jacques C. Rudell, RFIC 2013 General Chairman

Jacquie McNish and Sean Silcoff; Reviewed by Gary Lerude

Jad Faraj, Verspecht-Teyssier-DeGroote SAS, France; Simon Mathias, Mesuro Ltd., UK; Jean-Pierre Teyssier, XLIM, University of Limoges, France; Johanne

JADAK

Jae-Ho Yoon, Won-Yong Cho, Ah-Rah Koh, Seung-Jun Lee, Bhanu Shrestha, Gary P. Kennedy and Nam-Young Kim, Kwangwoon University Seoul, Korea

Jaehoon Kim, Smit Baua, Gopinath Gampala and Aniket Hegde, Altair Engineering, Troy, Mich.

Jagjit Singh Bal, Infineon Technologies North America Corp.

Jaime Leger, Partner at SLN – Sheppard, Leger, Nowak Inc. Marketing Communications

Jaime Leger, SLN

Jake Goldstein and Mehdi Soltan

Jaleh Komaili, Darioush Agahi and Masoud Kahrizi, Senior Members, IEEE

Jaleh Komaili, Senior Member, IEEE, Darioush Agahi, and Masoud Kahrizi, Senior Member, IEEE

Jamal S. Izadian, AntennEM Communication LLC

Jamal S. Izadian, Ph.D, RFCONNEXT, Inc.

James C. Rautio, IEEE Fellow, FRSE

James C. Rautio, Sonnet Software

James C. Rautio, Sonnet Software Inc., Syracuse, N.Y.

James Chen

James E. De Broeck

James Frame, PhD, Jeritt Kent and Ian Lawee, Analog Devices Inc., Norwood, MA

James J. Rosenberg, Michael P. DeLisio and Blythe C. Deckman Wavestream Corp., Chun-Tung Cheung and David B. Rutledge California Institute of Technolo

James Kimery and Ian Wong, National Instruments, Austin, TX

James Kimery, Director of Marketing, National Instruments

James Kimery, National Instruments, Austin, Texas

James Logothetis and Kevin Spencer, Crane Aerospace & Electronics, West Caldwell, N.J.

James Rautio, Sonnet Software, Liverpool, NY

James Rautio, Sonnet Software, Syracuse, NY, John Reynolds and Allen F. Horn III, Rogers Corp., Rogers, CT

James Skinner and Nick Ridler, National Physical Laboratory, Teddington, U.K.

James Spoto, Applied Wave Research Inc.

James Swonger, Peter Bacon and Gary Wu, Peregrine Semiconductor, San Diego, CA

James Truchard, National Instruments, Austin, Texas

James Weiler, IMS MicroApps 2012 Chair

James Wong, Andrei Grebennikov and Naoki Watanabe, Sumitomo Electric Europe Ltd.

Jan Carlsson, RanLOS AB, Gothenburg, Sweden

Jan E. Prochnow, Rohde & Schwarz Munich, Germany

Jan Whitacre, Agilent Technologies, Santa Clara, CA

Janet Ooi, Keysight Technologies

Janet Smith

Jang-Hyeon Jeong, Young Yun, Hong-Seung Kim and Nat-Won Jang, Korea Maritime University, Yunju Baek, Pusan National University

Janine Love Event Director and Contributing Editor, Microwave Journal

Janine Love, Contributing Editor MWJ, Editor SIJ

Janine Love, Contributing Editor, Microwave Journal

Janine Love, EDI CON Event Director

Janine Love, Technical Program Director, EDI CON China 2017

Janine Love, Technical Program Director, EDI CON China 2018

Jason Breitbarth and Joe Koebel, Holzworth Instrumentation

Jason Breitbarth, Holzworth Instrumentation, Boulder, CO

Jason Breitbarth, Saetta Labs, Boulder, Colo.

Jason Schreiber, SixArms, Queensland, Australia

Jason Smith

Jason Smith and Pat Malloy

Jason Smith and Pat Malloy, AR Worldwide

Jason Smith; Manager Applications Engineer and Pat Malloy; Sr. Applications Engineer. AR Worldwide

Jason Zhang, Jonas Urbonas and Giampiero Esposito, Maury Microwave, Ontario, Calif.

Jaume Anguera, Fractus Antennas and Universitat Ramon Llull

Javelin Semiconductor Inc.

Javelin Semiconductor, Austin, TX

Jay McDaniel, Jie-Bang Yan and Sivaprasad Gogineni, University of Kansas, Lawrence, Kan.

Jayant Kumar Rai and Pinku Ranjan, Atal Bihari Vajpayee Indian Institute of Information Technology and Management Gwalior, Madhya Pradesh, India

Jazz Semiconductor

JCREW

Jean Francois Favennec, Cedric Quendo, Universite de Brest

Jean-Jacques Bouny

Jean-Jacques DeLisle, EMRFS, Theodore, Ala.

Jean-Jacques DeLisle, IXS, Theodore, Ala.

Jean-Pierre Bertinet, Eddie Leleux and Jean-Pierre Cazenave, THALES Microelectronics; Jean-Pierre Ganne, Michel Paté and Richard Lebourgeois, THALES R

Jean-Pierre Bienaime, Chairman, UMTS Forum London, UK

Jeanmarc Laurent and Chinh Doan, Milliwave Silicon Solutions Inc., San Jose, Calif.

Jed Rice

Jeff Barney and Scott Langdon, Remcom Inc., State College, Pa.

Jeff Burkett, Tim Dolan, Rafi Hershtig, K&L Microwave; Douglas King, Pole/Zero Corp.

Jeff Gengler and James Nelson, Qorvo Inc., Richardson, Texas

Jeff Hassannia, President, Aerospace BD

Jeff Heynen, Dell’Oro Group, Redwood City, Calif.

Jeff Owens

Jeff Shamblin, Ethertronics, San Diego, CA

Jeff Shamblin, Taoglas, Enniscorthy, Ireland

Jeff Stitt

Jeffrey Jargon, Jon Martens, Andrej Rumiantsev and Marc Vanden Bossche

Jeffrey M. Pond, IMS 2011 General Chairman

Jeffrey M. Pond, Naval Research Laboratory and IMS General Chair, Washington, DC

Jenn DiMarco, Staff Editor, Microwave Journal

Jennifer DiMarco and Frank Bashore

Jennifer DiMarco and Frank Bashore Microwave Journal staff

Jennifer DiMarco, Managing Editor

Jennifer DiMarco, Managing Editor, Microwave Journal

Jennifer DiMarco, Staff Editor

Jenshan Lin, General Chair

Jeong-Gab Ju, Young Yun, Young-Bae Park and Suk-Youb Kang Korea Maritime University, Busan, Korea

Jeonghyeon Cha, Ildu Kim, Sungchul Hong and Bumman Kim, Pohang University of Science and Technology (POSTECH), Gyeongbuk, South Korea, Jong Sung Lee a

Jeremy K. Raines

Jeremy K. Raines, Raines Engineering

Jeremy Wensinger, Cobham Defense Systems, Washington, DC

Jerome Kerr

Jerry D. Neal

Jerry Hausner, Electro Science Technologies

Jerry Jordan

Jerry Yue and Jeff Kriz

Jersey Microwave

Jesper Thaysen, Nokia Denmark; Kaj B. Jakobsen, Technical University of Denmark

Jesse C. James

Jessy Cavazos, Keysight Technologies

Jessy Cavazos, Keysight Technologies, Santa Rosa, Calif.

Jessy Cavazos, Keysight Technologies, Santa Rosa, Calif.

JFW

JFW Industries Inc., Indianapolis, Ind.

Jian An, Guang-ming Wang, Chen-xin Zhang and Hui-yong Zeng, Air Force Engineering University, Sanyuan, P.R.C.

Jian-kang Xiao South China University of Technology Guangzhou, China, Shi-wei Ma Shanghai Key Laboratory of Power Station Automation Technology Shangh

Jian-Kang Xiao, Xidian University, State Key Laboratory of Millimeter Waves; Wen-Jun Zhu, Hohai University

Jian-Kang Xiao, Xidian University, Xi’an, China, and State Key Laboratory of Millimeter Waves, Nanjing, China; Wen-Jun Zhu, Hohai University, Changzho

Jian-Qiang Gong and Chang-Hong Liang, Xidian University, Xi’an, China

Jiang Liu, Hugo Morales, Thomas Weller and Larry Dunleavy, Modelithics Inc., Tampa, FL; Gerhard Schoenthal, Virginia Diodes Inc., Charlottesville, VA

Jianhao Ma, Yong Fang, Qingsong Zhang, Huijun Wang, Ziwei Xie and Qi Zhang, Chengdu University of Technology, Chengdu, China

Jianhua Deng, Sichuan Zhongce Microgrid Technology Co. Ltd.

Jianing Zhao, Jianyi Zhou, Jianfeng Zhai, Xiao Liang and Wei Hong, Southeast University, Nanjing, P.R. China

Jianing Zhao, Xiaowei Zhu, Jianyi Zhou, Jin Liu

Jianjun Gao, East China Normal University Shanghai, P.R. China

Jianyi Zhou, Jianing Zhao, Wei Hong and Xiaowei Zhu, Southeast University

Jianyi Zhou, Lei Zhang, Wei Hong, Jianing Zhao and Xiaowei Zhu, Southeast University

Jianyi Zhou, Limin Feng, Xiaowei Zhu and Wei Hong

Jianzhong Chen and An-Xue Zhang, Jiaotong University, Xi’an, Shaanxi, China; Kun Deng and Shuai Yang, Xidian University, Xi’an, Shaanxi, China

Jianzhong Chen, Jie Shen, Ni Gao and Anxue Zhang, Xi’an Jiaotong University, Xi’an, Shaanxi, China

Jie Li, Jia-Bei Zhao, Jia-Jun Liang, Lin-Lin Zhong and Jing-Song, Hong University of Electronic Science and Technology of China, Chengdu, China

Jim Barthold

Jim Barthold, <i>Telecommunications</i>®

Jim Barthold, Telecommunications

Jim Barthold, Telecommunications Magazine

Jim Carlini

Jim D’Ostilio Microwave Circuits Inc. Lynchburg, VA

Jim DeLap

Jim Fallon

Jim Fallon President and CEO, Fallon & Associates LLC

Jim Fallon President and CEO, Fallon and Associates LLC

Jim Fallon, Fallon and Associates Consulting LLC

Jim Fallon, Fallon and Associates LLC, Hingham, MA

Jim Fallon, Hittite Microwave Corporation, Corporate Business Development, Military Systems

Jim Fallon, President and CEO of Fallon & Associates Consulting

Jim Fallon, President and CEO, Fallon and Associates Consulting LLC

Jim Fallon, President and CEO, Fallon and Associates LLC

Jim Harvey

Jim Henderson and Billy Kao, Innovative Integration, Camarillo, Calif.

Jim Holbrook, SiTime, Sunnyvale, Calif.

Jim Mayock, VIPER RF Ltd.

Jim Morgan, SemiGen Inc.

Jim Ross, Skyworks Solutions Inc., Woburn, Mass.; Vic Wilkerson and Peter Lefkin MIPI® Alliance

Jim Stratigos, CEO, Jacket Micro Devices

Jim Tabor Product Planner, Real-Time Spectrum Analyzer Group, Tektronix Inc.

Jimmy Yu, Dell’Oro Group, Redwood City, Calif.

JIN-KUK LEE, SU-TAE KIM AND YONG-CHAE JEONG Chonbuk National University, JONG-SIK LIM Soonchunhyang University, Asan, Korea, CHUL-DONG KIM, Sewon Tele

Jin-Su Kim and Hee-Yong Hwang, Kangwon National University, Chuncheon, South Korea

Jinaing Zhao, Jianyi Zhou, Xiao Liang and Jianfeng Zhai, School of Information Science and Engineering, Southeast University

Jinaing Zhao, Jianyi Zhou, Xiao Liang, Jianfeng Zhai, School of Information Science and Engineering, Southeast University, Nanjing, P.R. China

Jinbiao Xu, Agilent Technologies

Jincan Zhang, Bo Liu, Leiming Zhang and Ligong Sun, Henan University of Science and Technology, Luoyang, China

Jincan Zhang, Bo Liu, Leiming Zhang, Jinchan Wang and Qing Hua, Henan University of Science and Technology

Jincan Zhang, Ligong Sun, Min Liu, Liwen Zhang and Bo Liu, Henan University of Science and Technology, Luoyang, China

Jincan Zhang, Min Liu, Jinchan Wang, Liwen Zhang and Bo Liu, Henan University of Science and Technology, Luoyang, China

Jing Guo, XianQi Lin, YuXin Kang, ChangSong Liang and Delanyo Kulevome, University of Electronic Science and Technology of China

Jing Guo, XianQi Lin, YuXin Kang, ChangSong Liang and Delanyo Kulevome, University of Electronic Science and Technology of China

Jinwoo Jung and Yeongseog Lim, Chonnam National University Gwangju, Korea; Hyeonjin Lee, Dongkang College, Gwangju, Korea

Jinwoo Jung and Yeongseog Lim, Chonnam National University; Hyeonjin Lee, Dongkang College

Jiri Polivka, Spacek Labs Inc.

JitterLabs LLC

Jiyeon Jang, Yejune Seo, Yejin Lee, Department of Information and Telecommunication Engineering, Incheon National University, Incheon, South Korea

Jiyoun Munn, COMSOL, Inc., Burlington, Mass.

Joachim Samuelsson

Joakim Espeland and Andrian Buchi, QuadSAT, Denmark

Joakim Espeland, QuadSAT, Odense N, Denmark

Jochen Wolle and Rainer Lenz, Rohde & Schwarz, Munich, Germany

Joe Chandler, Millitech (Smiths Microwave), Northampton, Mass.; R. William Steagall, L-3 Communication Systems-West, Salt Lake City, Utah

Joe Chandler, Millitech Inc., a Smiths Interconnect Business, Northampton, MA

Joe Cozzarelli, Anadigics

Joe Gorin and Michael Dobbert, Agilent Technologies, Santa Rosa, CA

Joe Madden Avago Technologies San Jose, CA

Joe Madden, Mobile Experts, Campbell, Calif.

Joe Madden, Mobile Experts, Silicon Valley, Calif.

Joe Madden, Mobile Experts; Anirban Bandyopadhyay and Ned Cahoon, GlobalFoundries; Harish Krishnaswamy, MixComm

Joe Madden, Principal Analyst, Mobile Experts

Joe Pusl, Srikanth Sridharan, Philip Antognetti, David Helms, Anurag Nigam, James Griffiths, Kenneth Louie, Mark Doherty

Joel Brand, Kumu Networks, Sunnyvale, Calif.

Joel Dobler and Sam Ringwood, Analog Devices, Wilmington, Mass.

Joel Dobler and Sam Ringwood, Analog Devices, Wilmington, Mass.

Joel Dobler, Analog Devices, Wilmington, Mass.

Joel Dunsmore

Joel Dunsmore, Agilent Technologies Inc., Santa Clara, CA; Ted Heil and Harvey Kaylie, Mini-Circuits, Brooklyn, NY

Joel Dunsmore, Greg Jue and John Kikuchi

Joel Goldstein, President, Goldstein Group Communications Inc.

Joel Kirchman, AWR

Joel Kirschman

Joel Kirshman, AWR Corp.

Joel M. Libove, Brendan R. Illingworth, Steven J. Chacko - Furaxa Inc.; Hal L. Levitt, Naval Research Laboratory

Joel P. Dunsmore, Agilent Technologies Inc., Santa Rosa, CA

Joerg Koepp and Nikola Serdar, Rohde & Schwarz

Johannes Benedikt

Johannes Schulze and Peter Singerl, Infineon, Neubiberg, Germany

Johannes van Bezouwen and Dr. Michael Brandfass, HENSOLDT Sensors GmbH

Johanson

Johanson Technology Inc.

Johanson Technology, Camarillo, Calif.

John Barfuss, Agilent Technologies

John Barr, General Chairman, 2006 International Microwave Symposium

John Brewer

John Brewer and Peter Gammel, SiGe Semiconductor Inc.

John Bushie

John Coonrod, Rogers Corp., Chandler, Ariz.

John Coonrod, Rogers Corp., Chandler, AZ and Brian Rautio, Sonnet Software, North Syracuse, NY

John Coonrod, Rogers Corp., Rogers, CT

John Cowles, Senior Director of Engineering & Technology, Analog Devices, Norwood, Mass.

John Dames, Reticulate, Palm Bay, Fla.

John Dunn, National Instruments, Austin, Texas

John E. Penn

John E. Penn, Johns Hopkins University

John Esterline, Greenray Industries Inc.

John F. Aubin

John F. Sevic

John Hansen, Agilent Technologies Inc., Santa Clara, CA

John Harmon, Agilent Technologies Inc., Santa Clara, CA

John Hendricks, Rogers Corp.

John Hoschette

John Kilpatrick and Robbie Shergill, Analog Devices, Norwood, Mass.; Manish Sinha, Xilinx Inc., San Jose, Calif.

John Lee, RFHIC, Gwacheon, South Korea

John M. Seavey

John Martens and Dennis Lewis, ARFTG 2023 Tech Program Chairs

John McKillop, TeraVicta Technologies Inc., Austin, TX

John Mruz, Sr., Retired Microwave Engineer

John P. Wendler

John S. Hansen, Agilent Technologies Inc.; Jim Taber, X-COM Systems

John S. Hansen, Keysight Technologies Inc., Santa Rosa, Calif.

John Silvestro, Kezhong Zhao and Arien Sligar; ANSYS Inc., Canonsburg, PA

John Thornton, Andy White and Graham Long, University of York, UK

John W. Schultz, Compass Technology Group, Roswell, Ga.

John W.M. Rogers and Calvin Plett

John Walker and James Custer, Integra Technologies Inc.

John Walker and James Custer, Integra Technologies, El Segundo, Calif., Malcolm Edwards, Cadence, El Segundo, Calif.

John Walker, Integra Technologies, El Segundo, Calif.

John Walker, William Veitschegger, Richard Keshishian, Integra Technologies Inc., El Segundo, Calif.

John Wood and Gayle Collins, IMS2023 General Chairs

John Zorzy & R. F. Muehlberger

Emmy Johnson

Joint Institute for VLBI in Europe

Joint Program Executive Office, Joint Tactical Radio System

Jon Bentley and Jerome Patoux, Analog Devices, Wilmington, Mass.

Jon Martens and Steve Reyes, Anritsu

Jon Martens and Tom Roberts, Anritsu Co., Morgan Hill, Calif.

Jon Martens, Anritsu Co., Morgan Hill, CA Jeffrey Hesler and Alex Arsenovic, Virginia Diodes Inc., Charlottesville, VA

Jon Martens, Anritsu Co., Morgan Hill, Calif.

Jonathan Chisum, University of Notre Dame, Notre Dame, Ind.

Jonathan Leitner, Menlo Micro, Irvine, Calif.

Jonathan Loo, University of Hertfordshire, Hertfordshire, U.K.

Jonathan Wells, AJIS Consulting

Jonathan Wells, AJIS LLC, San Francisco, CA

Jonathan Wells, Consultant

Jong-Hwan Lee and Kyung-Whan Yeom, Chungnam National University, Daejeon, Korea

Jonthan Wells

Joon-Won Jang and Hee-Yong Hwang

Jordan Mizerak, JETCOOL Technologies Inc., Littleton, Mass.

Jörg Köpp, Rohde & Schwarz, Munich, Germany

Jorge A. Ruiz-Cruz, Universidad Autónoma de Madrid; Chi Wang, Orbital Sciences Corp.; Kawthar A. Zaki, University of Maryland

Doug Jorgesen

José Luis Flores

Jose Moreira, Advantest, Boeblingen, Germany

Joseph Andrews, RFVCO

Joseph F. White, Consulting Editor (May 1979)

Joseph Merenda

Joseph R. Guerci

Joseph R. Jahoda

Josh Moore, Applied Wave Research Inc.

Josh Moore, AWR Corp.

Josh Raha and Mark Andrews, TriQuint Semiconductor

Josh Raha, TriQuint Semiconductor, Hillsboro, OR

Microwave Journal

Joy Laskar, General Chair, 2008 International Microwave Symposium

JQL Electronics

JQL Technologies

JS Mandeep, School of Electrical and Electronic Engineering, Universiti Sains Malaysia

Ju-Young Moon and Sang-Won Yun, Sogang University; Chang-Soo Ahn and Seon-Joo Kim, Agency for Defense Development

Juan Cordovez, James Victory, Samir Chaudhry, Volker Blaschke, Zhixin Yan, Robert Milkovits, Ivan Ban and Marco Racanelli, Jazz Semiconductor

Juan Cordovez, James Victory, Samir Chaudhry, Volker Blaschke, Zhixin Yan, Robert Milkovits, Ivan Ban, Grady Lyda and Marco Racanelli, Jazz Semiconduc

Juan Eusebio Garrido Arenas, Alberto Barcia Cancio and Jose Manuel Paez Borrallo

Juan L. Cano and Eduardo Artal, University of Cantabria, Santander, Spain

Juergen Hartung, Keysight Technologies, Santa Clara, CA

Julian Emmerich and Harald Rudolph KVG Quartz Crystal Technology GmbH, Neckarbischofsheim, Germany

Julian Emmerich and Harald Rudolph, KVG Quartz Crystal Technology GmbH, Neckarbischofsheim, Germany

Julie Declercq

Julie Teinert (julie@julieteinert.com) and Robyn Tinsley (robyn@tinsleypr.com)

Julie Teinert, Mimix Broadband

Julien Regoli, VP Operations, Maravedis Inc.

Jun Lee, Skyworks Solutions Inc., Irvine, CA

Jun Won Huh, Ik Soo Chang, Chul D. Kim

Jun-Bao Du, Lin Li and Xian-Chuang Su, Zhejiang Sci-Tech University, Hangzhou, China

Jun-Seok Park, Kookmin University

Junghyun Cho and Sungtek Kahng, Department of Information and Telecommunication Engineering, Incheon National University, Incheon, South Korea

Junil Choi, Pohang University of Science and Technology (POSTECH), Pohang, Gyeongbuk, Korea

Juniper Research

Junkosha USA Inc., Irvine, Calif.

Junkosha, Irvine, Calif.

Junkosha, Irvine, Calif.

Junying Liu, Dongjin Wang, Shengzhao Xiang, Weidong Wang and Sheng Zhang, University of Science and Technology of China, P.R. China

Jürgen Hartung; Cadence Design Systems Inc., Munich, Germany

Jussi Rahola and Jaakko Juntunen Optenni Ltd., Finland

Jussi Rahola and Jaakko Juntunen, Optenni Ltd., Finland

Justin Gallagher, Joseph A. Haimerl, Thomas Higgins and Matthew Gruber, Lockheed Martin MST, Moorestown, N.J.

Jwo-Shiun Sun

Jwo-Shiun Sun , Kwong-Kau Tiong and Jiann-Hwang Liu

Jwo-Shiun Sun and Guan-Yu Chen

Jwo-Shiun Sun and Jier-Chih Hsieh

Jwo-Shiun Sun and Yao-Liang Huang

Jwo-Shiun Sun, Ren-Hao Chen, Shao-kai Liu, and Cheng-Fu Yang

Jwo-Shiun Sun, Tsung-Lin Lee

K

K K Jain, Kirti Bansal, Meenakshi Aggarwal, B S Matheru

K. Narendra, Motorola Technology; E. Limiti and C. Paoloni, University of Roma Tor Vergata; V. Zhurbenko, Technical University Denmark

K. Narendra, Motorola Technology; M.F. Ain, J.S. Mandeep and S.I.S. Hassan, University Sains Malaysia

K. Rambabu, M. Ramesh and A.T. Kalghatgi

K. Singh and K. Ngachenchaiah, Semi-Conductor Laboratory Near Chandigarh, India, D. Bhatnagar, University of Rajasthan, Jaipur, India, S. Pal, ISRO Sa

K. Singh, V. Vinayakarohit, R. Ramasubramanian and S. Pal

K. Vaesen, A. Visweswaran, S. Sinha, A. Bourdoux, B. van Liempd and Piet Wambacq, imec, Leuven, Belgium

K. Werner and S. Theeuwen, NXP Semiconductors, Nijmegen, The Netherlands

K.A. Jose, Vasundara V. Varadan and Vijay K. Varadan

K.J. Cho, W.J. Kim and S.P. Stapleton, J.H. Kim, J.Y. Kim, B. Lee, J.J. Choi and J.C. Lee

K.V. Puglia

K.V. Puglia, Tyco Electronics

K.W. Kobayashi

K.W. Kobayashi A.K. Oki, A. Gutierrez-Aitken. J. Cowles, L.T. Tran, T.R. Block and D.C. Streit

K&L Microwave

K&L Microwave Inc., Salisbury, Md.

K&L Microwave, Salisbury, MD

Kaben Research

Kaben Wireless Silicon Inc.

Kae-Oh Sun and Hai Zhang, University of Wisconsin, Madison, Wis.

Kaelus (a Smiths Company), Centennial, CO

Kaelus, Hayden, Idaho

Kagan, of S&P Global Market Intelligence

Kaijun Song, Jia Yao, and Qian Li

Kaijun Song, Yu Zhu, Shunyong Hu, Fan Zhang, Maoyu Fan and Yong Fan, University of Electronic Science and Technology of China, Chengdu, China

Kailash Narayanan, Keysight Technologies, Santa Rosa, Calif.

Kaltman Creations

Kamaljeet Singh and K. Nagachenchaiah, Semiconductor Laboratory

Kamaljeet Singh and Surendra Pal, ISRO Satellite Center

Kamil Janeczek, Malgorzata Jakubowska, Grazyna Koziol and Wojciech Steplewski, Tele & Radio Research Institute

Kang Chen, Spirent Communications

Karin van Oort and Peter Hoogeboom, TNO Defence, Security and Safety

Karl B. Niclas and Michael Madera-Meza

Karl L. Kovach and Karen J. Van Dyke

Kassem Hamze1,2, Edouard De Ledinghen1, Daniel Pasquet2 and Philippe Descamps2; Normandie Universite1, Presto Engineering Europe2

Katerina Galitskaya, Kaelus, Finland

Katherine J. Herrick, Linda P.B. Katehi, Robert T. Kihm

Kathiravan Krishnamurthi and Stephen P. Jurgiel

Kathiravan Krishnamurthi, Zhiyang Liu and Ian Gresham, NXP Semiconductors, Billerica, MA

Kathleen Love

Kaue Morcelles and Brandon Malatest, Per Vices

Kawther Mekki and Ali Gharsallah, University of Tunis El Manar, Tunis, Tunisia

Kazimierz Siwiak, TimeDerivative Inc. and Ulrich L. Rohde, Informatics, Cybersecurity; Federal University of the Armed Forces of Germany

KCB Solutions

KDI/triangle Corp.

Ke Lu, Anokiwave

Ke Wu, IMS 2012 General Chairman

Ke-Li Wu and Gordon McDonald

Frank Kearney

Kefeng Liu, ETS-Lindgren, Cedar Park, TX

Keith Benson, Analog Devices Inc., Norwood, Mass.

Keith Howell and Ken Wong

Keith Moore and Frank Bashore

Keith Willetts, Chairman and CEO, TM Forum

Keith Willey

Keithley

Keithley Instruments

Keithley Instruments Inc.

Kelley Roche, Editorial & Media Specialist; Pat Hindle, Media Director & Eric Higham, Technical Editor

Kelley Roche, Staff Editor

Kellie Chong, RFMD, Greensboro, NC

Kelsey Ryon, Mercury Systems, Inc., Andover, Mass.

KEMET

KEMET Electronics GmbH

Ken Wieland

Ken Wieland, Telecommunications

Ken Wong, Conference Chair

Kendall S. Ching

Kendrick Struthers-Watson

Kendrick Struthers-Watson, Telecom Engine

Kenneth M. O’Hara and Gregory J. Skidmore, Remcom Inc., State College, Pa.

Kenneth M. O’Hara, Remcom Inc., State College, Pa.

Kenneth Stern

Kenneth Stern, Synxronos LLC

Kenny Gunderman, Chad Crank, & Ross Rucker

Kent K. Johnson, Agilent Technologies

Kent Nickerson, BlackBerry (MIPI Alliance Member), Canada

Kerri Germani, Staff Editor

Kerry Glover and Bror Peterson, Qorvo, Greensboro, N.C.

Kerry Z. Cai and Pengfei Zhang

Kevin Danehy and Mark Wolf

Kevin Gallagher, Qorvo, Chelmsford, Mass.

Kevin Harrington and Scott Vasquez, M/A-COM Technology Solutions, Lowell, MA

Kevin Hietpas, Fairview Microwave, Lewisville, Texas

Kevin Hietpas, Pasternack

Kevin Hietpas, Pasternack, Irvine, Calif.

Kevin Loutfy, Nano Materials International Corp., Tucson, Ariz

Kevin Mak and Asif Anwar, TechInsights, Milton Keynes, U.K.

Kevin Spencer, Crane Aerospace & Electronics, West Caldwell, NJ

Kevin W. Kobayashi

Kevin W. Kobayashi, Aaron K. Oki and Dwight C. Streit

Kevin Walsh and Jackie Johnson

Kevin Walsh and Jackie Johnson, RFMD

Keysight Technologies Inc., formerly Agilent Technologies electronic measurement business, Santa Rosa, Calif.

Keysight Technologies Inc., formerly Agilent Technologies electronic measurement business

Keysight Technologies Inc., formerly Agilent Technologies electronic measurement business, Santa Rosa, Calif.

Keysight Technologies Inc., Santa Rosa, Calif.

Keysight Technologies Inc., Santa Rosa, Calif.

Keysight Technologies, NI/AWR, ANSYS, COMSOL, CST, Delcross and Sonnet Software

Keysight Technologies, Santa Rosa, Calif.

Khaled Khalaf

Khanh Tuan Le

Khelifa Hettak and Malcolm G. Stubbs

Kim Tran and Richard Martin, Qorvo Inc., Richardson, Texas

Kirti Bansal, K.K. Jain, B.S. Matheru and U.C. Ray, Solid State Physics Laboratory, Delhi, India

Klaus Krohne, Computer Simulation Technology, Darmstadt, Germany

Klaus Werner, RF Energy Alliance

Klaus-Dietmar Muller

KMW USA Inc., Fullerton, CA

Knowles Capacitors

Knowles Capacitors, Norwich, U.K.

Knowles Corp.

Knowles Precision Devices

KOA Speer Electronics

Koch Industries Inc.

Kohei Fujii and Henrik Morkner, Avago Technologies

Kohei Fujii, John Stanback, and Henrik Morkner - Avago

Kohei Fujii, John Stanback, and Henrik Morkner - Avago Technologies

Kohei Fujii, John Stanback, and Henrik Morkner, Avago Technologies

Kokulathasan Thalayasingam and Holger Heuermann, Heuermann HF-Technik GmbHAachen, Germany

Henri Komrij, Agilent Technologies

KOR Electronics

KP Performance Antennas Edmonton, Alberta, Canada

KPMG LLP

KR Electronics Inc.

Kratos Defense & Security Solutions Inc.

Krešimir Malaric

Kristen Anderson

Kristen Anderson, Marketing and Event Coordinator

Kristen Anderson, Microwave Journal

Kristi Pance and Gianni Taraschi, Rogers Corporation

Kristian Lotz, Kim Vienberg and Jesper Trier, Combilent A/S, Alleroed, Denmark

Kristoffer Andersson, David Gustafsson and Jonas Hansryd, Ericsson, Gothenburg, Sweden

KRYTAR Inc., Sunnyvale, Calif.

Kuhne Electronic GmbH, Berg, Germany

Kumar Narendra & Sangaran Pragash, Motorola Technology, Penang, Malaysia; Lokesh Anand, M.F. Ain & S.I.S. Hassan, University of Science Malaysia

Kumar Narendra, Sangaran Pragash and Chacko Prakash, Motorola Technology; Lokesh Anand, M.F. Ain and S.I.S. Hassan, University Science Malaysia

Kwangjin Koh and Gabriel M. Rebeiz University of California at San Diego

Kyle Labowski, Christopher Penney and James F. Stack, Jr., Remcom Inc., State College, PA

Kyle Morgan, Sperry, Mitchell & Company, New York, N.Y.

Kymeta

Kymeta

Kyocera America

Kyocera America Inc.

Kyoung-Joon Cho and Wan-Jong Kim, Dali Wireless; Ji-Yeon Kim and Jong-Heon Kim, Kwangwoon University; Shawn P. Stapleton, Simon Fraser University

Kyu-Ho Park, Hee-Seok Song, Young-Shin Lee, and Yong-Chae Jeong

Kyungseok Kahng, Sungtek Kahng and Inkyu Yang, Incheon National University; Qun Wu Harbin Institute of Technology

L

L-3 Communications

L-3 Electron Devices, San Carlos, Calif.

L-3 Electron Technologies Inc.

L-3 Global Connectivity

L-3 Southern California Microwave

L-3 Telemetry & RF Products

L-3 Telemetry-East

L-3 Telemetry-West

L-3 TRL Technology

L-3 WESCAM

L-com

L-com Inc., North Andover, Mass.

L. Chen, Y. Shang and Y.L. Zhang, Xi’an Technological University, Xi’an, P.R. China; F. Wei, Xidian University, Xi’an, P.R. China

L. Devlin, A. Dearn, G. Pearson and T. Richards, Plextek Ltd., Great Chesterford, UK

L. Dunleavy, W. Clausen and T. Weller

L. Durand, L. Duchesne, L.J. Foged, Reuven Konevky, Lior Shmidov: SATIMO & ORBIT/FR

L.V. Kasatkin and N.F. Karushkin

Labtech Microwave

Ladybug Technologies LLC

LadyBug Technologies LLC

LadyBug Technologies, Boise, Idaho

LadyBug Technologies, Santa Rosa, CA

Laird R&F Products

Laird Technologies

Laird Technologies Inc.

Laird Thermal Systems

Lake Shore Cryotronics

Lake Shore Cryotronics

Lambert Devoe and Alan Devoe

Lamberto Raffaelli

Lamhroe

Lamin Zhan, Kun Li and Guoan Wu, Huazhong University of Science and Technology, Wuhan, China

Lamin Zhan, Yang Pei, Zuwei Li and Wenguang Li, Huazhong University of Science and Technology, Wuhan, China

Lamina Ceramics

Lance Doherty, Jonathan Simon and Thomas Watteyne, Dust Networks Product Group, Linear Technology Corp., Milpitas, CA

Langer EMV-Technik GmbH, Bannewitz, Germany

Lantiq and T-Venture

Alex D. Lapidus, L-3 Communications

Lark Engineering

Larry Dunleavy and Chris DeMartino, Modelithics Inc., Tampa, Fla.

Larry Dunleavy and Hugo Morales, Modelithics Inc.; Charles Suckling and Kim Tran, Qorvo Inc.

Larry Dunleavy, IMS 2014 Chair; Tom Weller, IMS 2014 Vice-Chair

Larry Dunleavy(1,2), The University of South Florida(1), Tampa, Fla.

Larry Giacoletto

Laser Services

Laser Services

Laser Services

Laser Services

Laser Services

Guang Yang, Wei Liu and Falin Liu, University of Science and Technology of China Last

Anritsu Corp. Microwave Measurement Division (MDD) Last

MVG (Satimo) Industries Last

Guzik Technical Enterprises Last

Laura Borgstede, Calysto Communications

Laura Casasanto, Staff Editor, Microwave Journal

Laurent Desclos, Ethertronics, Inc.

Lawrence (“Larry”) Dunleavy

Lawrence Kushner, RFIC 2014 General Chair; Bertan Bakkaloglu, TPC Co-Chair; Albert Wang, TPC Co-Chair

Lawrence P. Dunleavy, Modelithics Inc.

Lawrence P. Dunleavy, Thomas M. Weller, Paul G. Flikkema, Horace C. Gordon, Jr. and Rudolph E. Henning

Lawrence Williams, Matthew Commens and Steve Rousselle, ANSYS Inc.

Lawrence Wilson, Rohde & Schwarz, Munich, Germany

Leader Tech

LeCroy Corp.

LeddarTech and IDT

Ledezma (USF), Weller (Modelithics), Robin (Motorola)

Legacy Technologies Inc.

Lei Xin, Kaiyuan Cao and Xiaoqing Yang, Sichuan University, Chengdu, China

Lei Xu, Guohua Liu and Han Feng, Hangzhou Dianzi University, Hangzhou, China

Leif Jensen, TopSil Global Wafers A/S, Frederikssund, Denmark

Lemko Corp.

Len Crane, Coilcraft

Lennart Berlin, Saab Aerodefense, Stockholm, Sweden

Lenovo

Lenthor Engineering

Leo G. Maloratsky

Leo G. Maloratsky, Aerospace Electronics Co.

Leo G. Maloratsky, Aerospace Electronics Co., Indialantic FL

Leo G. Maloratsky, Rockwell Collins

Leo G. Maloratsky, Rockwell Collins; Simon Y. London, Advanced Power Technologies Inc.

Leo Gumina

Leo Sennott

Leo Sennott

Leonard Pelletier, Freescale Semiconductor

Leonardo

Leonardo DRS

Leonardo MW Ltd.

Leonardo-Finmeccanica

Leondard Hayden and Brett Grossman, ARFTG Conference Co-Chairs

Leonhard Sturm-Rogon, Robert Wieland and Wilfried Lerch, Fraunhofer EMFT, Munich, Germany

Leopold E. Pellon, Otava Inc., Moorestown, N.J.

Les Besser

Les Crane, Coilcraft

Leti

Li Zhao, Jian-Yi Zhou, Wen-Wen Yang, Zhi-Qiang Yu and Li-Na Cao, Southeast University, Nanjing, China

Yong-Qing Leng, Yun Zeng, Guo-Liang Zhang and Wei Peng, Hunan University, Changsha, China Li-Jun Zhang, Ya-Tao Peng, Jin Guan, Hui Lu and Zhan-Qi Zheng, Institute of Microelectronics Chinese Academy of Sciences, Beijing, China

Li-Li Yang, Lin Li, Ting Lang, Zhi-Hao Zhang and Kai-Yu Zhao, Zhejiang Sci-Tech University, Hangzhou, China

Liam Devlin, Plextek RF Integration, Great Chesterford, UK

Liang Han, Ke Wu, Xiao-Ping Chen and Fanfan He, École Polytechnique de Montréal, Montreal, Canada

Liang Jia, University of Electronic Science and Technology of China, Chengdu, China

Liang Ma, Jianyi Zhou and Weichen Huang, Southeast University, Nanjing, China

Liang-Hui Li and Huey-Ru Chuang, National Cheng Kung University

Lianqing Ji, Zhiming Xu, Jianyi Zhou and Jianfeng Zhai, Southeast University, Nanjing, Jiangsu, China

Lianwu Yang and Ying Li, Yichun University, Yichun, China

LightSquared

Lijun Zhang, (1) Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China

Lily Geller, Tufts University, Medford, Mass.

Lime Microsystems

Yijun Lin

Lin Lin and Kevin Loughran, Jabil Circuits, Inc., Warren, N.J.

Lin Qiang, Zhang Zu Ying and Guo Wei; Air Force Radar Academy and Huazhong University of Science and Technology

Lin Sun

Lin-Sheng Liu, University of Electronic Science and Technology of China, Chengdu, China

Lina Schmidt, SSB-Electronic GmbH, Lippstadt, Germany

Linear Technology

Linear Technology Corp.

Linear Technology Corp., Milpitas, Calif.

Linear Technology, Milpitas, CA

Linearizer Technology Inc.

LingXia Wang Xidian University, Shaanxi, China HaoJia Lin China Academy of Space Technology, Shaanxi, China

Link Labs

Link Microtek

Link Microtek, Basingstoke, UK

Linli Xie, Yong Hong Zhang and Yong Fan, University of Electronic Science and Technology of China, Chengdu, China

Linwave Electronic Manufacturing Services

Linwave Technology, Lincoln, UK

Linx Technologies

Lise Proust

Litron

Guohua Liu

LNX Corp.

LNX Corp. Salem, NH

Lockard & White

Lockheed Martin

Lockheed Martin Aeronautics

Lockheed Martin Corporation

Locus Microwave Inc., Boalsburg, PA

Locus Microwave, Boalsburg, PA

Lorch Microwave

Loren Betts, Agilent Technologies and Dylan T. Bespalko and Slim Boumaiza, University of Waterloo, Canada

Loren Betts, Agilent Technologies Inc., Santa Clara, CA

Lorenz-Peter Schmidt, General Chairman; Charles Ayotte, Horizon House Publications Inc.

Lorne Graves, Mercury Systems Inc., Chelmsford, Mass.

Los Angeles Air Force Base

Louis Fan Fei, Garmin International

LPKF

LPKF Laser & Electronics

LPKF Laser & Electronics AG, Garbsen, Germany

LPKF Laser & Electronics AG, Garbsen, Germany

LPKF Laser & Electronics, USA

LPRS

Luca Galatro and Raffaele Romano, Vertigo Technologies, The Netherlands

Luca Galatro, Vertigo Technologies, Delft, The Netherlands

Luca Perregrini, EuMW General Chair, University of Pavia, Italy

Luca Stroppolo, Ericsson NSI, Rome, Italy

Lucent Technologies Inc.

Lucia David, Selex Systemi Integrati, Rome, Italy

Luciano Tarricone, EuMW General Co-chair, University of Salento, Italy

Lucix Corp.

Lucy Berridge, Stephen Stones, Peter Kingsland, Tania Harvey and Ross Parsons

Luke Getto, Microlab

LUMILOOP

Luo Xiaobin, Guo Dechun, Yu Weihua, Lv Xin, Beijing Institute of Technology, Beijing, China

Luso Electronics

Lute Maleki, OEwaves, Pasadena, CA

Lutz Wunderlich, Michael Wleklinski, Thorsten Liebig and Simona Bruni, IMST GmbH, Kamp-Lintfort, Germany

Lynk & Co.

LYNX

M

M Wave Design Corporation

M-Wave Design Corp., Simi Valley, Calif.

M. ABRI, N. BOUKLI-HACENE AND F.T. BENDIMERAD, Université Abou Bekr Belkaïd, Tlemcen, Algeria; E. CAMBIAGGIO, Université de Nice – Sophia Antipolis, V

M. Conte, University of Massachusetts, Amherst, Mass.

M. Fujimoto

M. Gurumurthy and M. McKernan, Spirent Communications

M. Hagensen, Guided Wave Technology ApS, Hilleroed, Denmark

M. Ibrahim Khalil, Armin Liero, Andreas von Müller and Thomas Hoffmann

M. Imran Cheema, Andrew Kirk McGill University

M. Kameche, and N.V. Drozdovski; National Centre of Space Techniques and ETEC

M. Kameche, M. Feham

M. Mathian, E. Korolkewicz, P. Gale and E.G. Lim

M. McKeown, Hesse-Mechatronics, Inc., Paderborn, Germany

M. Obrien

M. Oldoni, S. Moscato, G. Biscevic and G. Solazzi, SIAE Microelettronica, Milan, Italy

M. Oldoni, S. Moscato, G. Biscevic, G.L. Solazzi and G. Skiadas, SIAE MICROELETTRONICA, Milan, Italy

M. Oldoni, S. Moscato, G. Biscevic, G.L. Solazzi, SIAE MICROELETTRONICA, Milan, Italy and G. Skiadas, COSMOTE, Athens, Greece

M. Palandöken, Gediz University; A. Sondas, Kocaeli University

M. Perotoni and L.A. de Andrade, CST AGl; M.C. Rezende and H. Vieira, Jr., IAE Space and Aeronautic Institute

M. Rack, L. Nyssens and J. P. Raskin, ICTEAM, Université Catholique de Louvain, Louvain-la-Neuve, Belgium

M. Sypek, M. Makowski, Orteh SP. Z.O.O.; C. Martel, T. Crepin, F. Boust, Office National d'Etudes et de Recherches Aerospatiales

M. Wajih Elsallal, Jamie Hood and Ian McMichael, The MITRE Corporation, Bedford, Mass.; Travis Busbee, Voxel8, Somerville, Mass.

M. Weber, University of Oklahoma/National Oceanic and Atmospheric Administration, Norman, Okla.

M.B.I. Reaz, National University of MalaysiaSelangor, Malaysia; J. Uddin, S. Hussain, A.N. Nordin and M.I. Ibrahimy, International Islamic University

M.D. Brunsman, TriQuint Semiconductor, Hillsboro, OR

M.F. Ain, J.S. Mandeep, C.T. Chin, S.I.S. Hassan M.A.Othman and B.M. Nawang

M.J. Poulton, K. Krishnamurthy, J. Martin, B. Landberg, R. Vetury and D. Aichele, RF Micro Devices

M.N. Zybin, JSC Pluton, Moscow, Russia

M.O'Brien

M.P.R. Panicker, D. Douriet, M.S. Hyslop and N.L. Greenman

M.S. Muha, C.J. Clark, A.A. Moulthrop and C.P. Silva

M/A-COM Inc.

M/A-COM Inc., a Tyco Electronics company Roanoke, VA

M/A-COM Tech

M/A-COM Tech Asia

M/A-COM Tech Asia; Taiwan, ROC

M/A-COM Technology

M/A-COM Technology Solutions

M/A-COM Technology Solutions and Mimix Broadband

M/A-COM Technology Solutions Inc.

M/A-COM/Mesuro

M2 Global

M2 Global Technology Ltd.

M2 Global Technology Ltd.

MACOM

MACOM

MACOM Technology Solutions Inc.

Joe Madden

Madhu Gurumurthy, Spirent Communications

Madrone Coopwood and Jason Yoho, HYPERLABS Inc., Beaverton, Ore.

MagCap Engineering Inc.

Magdalena Salazar Palma and José Ignacio Alonso Montes, EuMW 2018 General Chair and General Co-Chair

Magfusion Inc.

MagnaChip Semiconductor Corp. and Peregrine Semiconductor Corp

MAGUS (Pty) Ltd

Magus (Pty) Ltd., Stellenbosch, South Africa

MAGUS, CST and EMSS

MAJ Staff

Maja Systems

Majid Razavi-Rad, Changiz Ghobadi, Javad Nourinia and Reza Zaker, Urmia University, Urmia, Iran

Malcolm Edwards, AWR Corp.

Man Ho Tsoi, Research and Development Office, The Education University of Hong Kong

Man Seok Uhm and In Bok Yom, ETRI, Daejeon, Korea; Juseop Lee, University of Michigan, Ann Arbor, MI; Jeong Phill Kim, Chung-Ang University, Seoul, Ko

Manish Shah, Tagore Technology Inc., Arlington Heights, Ill.

Manny Assurian, Ray Hashemi and Jim Assurian Reactel Inc.

Manny Assurian, Ray Hashemi and Jim Assurian, Reactel Inc.

Mano Vafai, WiMAX Forum® Application Architecture

Manos M. Tentzeris, Rushi Vyas, Vasileios Lakafosis, Taoran Le, Amin Rida and Sangkil Kim School of ECE, Georgia Tech, Atlanta, GA

Manos Tentzeris, Technical Program Chair

Manuel del Castillo and Henry Valenzuela

Mao Tian

Maravedis

Marc Faucher, V-Micro SAS, Villeneuve d’Ascq, France, Univ. Lille, CNRS, Centrale Lille, Univ. Polytechnique Hauts-de-France, Lille, France

Marc Frechette, Marketing Communications, Micronetics

Marc Llamas, Nanusens, Devon, UK

Marc Stackler, Teledyne e2v, Hong Kong

Marc Vanden Bossche and David Vye, National Instruments, Austin, Texas

Marcel Kossel, Hansruedi Benedickter, Werner Bachtold, Roland King and Jan Hansen

Marco Pasian, University of Pavia, Pavia, Italy

Marco Spirito and Jeffrey Jargon, ARFTG 2023 Chairs

Marco Spirito, Basim Noori, Jeffrey Jargon and Jon Martens, ARFTG General Chairs

Marco Spirito, Jeffrey Jargon Jon Martens and Dennis Lewis, ARFTG 2023 Chairs Tech Program Chairs

Marconi Applied Technologies

Marconi Instruments Inc.

Marcus da Silva, Tektronix Inc.

Marcus Dasliva

Marinus (Ron) Korber, Jr.

Mario LaMarche, Mercury Systems, San Jose, Calif.

Mario Narduzzi, Keysight Technologies, Santa Rosa, Calif.

Marjan Grman, Iskra Sistemi

Mark Andres and Heatherly Bucher, Arena Solutions, Foster City, Calif.

Mark Bailly, EMC Technology, Stuart, FL

Mark Chapman, WiSpry Inc., Irvine, CA

Mark Elo Director, RF Products Keithley Instruments, Inc.

Mark Elo, Director, RF Products, Keithley Instruments

Mark Elo, Keithley Instruments

Mark Elo, Marketing Director of RF Products, Keithley Instruments

Mark Elo, Tabor Electronics, Nesher, Israel

Mark Elo, Tabor Electronics, Nesher, Israel

Mark Elo, Tektronix

Mark Fitzgerald, TechInsights, Needham, Mass.

Mark Hickle, BAE Systems, Nashua, N.H.

Mark Lombardi, RT Logic, Colorado Springs, CO

Mark Pierpoint, Keysight Technologies, Santa Rosa, Calif.; Gabriel M. Rebeiz, University of California, San Diego, Calif.

Mark R. Simpson and John M. Dixon

Mark Ravenstahl

Mark Roos, Roos Instruments, Santa Clara, Calif.

Mark Saffian - Soultion Architect, AWR Corp.

Mark Slovick

Mark Walker, Cobham Advanced Electronic Solutions, Arlington, Va.

Mark Winebrand and John Aubin, ORBIT/FR Inc.

Mark Winebrand, John Aubin and Russell Soerens, ORBIT/FR Inc.

Market Research Reports Inc.

MarketsandMarkets

Chris Marki

Marki Microwave Inc., Morgan Hill, Calif.

Marki Microwave, Morgan Hill, Calif.

Marko Marin, Infinera

Markus Kopp, ANSYS Corp., Canonsburg, PA, and Juliano Fujioka Mologni, ESSS, Brazil

Markus Zeier, Federal Institute of Metrology (METAS), Berne-Wabern, Switzerland

Marta Cabedo-Fabrés and Miguel Ferrando-Bataller, Iteam, Universitat Politècnica de València, València, Spain

Marta Iglesias

Marta Iglesias-Xamani

Marten Seth, Jeff Harth and Jonathan Leitner, Menlo Microsystems, Inc., Irvine, Calif.

Martha Zemede, Agilent Technologies, Santa Clara, CA

Martin Coleman, The Satellite Interference Reduction Group (sIRG), Douglas, Isle of Man, UK

Martin J. Salter and Nick M. Ridler, National Physical Laboratory, Teddington, Middlesex, UK

Martin Moder and Joachim Schubert, Rosenberger, Fridolfing, Germany

Martin Schmaehling, Rohde & Schwarz, Munich, Germany

Martin Timm

Marvell

Marvin Test Solutions Inc.

Mary Anne Tupta, Keithley Instruments

Maryam Rofougaran, CEO, Movandi

Masashi Nogawa,, Sr. Member of Technical Staff, Qorvo

Masashi Nogawa,, Sr. Member of Technical Staff, Qorvo

Masashi Nogawa,, Sr. Member of Technical Staff, Qorvo

Massachusetts Bay Technologies

Massachusetts Institute of Technology

Master Bond Inc.

Matajaz Vidmar

Mathew Hubbard, RFMD

MathWorks

Matjaz Vidmar

Matjaz Vidmar, University of Ljubljana

Matt Landry (@mattmatter), Vice President, Matter Communications

Matt Miller, Co-Owner & Principal RF Engineer II, EMA

Matt Morgan and Tod Boyd, National Radio Astronomy Observatory, Charlottesville, Va.

Matt Ozalas, Keysight Technologies Inc., Santa Rosa, Calif.

Matt Spexarth, National Instruments, Austin, Texas

Matteo Oldoni, Dipartimento di Elettronica, Informazione e Bioingegneria, Politecnico Di Milano, Milan, Italy

Matthew Funaiole, Brian Hart and Aidan Powers-Riggs, Center for Strategic and International Studies, Washington, D.C.

Matthew J. Maxwell, Tektronix Inc.

Matthew Morgan and Sander Weinreb, National Radio Astronomy Observatory, Jet Propulsion Laboratory

Matthew S. Clements, Department of Electrical and Computer Engineering, University of California, Davis, Calif.

Mauna Kea Semiconductors (MKSemi), San Jose, Calif.

Mauro Marchetti, Anteverta Microwave B.V. Delft, The Netherlands

Maury Microwave

Maury Microwave Corp., Ontario, Calif.

Maury Microwave Corp., Ontario, Calif.

Maury Microwave, Ontario, Calif.

Maxim Integrated Products Inc.

Maxim Integrated, San Jose, Calif.

MaxLinear Inc.

MAXRAD Inc.

Maxtek Components Corp.

MBDA

John McClurg

MCE-KDI Integrated Products

MCE/KDI Integrated Products

MCV Microwave, Laurel, Del.

MCV Microwave, San Diego, Calif.

Mearthane Products Corporation

MECA Electronics Inc., Denville, N.J.

MECA Electronics, Denville, N.J.

Meg Tredinnick and David Malanga

MegaPhase

MegaPhase LLC

MegaPhase, Stroudsburg, Pa.

MegiQ

Mehdi Nosrati, Islamic Azad University (IAU), Ilam Branch, Iran, Mojgan Daneshmand, University of Alberta, Edmonton, Alberta, Canada

Mehran Mossammaparast, Patrick Mullin, Nikki Quinn and Mike Sawicki, Quantic Wenzel, Austin, Texas

Meir Bartur, Optical Zonu, Van Nuys, Calif.

Melissa Cortez, MegaPhase, Stroudsburg, PA

Meller Optics Inc.

MEM Research

Mendy Ouzillou, Scintera; Arwyn Roberts, TriQuint Semiconductor

Mendy Ouzillou, Silicon Labs, Austin, Texas; Ross Yu, Linear Technology Corp. (Dust Networks Group), Milpitas, Calif.

Meng-Chung Tsai, Huey-Ru Chuang

Menlo Micro, Irvine, Calif.

Menlo Microsystems, Inc. Irvine, Calif.

Mentor Graphics

Mentor Graphics Corp., Wilsonville, Ore.

Mercury

Mercury Computer Systems Inc.

Mercury Systems Inc., Andover, Mass.

Meridian Medical Systems

Merrimac Industries Inc.

Mesa Microwave Corp.

MESL Microwave

MESL Microwave/Link Microtek

Messe München GmbH

Messe München International India Pvt. Ltd.

Mesuro

Mesuro Ltd.

MET Laboratories

Metal Processing Co. Inc

Metallized Carbon Corporation

Metawave

Metrigraphics

MFG Galileo Composites

MI Technologies

Mi-Young Lee, Chan-Young Jeong, Jae-Woo Park, Changsik Yoo, Hanyang University, Seoul, Korea; Jin-Soo Park, Samsung Advanced Institute of Technology,

Mic

MIcable

MIcable Inc.

Michael

Michael Ashman and Inder Bahl, M/A-COM Inc. Roanoke, VA

Michael Case

Michael Casper, President/CEO UltraSource, Inc.

Michael Casper, President/CEO, UltraSource Inc.

Michael D. Foegelle, ETS-Lindgren

Michael D. Foegelle, ETS-Lindgren, L.P.

Mark W. Ingalls, Machine2Wireless LLC, Fayetteville, Ark.; Michael D. Glover, University of Arkansas, Fayetteville, Ark.; Ed Liang, MCV Microwave Inc., San Diego, Calif.

Michael D. Hillbun, Diamond Engineering

Michael D. McKinley and Kate A. Remley, National Inst. of Standards and Technology, Boulder, CO; Maciej Myslinski, Katholieke Universiteit, Leuven, Be

Michael Heimlich, Applide Wave Research Inc.

Michael Heimlich, Macquarie University and Joseph Gering, RFMD

Michael Hiebel

Michael Hiebel, Rohde & Schwarz

Michael Hopkins, CurrentRF, Discovery Bay, CA

Michael J. Hannon and Pat Malloy

Michael J. Marcus

Michael Keeley, Spirent Communications

Michael Kettner, Patrick Biebersmith, Nelson Roldan and Balram K. Sharma

Michael Knox, Mode 1 Corp. Ben Zarlingo, Agilent Technologies

Michael Lawton and Peter Cain, Agilent Technologies Inc., Santa Clara, CA

Michael Millhaem

Michael O'Brien

Michael Oberle, Schmid & Partner Engineering AG Zurich, Switzerland

Michael Obrien

Michael Parnes

Michael Puttre

Michael Redding, Quantropi, Ottawa, Canada

Michael S. Heutmaker

Michael Sieber and Attila Simon, European Defence Agency (EDA)

Michael Weizmann

Michael Wohlert, Sang-Kyo Shin and Xiang Feng, Keysight Technologies

Michal Fiszer and Jerzy Gruszczynski

Michal Fiszer, Collegium Civitas, Warsaw, Poland

Michal Grabowski

Michal Odyniec

Michel M. Bègue, Agilent Technologies Inc.

Mician GmbH

Mician GmbH, Bremen, Germany

Mician, Bremen, Germany

Mickael Viot, Alexis Bizalion and Jervais Seegars, Qorvo, Greensboro, N.C.

MiCOM Labs Inc.

Micralyne Inc.

Micro Crystal

Micro Harmonics, Fincastle, Va.

Micro Harmonics, Fincastle, Va.

Micro Lambda Inc.

Micro Lambda Wireless Inc.

Micro Lambda Wireless Inc., Fremont, CA

Micro Metalsmiths Ltd.

Micro Modular Technologies

Micro Systems Inc.

Micro-Ant Inc.

Micro-Coax

Micro-Coax, Pottstown, Pa.

Micro-Precision Technlogies Inc. (MPT)

Micro-Precision Technologies Inc.

Micro-Precision Technologies Inc. (MPT)

Microchip, Chandler, AZ

Microlab

Microlab/FXR

Microlease

Micromanipulator Co.

Micron Technology Inc.

Micronetics

Micronetics Inc.

microRF Europe

Microsanj LLC, Santa Clara, Calif.

Microsemi

Microsemi Corp., Aliso Viejo, Calif.

Microsemi Corp.

Microsemi Corp. and Advanced Power Technology Inc.

Microsemi Corporation

Microsoft Corp.

Microsource Inc.

Microwave Components and Systems

Microwave dB

Microwave Development Labs

Microwave Dynamics

Microwave Flash

Microwave Hournal

Microwave Innovation Group

Microwave Innovation Group (MIG)

Microwave Innovation Group GmbH & Co. KG

Microwave Jounal

Microwave Jounral

Microwave Journal

Microwave Journal

Microwave Journal China

Microwave Journal Staff

Microwave Marketing Ltd./Linwave Technology

Microwave Solutions Inc.

Microwave Staff

Microwave Techniques

Microwave Techniques

MicroWave Technology Inc. (MwT)

MicroWave Technology Inc., Fremont, Calif.

Microwave Theory and Techniques Society

Microwave Vision

Microwave Vision Group (MVG)

Microwave Vision Group (MVG)

Microwave Vision Group (MVG), Kennesaw, Ga.

Microwave Vision Group, ORBIT/FR Inc.

Microwave Vision Group, ORBIT/FR, Horsham, PA

Microwave Vision Group, Paris, France

Microwwave Journal Staff

Micrwoave Journal

Miguel Á. García-Fernández, EMITE Ingeniería S.L. and David A. Sánchez-Hernández, Universidad Politécnica de Cartagena

Mike

Mike Donovan, MathWorks, Natick, Mass.; Andrei Cozma and Di Pu, Analog Devices Inc., Norwood, Mass.

Mike Geen, Filtronic, U.K.

Mike Greenelsh

Mike Heimlich, AWR Corp.

Mike Jones and Peter Delos, Analog Devices Inc., Norwood, Mass.

Mike Jones, Principal Electrical Design Engineer, Analog Devices Inc.

Mike Kappes, IQ-Analog Corporation, San Diego, Calif.

Mike Lincoln

Mike Lincoln, TriQuint Semiconductor Product Marketing

Mike McLernon, MathWorks, Natick, Mass.

Mike Millhaem, Michel Gagne, Greg Jue, Jin-Biao Xu, Jean-Marc Moreau, Keysight Technologies, Santa Rosa, Calif.

Mike O'Brien

Mike Obrien

Mike Roberts, Slipstream Engineering Design Ltd., Shipley, U.K.

Mike Santori, National Instruments; Jean Dassonville and Phil Lorch, Agilent Technologies; and Dave Hutton, Aeroflex

Mike Scarione, Nick Kolias, Michael Booen, Raytheon Co.; David McLaughlin, University of Massachusetts; M.C. Frank Chang, University of California at

Mike Seibel and Brian Denheyer, NI, Austin, Texas

Mike Violette

MILCOM

MILCOM 2009

MilesTek, Lewisville, Texas

Millennium Research Group

MilliBox, San Jose, Calif.

MilliLabs

MilliLabs brings innovative Wireless Channel Emulator to millimeters wave networks for new network generation, SG New Radio and Connected Vehicles.

Millitech Inc.

Milliwave Silicon Solutions Inc., San Jose, Calif.

Milliwave Silicon Solutions, Inc.

MILMEGA

MILMEGA Ltd.

MilSatCom USA

Mimix

Mimix Asia

Mimix Broadband

Mimix Broadband Inc.

Mimix Broadband Inc., Houston, TX

Mimix Broadband, Houston, TX

Mimix Broadband, Inc.

mimoOn

MIMOon GmbH

Mimosa Networks, Inc.

MIMOtech

Min Liu, Deyong Wang, Panpan Zhang, Xuefeng Hou and Jincan Zhang Henan University of Science and Technology Luoyang 471023, China

Mindspeed

Minh-Chau Huynh and Warren Stutzman, Virginia Tech Antenna Group

Mini-Circuits

Mini-Circuits

Mini-Circuits, Brooklyn, N.Y.

Mini-Circuits, Brooklyn, N.Y.

Mini-Circuits, Brooklyn, N.Y.

Mini-Circuits, Brooklyn, NY

MiniRF Inc., Fremont, Calif.

MIPI Alliance

Mirin Lew

Mirin Lew, Agilent Technologies

Mirza Shujaur Rahman, MarketandMarkets, Pune, India

Mission Microwave

Mission Microwave

MIT News Office

Mitchell Lazarus

Mitel Networks Corporation

MITEQ

MITEQ Inc.

MITEQ Inc., Hauppauge, NY

Mitron, Fuzhou, China

Mitsubishi Electric Corporation, Tokyo, Japan

MixComm, Inc., Chatham, N.J.

Mixed Signal Integration (MSI)

mmTron

mmTron Inc., Redwood City, Calif.

Mobile Experts

Mobile World Live

MoD Australia

Modelithics

Modelithics and Taconic

Modelithics Inc. and Dielectric Laboratories Inc.

Modelithics Inc., Tampa, Fla.

Mohamed Kameche, Centre National des Techniques Spatiales (CNTS), Algeria

Mohamed Sanad and Noha Hassan

Mohamed Sanad and Noha Hassan, Cairo University, Giza, Egypt

Mohamed Sanad, Amant-Antennas, Giza, Egypt; Noha Hassan, Cairo University, Cairo, Egypt

Mohamed Sayed, 83rd ARFTG General Chair

Mohamed Sayed, ARFTG Conference Chair

Mohammad A. Saed, Department of Electrical and computer Engineering of Texas Tech University

Mohammad Fairouz, TelecommunicationandNavigationInstitute, Kuwait

Mohammad H. Haroun EDST, Lebanese University, Beirut, Lebanon, Iteam, Universitat Politècnica de València, València, Spain

Mohammad Madihian, General Chairman, 2007 Radio and Wireless Symposium

Mohammad Reza Dehghani, Ahmed H. Akgiray, Arshad Mehmood and Onur Hamza Karabey, ALCAN Systems, Darmstadt, Germany

Mohammed R. Alshareef, National Center for MEMS Technology, King Abdulaziz City for Science and Technology, Riyadh, Saudi Arabia

Mohammed Salhi, Thomas Kleine-Ostmann and Thorsten Schrader, Physikalisch-Technische Bundesanstalt (PTB), Germany

Mohammed Tahir, Stuart Glynn, Liam Devlin, Andy Dearn and Graham Pearson, Plextek RFI, Great Chesterford, Saffron Walden, U.K.

Mohsen Hayati and Azadeh Khajavi Razi University, Kermanshah, Iran

Mohsen Hayati, Razi University; Parisa Karami Moghadam, Islamic Azad University

Mohsen Hayati, Sohrab Majidifar and Omid Sadeghi Fathabadi, Razi University

Molex

Molex Inc.

Molly Heyward, Strand Marketing

Monica Paolini, Senza Fili Consulting

Monika Roth, press@rohde-schwarz.com

Moray Rumney

Moray Rumney, Agilent Technologies

Moray Rumney, Agilent Technologies Inc.

Moray Rumney, Keysight Technologies, Edinburgh, Scotland

Morgan Advanced Materials

Morion US, LLC, San Jose, Calif.

Morris Engelson

Morris Engleson and Len Garrett

Morten Hagensen, Guided Wave Technology ApS, Hilleroed, Denmark

Morten Hagensen, Guided Wave Technology ApS, Hilleroed, Denmark, Anders Edquist, ANSYS Inc., Canonsburg, PA

Moscow Smart City Lab

MOSIS

Motorola

Motorola Inc.

Motorola Semiconducteurs S.A.S.

Mouloud Ayad, Department of Telecommunications, University of Setif, Algeria

Mouqun Dong, California Eastern Laboratories, Santa Clara, Calif.

MPI Corp & Rohde & Schwarz

MPI Corporation

MRCM GmbH

MSC Vertriebs/Micro Crystal AG

MTI-Milliren Technologies Inc.

MtronPTI

Mu’ath Al-Hasan, Al Ain University, Abu Dhabi, UAE

Muddaser Mohiyuddin, Rathna Kumar M, Jacob Mathew, Puneet Kumar Pandey, ISRO Satellite Centre

Muhammad Tahir

Multigig

Munkyo Seo, Joo-Yeol Lee, Kyung-Kuk Lee and Sangwook Nam

Murari Shaw, Institute of Engineering and Management

Murari Shaw, Institute of Engineering and Management, West Bengal, India

Murat Eron, Wireless Telecom Group

Murata

Murata Electronics North America

Murata Electronics North America Inc.

Murata Manufacturing Co. Ltd.

Bob Muro, Wireless Telecom Group

Murthy Upmaka and DingQing Lu, Agilent Technologies, Santa Clara, CA

Murthy Upmaka and Eva Ribes-Vilanova, Keysight Technologies, Santa Rosa, Calif.

MVG (Satimo) Industries

MVG-EMC (Rainford EMC Systems Ltd)

MVG-ORBIT/FR

MVG, Paris, France

MW Journal staff

MWJ

MWJ Ediorial Staff

MWJ Editorial Staff

MWJ Editors

MWJ Staff

MwT Inc.

MX-COM Inc.

My Le Truong

Myrianne Regis, Hugues Lafontaine, Steve Kovacic, Gilles Cibiel, Olivier Llopis

N

N. Benahmed and M. Feham

N. Benahmed and S. Seghier, University of Tlemcen

N. D. Orloff and D. Gu, National Institute of Standards and Technology, Boulder, Colo

N. Logan, J.M. Noras and J.G. Gardiner, Alcatel-Lucent

N. Sainz, I. Gutierrez, A. Muñoz and J. de Nó, TECNUN; E. Hernández and A. Garciá-Alonso, CEIT

M. Jordão, P.M. Cruz, D. Ribeiro, A. Prata, N.B. Carvalho, Instituto de Telecomunicações - Universidade de Aveiro, Campus Universitário de Santiago Aveiro, Portugal

N.D. du Toit, R. Thomas, J.H. Smith, F.N. Schirk and J.A. Mogel, AR RF/Microwave Instrumentation Souderton, PA

N.M. Ridler, National Physical Laboratory (NPL) Teddington, UK; R.A. Ginley, National Institute of Standards and Technology (NIST), Boulder, CO

Na-Fu Wang and Yu-Zen Tsai, Cheng Shiu University, Taiwan; Tseng Tang, National University of Tainan; Mau-Phon Houng, Institute of Microelectronics, N

Nader Behdad(2) and Zhenqiang Ma(2), University of Science and Technology of China(1)

Nadine Collaert

Nadine Collaert and Michael Peeters, imec, Leuven, Belgium

Naftali Herscovici

Nan-Lei Larry Wang

Nancy Friedrich, Keysight Technologies, Santa Rosa, Calif

Nancy Friedrich, Keysight Technologies, Santa Rosa, Calif.

Nancy Friedrich, Keysight Technologies, Santa Rosa, Calif.

Nancy Friedrich, Keysight Technologies, Santa Rosa, Calif.

Nancy Friedrich, Keysight Technologies, Santa Rosa, Calif.

Nancy Friedrich, Keysight Technologies, Santa Rosa, Calif.

Nano Dimension

Nano Dimension, Ness Ziona, Israel

Nano Materials International Corp.

Nano Materials International, Tucson, AZ

Nanotron

Narayan Propato, Mehran Mossammaparast and Patrick Mullin, Wenzel Associates, A Quantic Company, Austin, Texas

Narda

Narda Microwave

Narda Microwave-East

Narda Safety Test Solutions GmbH, Pfullingen, Germany

Narda Safety Test Solutions, Pfullingen, Germany

NASA

NASA Jet Propulsion Laboratory

NATEL

Felix P Nater

Nathan Burley, Ovum

Nathan Cohen, Fractal Antenna Systems, Bedford, Mass.

Nathan Kundtz, Kymeta Corp., Redmond, Wash.

Nathan Miller, Sam Brokenshire, Nathan Bayley and Peter Young, Flann Microwave Ltd., Bodmin, U.K.

National Association of Broadcasters

National Instruments, Austin, Texas

National Instruments, AWR Group (NI), El Segundo, Calif.

National Instruments, Microwave Components Group, Santa Clara, Calif.

National Instruments, Santa Clara, Calif.

National IT and Telecom Agency

National Semiconductor

Naval Air System Command

Naval Sea Systems Command

Navi Miglani, RaGE Systems, Lowell, Mass.

NDK

Nearfield Systems Inc.

Nearfield Systems Inc., Torrance, CA

NEC

NEC America Inc.

NEC and Renesas

NEC Corp.

NEC Corp. of America

NEC Corporation

NEC Electronics (Europe) GmbH

NEC Electronics Europe

Neha Baheti and Avik Santra, Infineon Technologies AG, Munich, Germany

NEL

NEL Frequency Controls Inc.

Nemai C. Kamakar and Marek E. Bialkowski

Nemai Chandra Karmakar and Mohammad Nurunnabi Mollah, Nanyang Technological University

Nemai Chandra Karmakar, Monash University; Mohammad Nurunnabi Mollah, Nanyang Technological University

Nenad PopoviĆ and Ivana RadnoviĆ; IMTEL Institute, Belgrade, Serbia

New York University

Newark element14

NewEdge Signal Solutions, Shirley, Mass.

Newtec

Newtec and Quantis

Newtec/SES

Newtec/Vizada Networks

Nexius

Nexyn Corp.

NGC

nGimat Co.

NGMN

NGMN Alliance

NI (National Instruments)

NI AWR, El Segundo, Calif.

NIC

Nicholas Cannon

Nicholas Cannon, Anritsu Co., Morgan Hill, CA

Nick Langston, Jr., TE Connectivity, Menlo Park, Calif

Nick Ridler, EuMW General Chair and John Cunningham, EuMW General Co-chair

Nickander J. Damaskos and Benuel J. Kelsall, Damaskos Inc.

Nickander J. Damaskos, Benuel J. Kelsall and James E. Powell, Jr. Damaskos Inc., Concordville, PA

Nickolas Kingsley, Auriga Measurement Systems

Nicolas Chantier and Julien Cochard, Teledyne e2v Semiconductors

Nicolas Garcia and Nicholas Estes, Cheshir Industries, Albuquerque, N.M.

Nicolas Labrousse and Wissam Saabe, AMCAD Engineering, Limoges, France

Niels Kirkeby, Chong Mei and Tom Buck, TTM Technologies, Santa Ana, Calif.

Nigel Bowes, Credowan Limited

Nils Heininger, LPKF Laser & Electronics AG

Nir Sever, proteanTecs

NIT DOCOMO

Nitero

Nitronex

NITRONEX Corp.

Nkorni Katte, Joseph Haus, Jean-Bosco Serushema, Michael Scalora

NMDG

Noam Levine, Partner Manager, MathWorks

NOFFZ Technologies GmbH, Toenisvorst, Germany

Noise Com Inc.

Noise eXtended Technologies (Noise XT), Elancourt, France

Noise XT

Noisecom

NoiseTech Microwaves Ltd.

NoiseWave

Nokia

Nokia Bell Labs

Nokia Networks

Nokia Siemens Networks

Nokia Siemens Networks/Motorola

Nokia Solutions and Networks

Nolato Silikonteknik AB

Noman Rangwala and Rick Myers; Analog Devices Inc., Norwood, MA

Norbert Schmidt, IMST GmbH, Kamp-Lintfort, Germany

Norden Millimeter Inc., Placerville, CA

Nordic Semiconductor

Norsat International Inc.

Norsat International, Richmond, British Columbia

North Carolina State University

Northrop Grumman

Novatel Wireless

Novator Solutions

Novelda

Novotronik

NRL

NRL, Arne Fliflet and M. Ashraf Imam

NSI-MI Technologies

NSI-MI Technologies

NSI-MI Technologies

NSI-MI Technologies

NSI-MI Technologies, LLC

NTT Communications Corporation

NTT DOCOMO

Nuhertz Technologies

Nujira and TriQuint Semiconductor

Nujira Ltd.

Nujira/KCB Signal Solutions

Nujira/Xilinx

Numerical Innovations

Nuno Borges de Carvalho and Jose Carlos Pedro

Nurad Technologies Inc.

NuRAN Wireless

Nuria G. Prelcic, Universidade de Vigo, Vigo, Spain

Nurnihar Begam, Rahul Mondal and Partha Pratim Sarkar, University of Kalyani, West Bengal, India

NuSil Technology LLC

Nutaq

Nuvotronics LLC

NuWaves Engineering

Nxbeam

Nxbeam Inc., Los Alamitos, Calif.

Nxbeam Inc., Los Alamitos, Calif.

NXP

NXP Semiconductors and STMicroelectronics

NXP Semiconductors N.V.

NXP Semiconductors, Eindhoven, The Netherlands

NXP Semiconductors, Chandler, Ariz.

NXP Semiconductors, Eindhoven, The Netherlands

NXP Software

Nynex/Newtec

NYU Tandon School of Engineering

NYU WIRELESS

O

O.K. Jensen, T.E. Kolding, C.R. Iversen, S. Laursen, R.V. Reynisson, J.H. Mikkelsen, E. Pedersen, M.B. Jenner and T. Larsen

Objective Interface Systems Inc.

Oclaro Inc.

OctoScope Inc.

octoScope Inc.

Oculii, Beavercreek, Ohio

Odile Ronat, SiTime Corporation, Santa Clara, Calif.

ODIN

OEM Capital

OEWaves

OEwaves Inc.

Yong Fang, Baoqing Zeng, Ye Yuan, Peng Gao and Xubo Wei, University of Electronic Science and Technology of China; Tiguo Gan, 10th Institute of China Electronic Technology Group Corp.; Hai Zhang, Nanchang Institute of Technology

Oleksandr Gorbachov

Oleksandr Gorbachov and Yie-Der Shen

Oleksandr Gorbachov STMicroelectronics Taipei, Taiwan, ROC

Oleksandr Gorbachov, Independent Contractor and Mario Paparo STMicroelectronics, Catania, Italy

Oleksandr Gorbachov, Leonid Kasatkin

Oleksandr Gorbachov, STMicroelectronics

Oleson Microwave Labs (OML)

Gopinath Gampala and C.J. Reddy, EM Software & Systems (USA) Inc., Hampton, VA; Oliver Stabler and Thomas Hager, AWE Communications GmbH, Boeblingen, Germany

Olli Pekonen, Arvi Karhumaki and Martti Valtonen

Omid Sotoudeh, Sony Ericsson Mobile Communications; Tilmann Wittig, CST GmbH

OML (Oleson Microwave Labs), Morgan Hill, CA

OML Inc.

OML Inc., Morgan Hill, CA

OMMIC

OMMIC, Paris, France

Omniradar

Omrane Necibi, University of Jouf, Jouf, Saudi Arabia

Omron Electronic Components LLC

ON Semiconductor

OneWeb Ltd.

ONR

OnScale

Onyx EMS LLC

Ooredoo

Ooredoo

OpenET Alliance

Optenni Lab

Optenni Ltd.

Optimal+

Optotek Ltd.

Orbel Corp., Easton, Pa.

Orbit

ORBIT Communication Systems

ORBIT Communication Systems Inc.

ORBIT Communication Systems Ltd.

ORBIT Communications Systems

Orbit Technologies

Orbit Technologies Ltd.

Orbit Technology Group

ORBIT/FR

ORBIT/FR - Europe GmbH

ORBIT/FR Israel

Erik Org

Erik Org

OriginGPS

Orolia

Orolia

Osama Shana'a, Donald Y.C. Lie and Danilo Manstretta, RFIC 2022 Chairs

Oscilent

Oscilloquartz SA

Osprey Metals Ltd.

Ossama El Bouayadi, Yann Lamy, Laurent Dussopt and Gilles Simon, CEA-Leti, Grenoble, France

OSU Research Communications

Ouslimani Hafdallah Habiba, Universite Paris Nanterre, France

OVUM

P

P. Angeletti, European Space Agency, and M. Lisi, Telespazio

P. Asbeck, J. Mink, T. Itoh and G. Haddad

P. Heymann, R. Doerner and M. Rudolph

P. Laforge, University of Regina, Regina, SK, Canada

P. Lagoiski, L. Matytsine and M. Matytsine, Matsing Pte. Ltd.; P.K. Tan, Temasek Laboratories, National University of Singapore

P. Latha St. Joseph's College of Engineering and Technology, Chennai, India

P.C.A. Hammes, H.F.F. Jos, F. van Rijs, S.J.C.H. Theeuwen and K. Vennema, Philips Semiconductors

P.K. Jain, Space Applications Centre (ISRO), Ahmedabad, India

P.S. Neelakanta, A.K. Stampalia and D. De Groff, Florida Atlantic University

P.S. Neelakanta, Jesada Sivaraks, Charoonkierti Thammakoranonta

P.S. Neelakanta, W. Preedalumpabut and S. Morgera, Florida Atlantic University

P1dB

P3 Communications

Paciwave Inc., Sunnyvale, CA

Palomar Technologies

Panasonic

Panasonic Corp. and Renesas Technology Corp.

Panasonic Corporation, Osaka, Japan

Pankaj Goyal, National Semiconductor

Pankaj R. Katiyar, M. M. Shafiei and Wan Nor Liza Binti Wan Mahadi, University of Malaya (UM), Kuala Lumpur, Malaysia

Paolo Arcioni, Rinaldo Castello, Luca Perregrini, Enrico Sacchi and Francesco Svelto

Paolo Lampariello, General Chairman, EuMW 2009; Ivar Bazzy, President, Horizon House Publications

Paradigm Services

Paratek

Paratek and STMicroelectronics

Paratek Microwave

Paratek Microwave Inc.

Paricon Technologies Corp

Paris Akhshi, PhD, Keysight Technologies, Santa Rosa, Calif.

Park Electrochemical Corp.

Park Electrochemical Corp., Melville. N.Y.

Parker Hannifin Corp.

Parker Traweek, SiTime, Santa Clara, Calif.

ParkerVision Inc.

Pascall

Pascall Electronics Ltd.

Pascall Electronics Ltd.

Pasquale Dottorato

Passive Plus

Passive Plus Inc.

Pasternack Enterprises Inc., Irvine, Calif.

Pasternack, an Infinite Brand, Irvine, Calif.

Pasternack, Irvine, Calif.

Pat Hindle

Pat Hindle and Kristen Anderson, MWJ Staff

Pat Hindle, Editor and Janine Love, Contributing Editor

Pat Hindle, Editor, Microwave Journal

Pat Hindle, Gary Lerude and Richard Mumford, Microwave Journal

Pat Hindle, Gary Lerude, Janine Love - MWJ Editors

Pat Hindle, Microwave Journal

Pat Hindle, Microwave Journal Editor

Pat Hindle, Microwave Journal Media Director

Pat Hindle, Microwave Journal Technical Editor

Pat Hindle, MWJ Editor, and Richard Mumford, MWJ International Editor

Pat Hindle, Technical Editor

Pat Hindle, Technical Editor, Microwave Journal

Patric Heide

Patrick Courtney, Qorvo, Richardson, Texas

Patrick Garrec, Thales, Paris, France

Patrick Hindle - Editor, Microwave Journal

Patrick Hindle and Gary Lerude, Microwave Journal, Norwood, Mass.

Patrick Hindle and Jennifer DiMarco

Patrick Hindle, Editor, Microwave Journal

Patrick Hindle, Editorial Director

Patrick Hindle, Gary Lerude and Richard Mumford Microwave Journal

Patrick Hindle, Gary Lerude, Jenn DiMarco, Microwave Journal Editors

Patrick Hindle, Microwave Journal

Patrick Hindle, Microwave Journal Editorial Director

Patrick Hindle, Microwave Journal Technical Editor

Patrick Hindle, Microwave Journal, Norwood, Mass.

Patrick Hindle, Richard Mumford and Gary Lerude, Microwave Journal Editors

Patrick Hindle, Technical Editor, Microwave Journal

Patrick J. Sullivan, Walter H. Ku and Bernard A. Xavier

Patrick Naraine and Chandra Mohan, Skyworks Solutions Inc., Woburn, MA

Patrick Naraine, Skyworks Solutions Inc.

Patrick Robbins, Micronetics Inc.

Patrizia Mühlbauer, press@rohde-schwarz.com

Patrizia Mühlbauer, Rohde & Schwarz

Anton Patyuchenko

Paul A. Crandell & Fredrick J. Dominick

Paul A. Moakes, CommAgility, Loughborough, U.K.

Paul Beasley and Damian McCann, MACOM, Lowell, MA

Paul Blount and Charles Trantanella, Qorvo, Inc., Chelmsford, Mass.

Paul Chiavacci

Paul Colestock

Paul Colestock, Agilent EEsof EDA

Paul Harris, Mark Beach and Simon Armour, University of Bristol (U.K.); Ian Mings British Telecom (BT)

Paul Hendriks, Analog Devices, Norwood, Mass.

Paul Hurwitz, Amol Kalburge, Edward Preisler, David Howard and Chris Masse, Tower Semiconductor, Migdal HaEmek, Israel

Paul Leclaire, KnowMade, Sophia Antipolis, France

Paul Mattheijssen, NXP Semiconductors, Eindhoven, The Netherlands

Paul Pino, W. L. Gore & Associates Inc., Landenberg, PA

Paul Pino, W.L. Gore & Associates Inc. Elkton, MD

Paul Pino, W.L. Gore & Associates, Newark, Del.

Paul Pino, W.L. Gore and Associates Inc.

Paul Tilghman, Defense Advanced Research Projects Agency (DARPA), Arlington, Va.

Paul Tornatta, Cavendish Kinetics Inc., San Jose, CA

Paul Turner, Systems4Silicon Limited, Bristol, U.K.

Paulo Correa and George Bollendorf, Empower RF Systems, Inglewood, Calif.

Pavin Singh Virdee, Department of Electrical Engineering California Polytechnic State University

Pavin Singh Virdee, Department of Electrical Engineering California Polytechnic State University

Payman Shanjani and Vikas Choudhary, pSemi Corporation, San Diego, Calif.

PCTEL Inc.

PCTEST Engineering Laboratory Inc.

Pedro Emiliano Paro Filho1,2, Mark Ingels1, Piet Wambacq1,2, Jan Craninckx1, Imec1, Leuven, Belgium; Vrije Universiteit Brussel2, Ixelles, Belgium

Pedro Miguel Cabral, José Carlos Pedro and Nuno Borges Carvalho

Pendulum

Pendulum Instruments

Pendulum Instruments AB

Pengcheng Jia, CAP Wireless Inc.

Pengfei Zhang, RF Micro Devices

Pentek

Pentek Inc., Upper Sadle River, N.J.

Per Vices

Per Vices, Toronto, Canada

Per Viklund

Per Viklund, Mentor Graphics and How-Siang Yap, Agilent

Per Viklund, Mentor Graphics; How-Siang Yap, Agilent Technologies Inc.

Peraso

Peraso Inc.

Peraso Technologies Inc.

Peraso, Inc., San Jose, Calif.

Peregrine

Peregrine Semiconductor Corp.

Peregrine Semiconductor Corp., San Diego, Calif.

Peregrine Semiconductor, San Diego, CA

Peregrine Semiconductor, San Diego, CA

Permac Electronics

Perry M. Malouf, Ph.D. and Robert E. Wallis, Johns Hopkins University Applied Physics Laboratory

Peter A. Rabbeni, Alvin Joseph, Theodore Letavic and Anirban Bandyopadhyay, GlobalFoundries, Santa Clara, Calif.

Peter Bacon and Kinana Hussain, Peregrine Semiconductor, San Diego, Calif.

Peter Bacon and Young-Taek Lee, pSemi, San Diego, Calif.

Peter Bacon, Chandra Mohan, David Fryklund and Peter Zampardi, Skyworks Solutions Inc.

Peter Bacon, Peregrine Semiconductor, San Diego, CA; Drew Fischer and Ruan Lourens, National Instruments, Austin, TX

Peter Barnwell, Michael O'Neill and Charles Sabo

Peter Cain, Agilent

Peter Carson and Steve Brown, Qualcomm

Peter Delos, Analog Devices, Inc., Norwood, Mass.

Peter Delos, Mike Jones and Mark Robertson, Analog Devices

Peter Delos, Mike Jones and Mark Robertson, Analog Devices Inc.

Peter Fox, aiRadar Inc., Vancouver, Canada

Peter Futter, Altair Engineering Inc., Troy, Mich.

Peter Gammel, Ph.D Skyworks Solutions, Woburn, MA

Peter Hoogeboom

Peter Ladbrooke and James Bridge

Peter Matthews, Knowles Precision Devices

Peter Matthews, Knowles Precision Devices, Cazenovia, N. Y.

Peter Matthews, Knowles Precision Devices, Cazenovia, N.Y.

Peter McNeil, Pasternack, Irvine, Calif.

Peter Shveshkeyev

Peter Staecker

Peter von Nordheim, Spectrum Elektrotechnik GmbH, Munich, Germany

Peter Y. Hong

Zachariah Peterson

Petteri Alinikula

PH

Phase Matrix

Phase Matrix Inc., San Jose, CA

Phasor Inc.

PHAZR

Phil Lambert, Fortify

Phil Lambert, Fortify, Boston, Mass.

Phil Leslie

Phil Lindsey, ARSI LLC, Atlanta, Kan.; C. J. Reddy Altair Engineering Inc., Hampton, Va.

Phil Warder and Nicolas Layus, TriQuint Semiconductor, Hillsboro, OR

Phil Warder, David Schnaufer, TriQuint Semiconductor

Philbert F. Marsh, Christopher Rutherglen, Alexander A. Kane, Tyler A. Cain and Kosmas Galatsis, Carbonics Inc., Culver City, Calif.

Philip F. Dindo

Philip Lambert, Fortify, Boston, Mass.

Philip Lambert, Jeff Von Loesecke and Henrik Ramberg, Fortify, Boston, Mass.

Philip M. Fabis

Philippe Eudeline, EuRAD 2010, Conference Chairman

Philippe Ferrari, TIMA, Université Grenoble Alpes, Grenoble, France

Philips Semiconductor

Philips Semiconductors

Philsar Electronics Inc.

Phoenix Microwave Corp.

Phonon Corp.

phys.org

Pickering Interfaces

Pickering Test Solutions

Pico Technology

Pico Technology, St Neots, U.K.

picoChip

Picochip/Wavesat

Piconics and Modelithics

Piconics Inc.

Picosecond Pulse Labs, Boulder, CO

Piero Angeletti and Marco Lisi, European Space Agency, Noordwijk ZH, The Netherlands

Pierre Bertram, Thales Air Defense

Pierre Piel

Pierre Piel, Wayne Burger, David Burdeaux, Warren Brakensiek, Freescale Semiconductor

Piet van Genderen, General Chairman; Charles Ayotte, Horizon House Publications Inc.

Pike Research

Bob Pinato

Ping Hui, Nokia Mobile Phones

Ping Yin, RF Micro Devices Inc.

Pivotal Commware

Pivotone

Pixus Technologies

Planar Electronics Technology

Planar Electronics Technology Inc. Frederick, MD

Planar Filter Co.

Planar LLC

Planar Monolithics Industries

Planar Monolithics Industries and AmpliTech

Planar Monolithics Industries Inc.

Platronics

Plessey Semiconductors

Plessey Semiconductors Ltd.

Plextek

Plextek RF Integration

Ploughshare Innovations

PMI and AmpliTech

PMR

PMT

POET Technologies Inc.

Point 35 Microstructures

Polaris Networks

Polaris Wireless

Pole/Zero

Polese Co.

PoLTE

PolyPhaser, Hayden, Idaho

Polytechnic Institute of NYU (NYU-Poly)

Poseidon Scientific Instruments Pty Ltd.

Poshun Chiu and Ezgi Dogmus, Yole Développement (Yole), Lyon-Villeurbanne, France

Power Module Technology

Power Module Technology, Carson City, NV

Power PR

Powering the Next Seven Billion Voices

PPC

PPM Systems, Swindon, U.K.

Patrick Pratt

Pravin Patel, Rubina Ahmed, Moises Cases -IBM; Gourgen Oganessyan, Quellan; Dave Dunham, Molex

Precision Devices

Precision Receivers Inc., Marshall, Va.

precisionWave Corp.

Premix Oy

PREMO

Presented by COMSOL

Presto Engineering Inc.

Princeton Electronic Systems Inc. (PES)

PrismTech

PRNewswire

Production Team

Professor Theodore Rappaport, Founding Director, NYU WIRELESS

Professor Theodore Rappaport, NYU WIRELESS

Programmed Test Sources (PTS)

Programmed Test Sources Inc.

Programmed Test Sources Inc. (PTS)

Promex Industries

Pronghorn Solutions, Denver, Colo.

ProPlus

Protek

Protek Inc.

Protium Technologies Inc.

Provigent

pSemi Corp.

pSemi Corp., San Diego, Calif.

Pulsar Microwave Corp.

Pulse

Pulse Electronics Corp.

Pulse Systems, Inc., South Easton, Mass.

PureWave Networks Inc.

Q

Q Microwave

Q-par Angus

Q-par Angus Ltd.

Q-Tech Corporation

Qian Cheng, Chen Yiyuan and Zhu Xiaowei

Qian Wang, Cheng Yuan and Yasen Huang, Southeast University; Jianjun Gao, East China Normal University

Qiang Chen, Hou Zhang and Xue-liang Min, University of Airforce Engineering, Xi’an, China, Lu-Chun Yang, China Mobile Ltd., Shenzhen, China

Qiang Wu, Heng Xiao and Fu Li

Qiao Ke, Tang Zongxi, University of Electronic Science and Technology of China, Chengdu, China

QinetiQ

Qingqing Ye and Lijun Zhang, Institute of Microelectronics of Chinese Academy of Science, Beijing, China

Qingqing Ye, (1) Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China, (2) University of Chinese Academy of Sciences

Qingshuang Liu(1,2), Yilong Lu(2), Jie Jin(2), Nanyang Technological University(1); Tianjin University(2)

Qingzhen Xia, Institute of Microelectronics Chinese Academy of Sciences, Beijing, China University of Chinese Academy of Sciences, Beijing, China

Qirong Li, Songbai He, Zhijiang Dai and Weimin Shi, University of Electronic Science and Technology of China, Chengdu, China

Qiu-Huan Huang, Dar-Ron Huang and Huey-Ru Chuang, National Cheng Kung University

Qorvo

Qorvo Inc., Greensboro, N.C.

Qorvo, Inc., Newbury Park, Calif.

Qosmotec

QPER

QRC Technologies, Fredericksburg, Va.

Quad Industries

QuadSAT

QuadSAT, Odense N, Denmark

QUALCOMM

Qualcomm Inc.

Qualcomm Technologies Inc., San Diego, Calif.

Qualcomm Technologies, Ericsson and AT&T

Quantic Croven

Quantic MWD

Quantic PMI (Planar Monolithics)

Quantic Wenzel, Austin, Texas

Quantum Microwave, Cohasset, Mass.

QuarterBranch Technologies Inc.

Quarterwave, Rohnert Park, Calif.

Quartzlock

Quartzlock (UK) Ltd. Totnes, Devon, UK

Quartzlock UK Ltd.

Quectel Wireless Solutions/MSC Vertriebs

Queen’s University Belfast

Quintech Electronics & Communications Inc.

R

R. Banham, G. Valsecchi, Lucci, G. Pelosi, S. Selleri, V. Natale, R. Nesti, and G. Tofani

R. Chair, A.A. Kishk, K.F. Lee and D. Kajfez, University of Mississippi

R. Dahle, State University of New York, New Paltz, New York, USA

R. El-Bouslemti, Ecole Nationale Polytechnique d’Oran, Algeria

R. El-Bouslemti, Ecole Nationale Polytechnique d’Oran, Algeriasup

R. Fuks and A. Weirback, Astrolab Inc.

R. Fulcoli, M. Sedehi, E. Tilli and L. Timmoneri, SELEX Sistemi Integrati, Rome, Italy

R. Giofre, L. Piazzon, P. Colantonio and F. Giannini, University of Tor Vergata

R. Joseph, K. Herbertz, T. Bertuch, Fraunhofer Institute for High Frequency Physics and Radar Techniques FHR

R. Kumar, N. Gupta and K.P.M. Bhat, Institute of Armament Technology

R. Lai, H. Wang, Y.C. Chen, T. Block, P.H. Liu, D.C. Streit. D. Tran. M. Barsky, W. Jones, P. Siegel and T. Gaier

R. Rathna and M. A. Bhagyaveni, Anna University, Chennai, India

R. Rathna and M. A. Bhagyaveni, S. S. Shamina P. Latha

R. Tayrani, Raytheon Space & Airborne Systems

R. Vilar, J. Marti, Universitat Politecnica de Valencia; R. Czarny, Thales Research and Technology

R. Wolf, A. Joseph, P. Rabbeni and J. Dunn, IBM Microelectronics Division Essex Junction, VT

R.A. Abd-Alhameed, D. Zhou, N.J. McEwan, P.S. Excell and A. Ghorbani

R.A. Abd-Alhameed, M. Zewani, P.S. Excell, J.G. Gardiner and N.J. McEwan, Bradford University; N.T. Ali, Etisalat Polytechnic

R.A. Abd-Alhameed, P.S. Excell and J.G. Gardiner, Bradford University;

R.C. Hansen

R.C. Hansen, Associate Editor MWJ (Dec. 1978)

R&D Microwaves

R&S

Racal Instruments Limited

Racal Instruments Wireless Solutions, an Aeroflex company Slough, UK

Rachid El Assir, Rohde & Schwarz

Radha Setty and Brandon Kaplan, Mini-Circuits, Brooklyn, N.Y.

Radhoine Aloui, Zied Houaneb and Hassen Zairi, University of Carthage, Tunisia

Radiall Inc.

Radiall USA

Radiall USA Inc., Chandler, AZ; Radiall France, Rosny sous Bois (Paris), France

Radiall, Paris, France

Radio Design Group Inc.

Radio Engineering Services

Radio Frequency Interference – End Users Initiative (RFI-EUI)

Radio Frequency Systems

Radio Waves

Radio Waves Inc.

RADX Technologies Inc., San Diego, Calif.

RADX Technologies, Palo Alto, Calif.

Raffaele Persico and Francesco Soldovieri

Rafi Hershtig and Tim Dolan, 2011 MicroApps Co-Chairmen

Rafi Hershtig, K&L Microwave

Raghavendra G. Kulkarni

Raj Kumar, N. Gupta and K.P.M. Bhat, Institute of Armament Technology; R. Sreehari Rao, Defence Electronics Research Laboratory

Raj Sodhi, Keysight Technologies; Jim Taber, X-COM Systems

Rajanish, P. Onno and N. Jain, Anokiwave Inc.,San Diego, CA; C. Weigand, P. McIntosh and B. Rizzi, M/A-COM Inc.,Lowell, MA; K. Izzac, Paratek Microwav

Rajesh Pazhyannur, Co-Founder and CEO of Ataya

Rakon

Ralf Kakerow, Continental Automotive and Matthias Tröscher, CST Munich, Germany

Ralph Levy

Ramesh K. Pokharel, Kyushu University

Randall North, David Kennedy and Mike Murphy

Randall Rhea

Randall W. Rhea

Randy Cochran, Phil Knights, Jarek Lucek - NXP

Randy Haupt, Utah State University

Randy J. Richards and Hector J. De Santos

Randy Oltman, Analog Devices Inc., Norwood, Mass.

Randy Rhea and Bill Clausen, Eagleware Corp.

Randy Rhea, Susina LLC

Randy Rhea. Susina LLC

Ranfy Haupt and Hugh Southall

Ranplan

Raven Industries

Ravinder Gill, Gigatronics

Ravish R. Shah, Amit Patel, Ved Vyas Dwivedi and Hitesh B. Pandya

Ray Crampton

Ray Pengelly, Cree RF Products

Ray Pengelly, WAMICON 2014 General Chairman

Ray Schwartz, Cobham DES M/A-COM

Raymond Pengelly and Ryan Baker, Cree Inc., Research Triangle Park, NC; Mattias Astrom and Joel L. Dawson, Eta Devices, Cambridge, MA

Raymond Quéré and Charles A. Ayotte

Raymond Rumpf, Professor at UTEP and Director of EM Lab

Raymond Schwartz and Peter Waltz, Cobham Defense Systems, Microwave Components, Exeter, NH

RAYSPAN Corp.

Raytheon

Raytheon Co.

Raytheon Microelectronics

RCL Microwave, Inc.

RCR Wireless News

RDECOM CERDEC Public Affairs

RDL Inc.

Reactel

Reactel Inc.

Red Oak Canyon LLC, Spicewood, Texas

Redline Communications

Reeves-Hoffman Inc.

Regina Gani and Grant A. Ellis, Universiti Teknologi Petronas Perak, Malaysia; Teoh Chin Soon, DreamCore Technologies, Malaysia

Reiner Stuhlfauth, Rohde & Schwarz, Munich, Germany

Relay

RelComm Technologies

RelComm Technologies Inc.

Remcom

Remcom Inc

Remcom Inc., State College, PA

Remcom Inc., State College, Pa.

REMEC Magnum INC.

Rémi Comyn, KnowMade, Sophia Antipolis, France

Rémi Comyn, PhD, Knowmade

Remote Sensing Solutions, Barnstable, Mass.

Remtec

Remtec Inc.

Rena Raj, Keysight Technologies Inc., Santa Rosa, Calif.

Renaissance Electronics

Renaissance Electronics & Communications LLC

Renaissance Electronics Corp.

Renaissance Electronics Corp. (REC)

Renaissance Electronics Corp./HXI

Renee Z. Jones and Bruce A. Kopp

Renesas Electronics

Renesas Electronics Corp.

Renesas Electronics Europe

Renesas Mobile Corporation

Res-Net Microwave, Clearwater, Fla.

Research and Markets

Resonant Inc.

Response Microwave Inc.

Reto Germann, HUBER+SUHNER AG, Herisau, Switzerland

Reuters

Reza Firoozabadi, Airvana Network Solutions and Eric L. Miller, Tufts University

Reza Kamali-Sarvestani, Rowan University, Glassboro, NJ and John D. Williams, UAHuntsville, Huntsville, AL

Reza Mohammadi and Simon Ndiritu, Per Vices, Toronto, Canada

Reza Rofougaran, Movandi, Irvine, Calif.

RF & MW Components Group, M/A-COM Inc.

RF Energy Alliance

RF Energy Alliance (RFEA)

RF Engines Ltd.

RF Industries

RF Industries Ltd.

RF Innovation, Starnberg, Germany

RF Micro Devices

RF Micro Devices Inc.

RF Micro Devices, Greensboro, NC

RF Microtech

RF Monolithics Inc.

RF Power Components

RF Prime Corp.

RF Savvy Technologies LLC, Santa Rosa, Calif.

RF Superstore

RF Systems

RF-Comm

RF-Lambda, San Diego, Calif.

RFaxis

RFCONNEXT Inc.

RFCONNEXT inc., San Jose, CA

RFE Inc., Fremont, Calif.

RFEL

RFEMX

RFHIC

RFHIC Corp., Anyang, South Korea

RFHIC Corp., Anyang, South Korea

RFHIC Corporation, Suwon, Korea

RFHIC, South Korea

RFHIC, Suwon, Korea

RFI

RFI Global Services

RFI Global Services Ltd.

RFIC

RFMD

RFMD Inc.

RFMD, Greensboro, NC

RFMD®, Greensboro, NC

RFMW

RFMW and Aeroflex-Metelics

RFMW and Smiths Interconnect

RFMW Ltd.

RFuW Engineering Ltd.

rgwergre

Rhonda Franklin, IMS2021 WIM Event Chair

Rice University

Rice University

Richard Bay-Ramyon, MiniRF

Richard Chen, Neal Mellen, Makoto Shibata and Masahiro Miyazaki, TDK Corp.

Richard Duvall, Keysight Technologies, Santa Rosa, Calif.

Richard F. Bilotta

Richard F. Schwartz

Richard Fiore

Richard G. Ranson

Richard Harlan, Director of Technical Marketing, ParkerVision

Richard Hilton and Steve Dudkiewicz, Maury Microwave Corp., Ontario, Calif.

Richard I. Harrison, General Telephone and Electronics Labs Inc.

Richard Mumford

Richard Mumford and Jennifer DiMarco, Microwave Journal staff

Richard Mumford and MWJ Staff

Richard Mumford and Pat Hindle, Microwave Journal Editors

Richard Mumford Microwave Journal European Editor

Richard Mumford, European Editor

Richard Mumford, European Editor, Microwave Journal

Richard Mumford, International Editor

Richard Mumford, International Editor – Microwave Journal

Richard Mumford, International Editor, Microwave Journal

Richard Mumford, International Editor, Patrick Hindle, Editor and Gary Lerude, Technical Editor

Richard Mumford, Microwave Journal

Richard Mumford, Microwave Journal European Editor

Richard Mumford, Microwave Journal European Editor

Richard Mumford, Microwave Journal International Editor

Richard Mumford, Microwave Journal International Editor

Richard Mumford, Microwave Journal, International Editor

Richard Mumford, Microwave Journal’s International Editor

Richard Mumford, MWJ International Editor

Richard Mumford/ARMMS

Richard Remski

Richard V. Snyder

Richardson

Richardson Electronics

Richardson Electronics Inc.

Richardson Electronics Ltd.

Richardson Electronics, Ltd.

Richardson RFPD

Richardson RFPD / Arrow RF & Power

Richardson RFPD Inc.

Richardson RFPD, Inc., LaFox, IL

RichardsonRFPD Inc.

Rick Hartman and Tom Bell Kaelus, Smiths Interconnect, Denver, CO

Rick Hartman, Kaelus Inc., Thousand Oaks, CA

Rick Montgomery and Patrick Courtney, Qorvo, Greensboro, N.C.

RIGOL, Beaverton, Ore.

Rikard Eliasson, Anders Sundberg and Anders Wall

Riot Research

Diane Ritchey

RJR Polymers

RJR Technologies Inc.

RLC

RLC Electronics

RLC Electronics Inc., Mt. Kisco, N.Y.

Rob Lefebvre

Rob Van Brunt

Robab Kazemi, R. Ali Sadeghzadeh, and Reza Fatemi Mofrad, K. N. Toosi University of Technology

Robab Kazemi, R. Ali Sadeghzadeh, Reza Fatemi Mofrad and K.N. Toosi, University of Technology

Robert Grossbach

Robert Gubser and David Kenny, Pletronics Inc.

Robert Gunnels

Robert H. Caverly, Nikolai V. Drozdovski and Michael J. Quinn

Robert John, W. L. Gore & Associates Inc., Landenberg, PA

Robert O’Rourke, Remcom Inc., State College, Pa.

Robert P. Bernardo, Micro Networks

Robert Plana, CNRS

Robert Smith and Liam Devlin, Plextek RFI, Great Chesterford, Saffron Walden U.K.

Robert Smith, Liam Devlin, Stuart Glynn, Tony Richards and Graham Pearson, PRFI, Great Chesterford, U.K.

Robert Syputa, Senior Analyst, Maravedis

Robert Wagner, Javelin Semiconductor

Robert Weigel, General Chairman, EuMW 2013 and Ivar Bazzy, President, Horizon House Publications

Roberto Cammarata and Alfio Scuto, STMicro, Italy

Roberto Lalli, Caterina Rapisarda, Alessandro Manuale and Valerio Tocca, Land & Naval Defence Electronics Leonardo S.p.A

Roberto Sorrentino

Roberto Sorrentino and Andre Vander Vorst, European Microwave Association

Roberto Sorrentino, General Chairman, EuMW 2014; Ivar Bazzy, President, Horizon House Publications

ROBIN Radar Systems

Rochester Electronics

Rockwell Collins

Rodger Billings and Tony Edridge, M2 Global Technology Ltd.

Rodger Hosking, Mercury Systems, Saddle River, N.J.

Rodrigo Kenji Enjiu, CST AG, Darmstadt, Germany; Marcelo Bender Perotoni, UFABC, Santo André, Brazil

ROG of Rogers Corp (aka John Coonrod)

Roger Clarke

Roger Hill

Roger Nichols, Keysight

Rogers

Rogers Corp.

Rogers Corp., Advanced Circuit Materials Division Chandler, AZ

Rogers Corp., Chandler, Ariz.

Rogers Corp., Rogers, CT

Rogers Corporation

Rohde & Schwarz

Rohde & Schwarz

Rohde & Schwarz

Rohde & Schwarz GmbH & Co. KG

Rohde & Schwarz Professional

Rohde & Schwarz USA

Rohde & Schwarz USA

Rohde & Schwarz, Munich, Germany

Rohde & Schwarz, Munich, Germany

Rohde & Schwarz, Munich, Germany

Rohde & Schwarz, Munich, Germany

Rohde & Schwarz/Synopsys

Rohde & Schwarz/u-blox

Roke Manor Research

Roke Manor Research Ltd.

Roland Hassun

Roland Hassun, Roland Hassun Consulting

Rolf Jakoby, European Microwave Conference 2007 Chairman

Ron Demcko

Ron Demcko and Daniel West, AVX Corporation, Greenville, S.C.

Ron Demcko, AVX Applications Engineer

Ron Ginley, IMS2022 General Chair

Ron Rausch and Mark Buffo, Keithley Instruments Inc., Cleveland, OH

Ron Williamson Aeroflex Test Solutions, Plainview, NY

Ronald A. Marino

Ronald A. Marino and Wesley Hearst

Ronen Holtzman, Elisra

Ronen Holtzman, Elisra Electronic Systems Ltd., Bene Beraq, Israel

Ronen Holtzman, General Microwave Israel Ltd., Jerusalem, Israel

Roos Instruments, Santa Clara, Calif.

Rosenberger

Rosenberger Hochfrequenztechnik

Rosenberger Hochfrequenztechnik Gm, Fridolfing, Germany

Rosenberger Hochfrequenztechnik GmbH & Co. KG, Fridolfing, Germany

Rosenberger Hochfrequenztechnik, Tittmoning, Germany

Rosenberger Hochrfrequenztechnik GmbH & Co KG

Rosenberger of North America

Rosenberger of North America LLC

Rosenberger, Fridolfing, Germany

Royal Australian Navy

Royal Philips Electronics

RT Logic

RTX and SiTel

Rudy Fuks

Rudy Fuks, Astrolab Inc., Warren, NJ

Rui Ma and Mouhacine Benosman, Mitsubishi Electric Research Laboratories, Cambridge, Mass.

Rui Wang and Jun Xu, University of Electronic Science and Technology of China, Chengdu, China

Ruixia Yang, Heibei University of Technology, Tianjin, China

Ruska Patton and Ning Yang, EMSCAN Corp., Calgary, Canada

Ruska Patton, EMSCAN, Calgary, Canada

Russ Alm (ALC), Dave Strand (Strand Mktg)

Russell J. Hoppenstein, Texas Instruments, Dallas, Texas

Russell J. Hoppenstein, Texas Instruments, Dallas, Texas

Russell Lake, Aalto University, Finland

Ruth Jackson

Rutronik UK

Ryan Benech, Roos Instruments

S

S C Bera, R V Singh and V K Garg

S. Aich, J. Dhar, S.K. Garg, B.V. Bakori and R.K. Arora, Space Applications Center, ISRO, Ahmedabad, India

S. Azam, C. Svensson and Q. Wahab, Linköping University, Linköping, Sweden; R. Jonsson, Swedish Defense Research Agency Linköping, Sweden

S. Korneev, S. Alyakrinsky.

S. Kuhn, Phasor Instruments

S. M. Stout-Grandy, J.S. Wight, A. Petosa, I.V. Minin and O.V. Minin

S. Yoo, M.R. Murti, D. Heo and J. Laskar

S.C. Bera and R.V. Singh, Space Applications Centre (ISRO)

S.C. Bera, P.S. Bharadwaj, R.V. Singh and V.K. Garg, Space Applications Center

S.C. Bera, R.V. Singh and V.K. Garg

S.C. Bera, R.V. Singh and V.K. Garg, ISRO

S.C. Bera, R.V. Singh and V.K. Garg, Space Applications Centre (ISRO)

S.C. Bera, R.V. Singh, V.K. Garg Space Applications Centre, ISRO Ahmedabad, India

S.E.A. Datentechnik

S.F. Ooi, S. Gao, A. Sambell, D. Smith and P. Butterworth, University of Northumbria

S.J. Caprio, Laurel, MD

S.J.C.H. Theeuwen, J.A.M. de Boet, V.J. Bloem and W.J.A.M. Sneijers, NXP Semiconductors

S.K. Lee, A. Sambell, E. Korolkiewicz, S.F. Loh, S.F. Ooi and Y. Qin

S.P. Yeo and M. Cheng

S.S. Riaz Ahamed

S.S. Shamina, Vellore Institute of Technology, Vellore, India

S.Y. Lin, H.R. Chuang and T.S. Horng

Saab

Saab AB

Saab Defense and Security USA (SDAS)

Saab Sensis

Sabritec

Sachin Kumar Yadav, Amanpreet Kaur and Rajesh Khanna, Thapar Institute of Engineering and Technology, Punjab, India

SAF North America

SAF Tehnika, Riga, Latvia

SAF Tehnika, Riga, Latvia

Sage Laboratories

Sage Laboratories Inc.

SAGE Millimeter Inc., Torrance, Calif.

SAGE Millimeter Inc., Torrance, Calif.

Saheli Roy Choudhury, Reporter, CNBC.com

Sai Gunaranjan Pelluri, Alok Joshi and Apu Sivadas, Steradian Semiconductors Pvt. Ltd., Bangalore, India

Saint-Gobain

Salam Dindo

Salisbury Engineering Inc.

Sam Bookman

Sam Kusano, Keysight Technologies, Santa Rosa, Calif.

Sam Morrar, Hughes Network Systems, LLC, Germantown, Md.

Sami Bousnina, PolyGrames Research Center

Samir El-Ghazaly

Samo Vehovc

Samsung

Samsung Electronics Co. Ltd.

HYUNGCHUL KIM, HANJIN CHO, MIN-SU KIM, MINCHEOL SEO, JUNGHYUN HAM, CHEON-SEOK PARK & YOUNGOO YANG, SUNGKYUNKWAN UNIVERSITY, SUWONG, KOREA YAO XI, SAMSUNG ELECTRONICS, KIHEUNG, KOREA SUNGCHAN JUNG, SAMSUNG TECHWIN, SUNGNAM, KOREA

Samtec

Samtec Inc., New Albany, Ind.

Samuel C. Yang

Samuel Cho, CTO, RFHIC Corp.

San-tron

San-tron Inc.

Sanan Optoelectronics

Sandeep Palreddy and Rudolf Cheung, Microwave Engineering Corp. North Andover, MA

Sandy Fraser, Agilent Technologies Inc.

Brook Sandy-Smith

Sang Hyun Park Chung-Ang University Seoul, Korea

Sang Won Kim, Han Yu Cho, Young Kim, Ik Soo Chang and Won Woo Lee

Sang-Kyo Shin and Xiang Feng, Keysight Technologies, Santa Rosa, Calif.

Sang-Tae Kim, Jong-Soo Lim and Kyoung-Rok Cho

Sang-Tae Kim, Jong-Soo Lim, Kyoung-Rok Cho

Sanggee Kang, Heonjin Hong and Sungyong Hong

Sanghoon Lee, James Kaney and Edgar Garay, Falcomm, Atlanta, Ga.

Sangshin Elecom

Sanjay Moghe, Babak Matinpour, and Drayton Avera, RF Solutions Inc.

SANTIER

Sapphicon and AWR

Saptarsika Das, Ramesh Chandra Tiwari and Lourembam Lolit Kumar Singh, Mizoram University, Mizoram, India

Sarah LeSalva, NI

Sarah Yost, National Instruments, Austin, Texas

Sascha Laumann, Rohde & Schwarz, Munich, Germany

SATCOM Digital Networks

SATELLITE 2011

Satellite Interference Reduction Group (IRG)

SATIMO (Nicolas Gross. Alessandro Scannavini and Meryam Abou el Anouar) MI Technologies (Derek Skousen)

SATIMO Industries, Villebon-sur-Yvette, France

SatNews Publishers

Saurabh Chaturvedi, Mladen Božanic and Saurabh Sinha University of Johannesburg, Johannesburg, South Africa

Saurabh Chaturvedi, Mladen Božanic and Saurabh Sinha, University of Johannesburg, Johannesburg, South Africa

Sawtek Inc.

Sawtek, Inc.

Scalable Network Technologies

Scalable Network Technologies Inc.

Scalable Network Technologies Inc. and VT MAK

Schaffner

Schleuniger Inc.

Schmid & Partner Engineering AG

Schmid & Partner Engineering AG (SPEAG)

Schmid & Partner Engineering AG (SPEAG)/Zurich MedTech AG (ZMT), Zurich, Switzerland

SCHMID Group

SCHOTT

SCHOTT Electronic Packaging

Schott Electronic Packaging, Landshut, Germany; IX-CAD GMBH Eichenau/Munich, Germany

Science and Technology Facilities Council

Science and Technology Facilities Council’s

Scintera

Scintera Networks Inc.

Scintera, Sunnyvale, CA

Scott Barker and Sanjay Raman

Scott Blanchard, Vaunix

Scott DeMange and Barry Wu, Keysight Technologies, Santa Rosa, Calif.

Scott Gibson, Symmetricom Inc., San Jose, CA

Scott Langdon, Remcom Inc., State College, Pa.

Scott Sentz, AEM Inc., San Diego, CA

Scott Wartenberg

Scott Wartenberg, RF Micro Devices

Scott Wedge, Evgeny Wasserman and David Neilson

Scott Wood, Milestone Marketing Inc.

Sean Buckley

Sean Buckley, Telecommunications

Sean Cordone, ISCO International, Elk Grove Village, IL

Sean Cordone, Vice President of Engineering

Sean D’Arcy, Director, Aerospace and Defense, ADI

Sean Ferguson and Haydn Nelson, National Instruments

Sean Thompson, National Instruments

Sean Thorne

Sector Microwave Industries, Deer Park, N.Y.

Secure Communication Systems

Sefa Tanis, Analog Devices Inc., Norwood, Mass.

Seiko Epson

Seikoh Giken Co. Ltd.

Select Fabricators Inc.

Selex ES

Selex Galileo

SELEX Sistemi Integrati

SELEX Systems Integration

SEMA Industries

Sematron

SEMI Silicon Manufacturers Group (SMG)

Semiconductor Industry Association ( SIA)

Semiconductor Industry Association ( SIA)

Semiconductor Industry Association ( SIA)

SemiGen Inc.

SemiGen, Manchester, N.H.

Semtech Corp.

SenarioTek

SenarioTek, Santa Rosa, Calif.

Senglee Foo

SenSyTech Inc.

Seok Kyun Park, Ik Soo Chang, Yun Seo Choi, Jun Won Huh, Young Kim

Seong-Ho Son, Sungtae Hwang, Janghoon Jeong, Heunggoo Jun and Dal Ahn, Soonchunhyang University, Asan 31538, Republic of Korea

Seong-Jun Kangand Hee-Yong Hwang, Kangwon National University Chuncheon, Korea

Seong-Sik Myoung and Jong-Gwan Yook, Yonsei University

Seongryong Yoo and Sungtek Kahng, University of Incheon, Incheon, Korea; Jong-Guk Kim, LG Innotek Co. Ltd., Ansan, Korea

Septentrio/QinetiQ

Sergey Beltchicov, Andrey Dzisiak and Igor Guletskiy, ELVIRA Production Co. Ltd., Russia

Sergio Cardona and Joe Schmelzer, ED2 Corporation, Tucson, Ariz.

SES S.A.

Seste Dell'Aera and Tom Riley, Kaben Research Inc.

Seste Dell'Aera and Tom Riley, Kaben Research Inc., Osgoode, Ontario, Canada

SETCOM Wireless

Seth Godin, Review by Gary Lerude

Shahar Peleg, Siklu

Shailender Timiri

Shane Collins and Kieran Flynn

Shanghai Simgui Technology Co., Ltd.

Shangyao Huang, Yanjie Wang and Xianfeng Que, South China University of Technology

Shanmukha Venkatesh and Amit Gulhane, MarketsandMarkets

Shaojun Li, Xidian University, Xi’an, China

Sharwan Ram, Madanapalle Institute of Technology & Science, Madanapalle, India

Shaun Cummins, Nujira Limited, Cambridge, UK

Shaun McFall, Harris Stratex Networks, San Jose, CA

Shawn Cheadle, Cougar Components Corp.

Shawn Cheadle, Lockheed Martin Space Systems, Denver, CO

Shawn Cheadle, Teledyne Cougar Inc

Shawn Logan, IEEE, Andover, Mass.

Shawn P. Stapleton

Shay Gross, Lawrence P. Dunleavy and Thomas M. Weller

Carl Sheffres

Sheng Chang, Qijun Huang and Jin He, School of Physics and Technology, Wuhan University, Wuhan, China

Sheng Zhang, China University of Mining and Technology

Sheng Zhang, Jian-Kang Xiao and Ying Li, Shanghai University

Sheng Zhang, Jian-Kang Xiao, Zi-Hua Wang and Ying Li, Shanghai University Shanghai, China

Sheng Zhang, Tian-Jian Bian and Yao Zhai, China University of Mining and Technology

Shengbiao An, Hebei University of Science and Technology, Shijiazhuang, China

Shengyi Technology

Sheppard Leger Nowak Inc.

Sheri DeTomasi, Keysight Technologies, Santa Rosa, Calif.

Ashraf Sheria North-West University

Ashraf Sheria

Sherif Ahmed and Andreas Schiessl, Rohde & Schwarz, Munich, Germany

Sherif R. Zahran, Emilio Arnieri, Giandomenico Amendola and Luigi Boccia, MAIC-LAB University of Calabria, Rende, Italy

Sherry Hess

Sherry Hess, AWR Corp.

Sherry Hess, VP Marketing, AWR Corp.

Sherry Hess, WIM Organizer

Cameron Sheth

Shiban K. Koul and Chaitanya Mahajan, C.A.R.E, Indian Institute of Technology, Delhi, India

Shiban K. Koul and Chaitanya Mahajan, C.A.R.E, Indian Institute of Technology, Delhi, India

Shiban K. Koul and Karthikeya G. S, Center for Applied Research in Electronics, IIT Delhi, India

Shiban K. Koul and Pranav K. Srivastava, C.A.R.E, Indian Institute of Technology, Delhi, India

Shiban K. Koul, Centre for Applied Research in Electronics, IIT Delhi, New Delhi, India

Shiban K. Koul, Indian Institute of Technology, Delhi, India

Shiqi Feng and Victor Wollesen, Per Vices Corporation Toronto, Canada

Shiva Khani and Mohsen Hayati, Islamic Azad University, Kermanshah, Iran

Shivansh Chaudhary and Eddie Rodriguez, National Instruments, Austin, Texas

Shivansh Chaudhary, National Instruments, Austin, Texas

Shiwei Zhao, Chongqing University of Posts and Telecommunications

Shiwei Zhao, Chongqing University of Posts and Telecommunications; Xiaosen Dai, Shanghai Radio Equipment Research Institute

Shiwei Zhao, Zongxi Tang and Ping Su, University of Electronic Science and Technology of China, Chengdu, China

Shiyong Li and Houjun Sun Beijing Institute of Technology, Beijing 100081 People’s Republic of China

Shmuel Auster

Shmuel Auster

SHOW: A.T. Wall

SHUMIN WANG AND HAI L, AUBURN UNIVERSITY, AUBURN, AL; C.J. REDDY, EM SOFTWARE & SYSTEMS (USA) INC., HAMPTON, VA

Shumin Wang, Hai Lu, Auburn University; C.J. Reddy, EM Software & Systems (USA) Inc.

SIAE MICROELETTRONICA Milan, Italy

SIAE MICROELETTRONICA Milan, Italy

SIAE MICROELETTRONICA S.P.A. Milan, Italy

SIAE MICROELETTRONICA, ErreBi Servizi and G&G Eléctronique

Siemens

Siemens AG

Siemens Semiconductors

Sierra Nevada Corp.

SiGe Semiconductor Inc.

SIGFOX

Siglent

SIGLENT Technologies, Solon, Ohio

SIGLENT Technologies, Solon, Ohio

Sigma

Sigma Systems Corp.

Sigma Systems Corp., El Cajon, CA

Signal Antenna Systems (SAS)

Signal Antenna Systems (SAS)

Signal Hound

Signal Hound, Battle Ground, Wash.

Signal Hound, Battle Ground, Wash.

Signal Hound, Battle Ground, Wash.

Signal Hound, Battle Ground, Wash.

Signal Hound, Battle Ground, Wash.

Signal Hound, Battle Ground, Wash.

Signal Hound, Battle Ground, Wash.

Signal Hound, La Center, Wash.

Signal Microwave, Chandler, Ariz.; GigaProbes, San Carlos, Calif.

Signal Microwave, LLC

Signal Microwave, LLC, Tempe, Ariz.

Signal Technology Corp.

SignalCore, Austin, Texas

Sijia Deng, Christopher J. Slezak, George R. MacCartney Jr. and Theodore S. Rappaport, NYU WIRELESS, NYU Polytechnic School of Engineering

Siklu

Silicon Image Inc.

Silicon Laboratories

Silicon Labs

Silvus Technologies

Simon Barke, University of Florida Precision Space Systems Laboratory, Gainsville, Fla.

Simon Grant, Knowles Corporation Precision Devices, Cazenovia, N. Y.

Simon L. Cotton and William G. Scanlon Queen’s University Belfast, UK

Simon L. Cotton and William G. Scanlon, Queen's University of Belfast; Efstratios Skafidas, University of Melbourne; Bhopinder K. Madahar, Ministry of

SIMULIA, Dassault Systèmes

Sinisa Jovanovic and Ivana Radnovic, IMTEL Komunikacije, Belgrade, Serbia

Sirenza Microdevices

SiTime Corp., Santa Clara, Calif.

SiTune, San Jose, Calif.

Sivers IMA AB

Sivers IMA AB, Kista, Sweden

Sivers IMA, Kista, Sweden

Sivers Semiconductors, Kista, Sweden

Sivers Semiconductors, Kista, Sweden

Skylogic

Skyworks Solutions

Skyworks Solutions Inc.

Skyworks Solutions Inc., Irvine, Calif.

Skyworks Solutions Inc., Woburn, MA

Skyworks Solutions Inc., Woburn, MA

Skyworks Solutions Inc., Woburn, Mass.

Skyworks Solutions, Inc., Irvine, Calif.

Skyworks, Cork, Ireland

SLN Marketing

Small Cell Forum

Smart Electronics

Smart Equipment Technology (SET)

Smith Marketing Services

Smiths Group

Smiths Group plc

Smiths Interconnect

Smiths Interconnect, Stuart, Fla.

Soitec

Solon J. Spiegel, RIO SYSTEMS, Giv’at Shmuel, Israel

Solution Paper, Motorola

Somnath Mukherjee, Mridul K. Pal, Ralph Inducta

Somnath Mukherjee, RB Technology

Sondrel

Sonja R. Nedeljkovic, John R. McMacken, Paul J. Partyka and Joseph M. Gering, RFMD

Sonnet

Sonnet Software

Sonnet Software Inc.

Sonnet Software Inc., North Syracuse, NY

Sonoscan

Sony Corporation

Soo Deok Moon and Hee Yong Hwang, Kangwon National University

Sophia Hsu and Yusuke Tajima, ACCO USA Corp.

Sophia Wireless Inc.

Sophia Wireless Inc., Chantilly, VA

Giovanni Bianchi, Advantest Europe GmbH;Fabrizio Gentili and Roberto Sorrentino, University of Perugia; Laura Urbani and Luca Pelliccia, RF Microtech SRL

Soufiane Tebache, Electrical Engineering Department, National Polytechnic School of Algiers, Algeria

Southwest Antennas, San Diego, Calif.

Southwest Microwave Inc., Tempe, Ariz.

Space Data Corp.

Space Tech Conference 2014

Spacecom

Spacek Labs Inc., Santa Barbara, CA

Spacek Labs, Santa Barbara, Calif.

Special Hermetic Products Inc.

Specialist Microwave Solutions Ltd.

Specialty Coating Systems

Spectra7 Microsystems Inc.

Spectracom

Spectrum

Spectrum Control

Spectrum Control Inc.

Spectrum Control, Fairview, Pa.

Spectrum Elektrotechnik GmbH, Munich, Germany

Spectrum Instrumentation Corp.

Spectrum Instrumentation GmbH, Grosshansdorf, Germany

Spectrum Instrumentation GmbH, Grosshansdorf, Germany

Spectrum Instrumentation, Grosshansdorf, Germany

Spectrum Instrumentation, Grosshansdorf, Germany

Spectrum Microwave Delmar, DE

Spectrum Systementwicklung GmbH

Spectrum Systementwicklung Microelectronic GmbH, Grosshansdorf, Germany

Spinnaker Microwave

SPINNER

Spinner GmbH and Precision Tube Co.

SPINNER GmbH, Munich, Germany

Spinner GmbH, Munich, Germany

SPINNER GmbH, Munich, Germany

Spirent

Spirent Communications

Spirent Communications plc

Spirent Communications, Sunnyvale, CA

Spirent/ETS-Lindgren

Spreadtrum Communications Inc.

Sprint/T-Mobile

Sravan Kundojjala, Lead Analyst, Strategy Analytics

SRC

SRC Inc.

SRCTec

SRI Connector Gage

Sridhar Kanamaluru, IMS2018 General Chair

Srikanth Sridharan

Srikanth Sridharan, Peregrine Semiconductor, San Diego, CA

SSI Cable Corp.

ST-Ericsson

St. D. Ilcev

St. D. Ilcev – Durban University of Technology (DUT)

St. D. Ilcev, Durban University of Technology (DUT)

Stackpole

Stacy Baniszewski, Allison Greco, James T. Walsh

staff

Stan Oda, Anritsu, Morgan Hill, Calif.

Stanford Research Systems Inc., Sunnyvale, CA

Stanford Research Systems, Sunnyvale, CA

Stanford Telecom, Telecom Component Products Group

Stanislaw Alechno

Mark Stanley

State of the Art Inc.

STEALTH Concealment Solutions Inc.

Stealth Microwave

Steatite

Steatite Q-par Antennas

Stefan Pongratz, Anritsu

Stefan Pongratz, Dell’Oro Group, Redwood City, Calif.

Stefan Zehle

Stefanie Lucas, slucas@remcom.com

Stefano Maddio University of Florence, Florence, Italy

Stefano Moscato and Alessandro Fonte, R&D Microwave Laboratory, SIAE MICROELETTRONICA, Cologno Monzese (MI), Italy

Stefano Selleri

Stefano Selleri, University of Florence

Steffen Heuel and Andreas Roessler, Rohde & Schwarz, Munich, Germany

Steffen Heuel and Darren McCarthy, Rohde & Schwarz, Munich, Germany

Steffen Heuel, Tobias Köppel and Sherif Ahmed, Rohde & Schwarz, Munich, Germany

Stellant Systems, Torrance, Calif.

Stepan Lucyszyn, EuMC 2011 Conference Chair

Stéphane Elisabeth, System Plus Consulting, Cédric Malaquin, Yole Développement (Yole)

Stephane Wloczysiak, Skyworks Solutions, Inc.

Stephanie Knight, Filtronic Compound Semiconductors Ltd.; Bill Johnson, Johnson Graphic Arts, San Francisco welcomes all IEEE

Stephen A. Maas

Stephen A. Maas and Ted Miracco

Stephen A. Maas, Nonlinear Technologies Inc., Long Beach, Calif.

Stephen D. Turner, Teledyne Paradise Datacom, State College, PA; Tom Dekker, Cree Inc., Durham, NC

Stephen Harman, Aveillant Ltd., Cambridge, U.K.

Stephen Heiser

Stephen J. Kovacic, Foad Arfaei Malekzadeh, Hassan Sarbishaei, Skyworks Solutions, Woburn, Mass.

Stephen L. Pendergast, 4ward Sciences, San Diego, Calif.

Stephen M. Hanham, University of Birmingham, Birmingham, U.K.

Stephen McClelland

Stephen Morley, TE Connectivity

Stevan Preradovic

Stevan Preradovic and Nemai C. Karmakar Electrical & Computer Systems Engineering, Monash University

Steve C. Cripps

Steve Dudkiewicz, Maury Microwave Corp., Ontario, CA

Yoshiyuki Yanagimoto, Keysight Technologies, Santa Rosa, Calif; David Vye and Marc Vanden Bossche, National Instruments, Austin, Texas; Steve Dudkiewicz, Maury Microwave, Ontario, Calif; Vince Mallette, Focus Microwaves, Montreal, Canada

Steve Dudkiewicz, Maury Microwave, Ontario, Calif.

Steve E. Avery and Richard Barber, Cobham Advanced Electronics Solutions, San Jose, Calif.

Steve Egolf

Steve Fry, Greenray Industries Inc.

Steve Huettner, Nuvotronics LLC, Radford, VA

Steve Hurwitz, Dir. of Product Marketing, ADI

Steve Kenney and John Papapolymerou, IMS2021 General Co-Chairs

Steve Loyal

Steve Maas

Steve Maas, Applied Wave Research Inc.

Steve Maas, J. Delacueva, J. Li and S. White

Steve Munns, ADI

Steve Murray , Keithley

Steve Reyes Anritsu Co., Morgan Hill, CA

Steve Reyes, DCM Industries Inc.

Steve W. Y. Mung, Research and Development Office, The Education University of Hong Kong, Hong Kong

Steve Williams, RT Logic, an Integral Systems Company, Colorado Springs, CO

Steven Fry, Greenray Industries

Steven G. Pytel JR., PHD.

Steven Gao, University of Kent, Canterbury, U.K.

Steven Gao, University of Kent, Canterbury, U.K.

Steven Norsworthy, RF2BITS, Inc., San Diego, Calif.

Steven Pong, Infinite Electronics, Irvine, Calif.

Steven R. Wilkinson, Charlie Hansen, Barry Alexia, Bishara Shamee and Brian Lloyd, Raytheon Intelligence & Space, El Segundo, Calif.

Steven Theeuwen, NXP Semiconductors

Stilwell Baker Inc.

STMicroelectronics

STMicroelectronics Inc.

STMicroelectronics/CMP

Storm Products

Strand Marketing

Strand Marketing Inc.

StratEdge

Strategic Defence Intelligence

Strategy Analytics

Structural Research & Analysis Corp.

Stuart Glynn, Robert Smith, Liam Devlin, Andy Dearn and Graham Pearson, Plextek RFI Ltd., U.K.

Stuart Little, Director of Global and Corporate Marketing of Aviat Networks

Stuart Little, Harris Stratex; Trevor Manning, TMC Global Ltd.

Stuart P. Litt

Su Yongbo, Zhao Hua, Ding Wuchang and Ding Peng, Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China

Su-Wei Chang, Ethan Lin, Andrew Wu and Jackrose Kuo, TMYTEK, New Taipei City, Taiwan

Sub10 Systems

Sub10 Systems/HUBER+SUHNER

Sumitomo Corporation

Sumitomo Electric Device Innovations USA Inc., San Jose, Calif.

Sumitomo Electric Industries, Ltd.

Summitek Instruments

Summitek Instruments Inc., Englewood, CO

Sun-Sook Kim, Jong-Hwan Lee and Kyung-Whan Yeom, Chungnam National University

SunCastle Microwave LLC

Sunday Achimugu, Abraham Usman Usman, Suleiman Zubairu, Federal University of Technology, Minna Minna, Nigeria

Sunder Gopani

SunEdison Inc.

Sungchan Jung, Samsung Techwin

Sungtek Kahng and Dongjin Lim, University of Incheon, Incheon, Korea

Sungwoo

Sunsight Instruments

Sunstone Circuits

Superconductor Technologies Inc.

Suren Singh, Keysight Technologies, Santa Rosa, Calif.

Suresh Ram and Jagjit Singh Bal, Infineon Technologies, Milpitas, Calif.

Surinder Kumar, Abbas Mohammadi and David Klymshyn

Surrey NanoSystems

SUSS

SUSS MicroTec

SUSS MicroTec Test System

SUSS MicroTec Test Systems

SUSS MicroTec Test Systems, Dresden, Germany

Suss/Rosenberger

Susumu Deutschland GmbH, Eschborn, Germany

SV Microwave

SV Microwave Inc., an Amphenol company, West Palm Beach, FL

SV Microwave, Commercial Products Group

SV Microwave, West Palm Beach, FL

Sven König, Langer EMV-Technik GmbH, Bannewitz, Germany

SW Filter Design

Daniel Swanson

SWE-DISH

Swift Bridge Technologies

SWISSto12

SWISSto12 SA, Renens, Switzerland

Marc Esquius-Morote, Jean-François Zürcher and Juan R. Mosig, Laboratoire d’Electromagnétisme et d’Acoustique (LEMA), Ecole Polytechnique Fédérale de Lausanne (EPFL), Switzerland, Benjamin Fuchs, IETR/University of Rennes I, France

Syfer Technology

Symmetricom

Symmetricom Inc.

Symmetricom® Inc.

Synergy Microwave Corp

Synergy Microwave Corp., Paterson, N.J.

Synergy Microwave Corp., Paterson, NJ

SynMatrix Technologies Inc., Toronto, Canada

SynMatrix Technologies Inc., Toronto, Canada

SynMatrix Technologies Inc., Toronto, Canada

SynMatrix, Richmond Hill, Canada

SynMatrix, Richmond Hill, Ontario, Canada

Syntonic Microwave Campbell, Calif.

Sypris Electronics/ Cassidian

Sypris Solutions Inc.

Sypris Test & Measurement Inc.

Syrlinks, Cesson-Sevigne, France

Mercury Systems

T

T. AlSharabati and Y. Chen, University of South Carolina, Columbia, SC

T. Jamsa, J. Malm<sup>1.</sup>; N. Gross, A. Scannavini<sup>2.</sup>

T. Johansson, P. Lundin, J. Engvall, D. Uggla and U. Hagström

T. Korosec, P. Ritosa, B. Batagelj and M. Vidmar University of Ljubljana, Slovenia

T. Pan, K. Song and Y. Fan, University of Electronic Science and Technology of China, Chengdu, China

T. Santos, L. C. Costa, M. Valente, J. Monteiro, J. Sousa

T. Warnagiris, Southwest Research Institute

T.K. Tsang and M.N. El-Gamal, McGill University; W.S. Best, Triangle ElectroMagnetics LLC; H.J. De Los Santos, NanoMEMS Research LLC

T.T. Chia, DSO National Laboratories and Temasek Laboratories, National University of Singapore

Tabor Electronics Ltd.

Taconic

Taconic Advanced Dielectric Division

Taconic Advanced Dielectric Division, Petersburgh, NY

Tadeusz Brenner, Leszek Lamentowski and Roman Mularzuk, PIT-RADWAR S.A.

Tahoe RF Semiconductor

Tahoe RF Semiconductor Inc.

Tahoe RF Semiconductor, Auburn, CA

Tailei Wang, Xi Wang, Rongwei Wang, Rensheng Xie, Dong Chen and Shouzheng Zhu, East China Normal University, Shanghai, China

Taiwan Union Technology Corp.

Taj Manku and Oleksiy Kravets, Cognitive Systems, Waterloo, Canada

Takao Inoue and David Vye, AWR Group, NI, El Segundo, Calif.

Takao Inoue, National Instruments, Austin, TX

Takao Ishida, Mitsubishi Electric Corp. Itami City, Hyogo, Japan

Tamagawa Electronics, Ayase, Japan

Tamarind Phinisee

Tamas Madarasz, Nokia, Espoo, Finland

Tamir Moran, Menlo Microsystems, Irvine, Calif.

Tampa Microwave

Tampa Microwave Inc., Tampa, FL

Tanbir Haque, Leonid Kazakevich and Alpaslan Demir, InterDigital Communications Corp.

Tango Wave

Tanner EDA

Taoglas

Taoglas, San Diego, Calif.

Tapani Ryhänen, Mikko A. Uusitalo, Olli Ikkala and Asta Kärkkäinen

Taro Eichler, Ute Philipp, Heinz Mellein and Lorenz Rädler, Rohde & Schwarz, Munich, Germany

Tarun Amla, Isola Group, Chandler, Ariz.

TASC Inc.

Tata Elxsi Ltd.

Tatsuo Itoh

Tatsuo Itoh, Technical Program Chair, IMS 2007

Tazca Connects

TDK Corporation

TDK-EPC

TE Connectivity

TE Connectivity

Tecdia, Santa Clara, CA

Tech Brief, Tektronix

Tech-Inter

Tech-Inter

Tech-Inter

Tech-Inter

Tech-Inter

Tech-Inter

Tech-Inter

Tech-X Corporation, Boulder, Colo.

TechCrunch

Technical Communities

Technical Research and Manufacturing Inc. (TRM)

Technicolor

Technology Business Research, Inc.

Technology Service Corp., Fairfax, VA

TechPlus Microwave

Techtrol Cyclonetics

TECOM

TECOM Industries Inc.

Tecore Networks

Ted Heil, Bill Roehrich and Jack Hakoupian

Ted McKenna, eDefense Online

Ted McKenna, Journal of Electronic Defense

Ted Miracco, Applied Wave Research Inc.

Ted Prema, Times Microwave Systems, Wallingford, CT

Ted Saad

Ted Saad and David Vye

Ted Saad, Harlan Howe, Jr., Peter Staecker and Glen Thoren Former IMS Chairmen Fred Schindler IMS Chairman 2009

TEGAM Inc.

Tekamul Buber, Pragti Narang, Giampiero Esposito and Sathya Padmanabhan, Maury Microwave, Ontario, Calif.

Tektelic Communications

Tektronix

Tektronix Application Note

Tektronix Component Solutions

Tektronix Inc.

Tektronix Inc., Beaverton, Ore.

Tektronix Service Solutions

Tektronix, Beaverton, OR

Telecommunications

Telecommunications Magazine Staff

Telecommunications staff

Telecommunications Staff, from news sources

Telecompetitor

Teledyne Coax Switches

Teledyne Defence

Teledyne e2v

Teledyne e2v Semiconductors

Teledyne e2v Semiconductors

Teledyne Electronics and Communications Europe

Teledyne Labtech

Teledyne LeCroy

Teledyne Ltd.

Teledyne Microwave Solutions, Mountain View, Calif.

Teledyne Microwave Solutions, Mountain View, Calif.

Teledyne Microwave Solutions, Rancho Cordova, CA,

Teledyne Microwave, Mountain View, CA

Teledyne Paradise Datacom, Rancho Cordova, Calif.

Teledyne Paradise Datacom, State College, Pa.

Teledyne Relays, a Teledyne Technologies company

Teledyne Relays, Hawthorne, Calif.

Teledyne Reynolds UK

Teledyne Reynolds, Newbury, UK

Teledyne Storm Products

Teledyne Technologies Inc.

Telefónica

Telegärtner

Telegärtner Karl Gärtner GmbH, Steinenbronn, Germany

Telemakus

Telemakus LLC

Telespazio

TeliaSonera

Telit

Telit Communications

Telit Wireless Solutions

Telonic Berkeley Inc.

Temex

TEMWELL

Tensolite, a Carlisle company

Terence W. Barrett

Terma

Terma Group

Terma/Printca

Tero Kiuru and Henrik Forstén, VTT Technical Research Centre of Finland Ltd., Espoo, Finland

Tero Ranta and Rodd Novak, Peregrine Semiconductor

Terry Edwards

Terry Edwards, Engalco-Research, Bridlington, England

Teseq

Teseq AG

Teseq Holding AG

Teseq Inc.

Teseq Ltd.

Teseq UK

test

Test Equipment Connection Corp.

Test Equipment Plus

Testing Technologies

TestMart

TestWorld Inc.

Tetsuo Sato and Chris Grigorean, Hitachi Semiconductor (America) Inc.

Texas Instruments

Texas Instruments Inc.

Texas Instruments, Dallas, Texas

Texas Microwave & Surplus

Thai Hoa Duong and Ihn S. Kim, Kyung Hee University, South Korea

Thaicom Public Company Limited

Thales

Thales Alenia Space

Thales Alenia Space España

Thales Electron Devices

Thales MESL, Edinburgh, Scotland

Thales Nederland

ThalesRaytheonSystems

The American Society of Breast Surgeons

The Associated Press

The EDA Consortium

The Ferraro Group

The Global Semiconductor Alliance

The IEEE

The IET

The Institute for System Level Integration

The Institution of Engineering and Technology

The International Microwave Symposium

The Micromanipulator Co.

The Microwave Journal Staff

The Phoenix Company of Chicago Inc.

The Rt Hon Matt Hancock MP

The Vitec Group

The Wi-Fi Alliance

The WiMAX Forum

The Z-Wave Alliance

The ZigBee Alliance

The ZigBee® Alliance and the Wi-Fi Alliance®

Theodore (Ted) S. Rappaport, Mingjun Ying and Dipankar Shakya, NYU WIRELESS, Tandon School of Engineering, New York University, Brooklyn, N.Y.

Theodore S. Rappaport, Director of NYU WIRELESS, New York, NY

Theodore Trembinski

Thi Thu Nga Tran, Chirn Chye Boon, Manh Anh Do and Kiat Seng Yeo, Nanyang Technological University, Singapore

Thierry Guillemin, Intelsat, Luxembourg District, Luxembourg

Thilo Bednorz and Jochen Wolle, Rohde & Schwarz, Munich, Germany

ThinKom Solutions Inc.

thinkRF

ThinkRF, Ottawa, Ontario

Thintri Inc.

Thomas Arthur, Valpey Fisher Microwave Products Group, Hopkinton, MA

Thomas Boegl, Rohde & Schwarz, Munich, Germany

Thomas Cameron, Analog Devices Inc., Norwood, Mass.

Thomas Chen, Donuwan Navaratne, Tom Huang, Habib Rastegar, Patrick Houghton and Andrew Chen, SwiftLink Technologies, Richmond, Canada

Thomas Elliott and Russel Lindsay, Anritsu Corporation, Morgan Hill, Calif.

Thomas Gneiting, AdMOS GmbH, (http://www.admos.de), Adrian Scott, CST AG, (http://www.cst.com)

Thomas Gneiting, AdMOS GmbH, Adrian Scott, CST AG

Thomas J. Warnagiris

Thomas Jungmann, Texterei Jungmann, Wangen, Germany

Thomas Jungmann, Texterei Jungmann, Wangen, Germany

Thomas Kleine-Ostmann, Buy Harles

Thomas Neu, Texas Instruments, Dallas, Texas

Thomas P. Budka, David Antopolsky and Matthew T. Pizzella

Thomas Roeder and Dr. Carolin Troester, Rohde & Schwarz

Thomas Sporkmann

Thomas Zwick, EuMW General Chair, Karlsruhe Institute of Technology and Vadim Issakov, EuMW General Co-Chair, Technical University Braunschweig

Thorbjörn Ebefors, Silex Microsystems AB, Järfälla, Sweden; Joachim Oberhammer, KTH Royal Institute of Technology, Stockholm, Sweden

Thunderline-Z

TiaLink Inc.

TiaLinx

TiaLinx Inc.

Tian Qi, University of Electronic Science and Technology of China, Chengdu, China

Tianze Su, Shanghai Transcom Instrument Technologies Co. Ltd., Shanghai, China

Ticer Technologies

Tim Boles, MACOM, Lowell, Mass

Tim Das, NXP

Tim Galla, Fairview Microwave, Lewisville, Texas

Tim L. Hillstrom, Agilent Technologies

Tim Lee, IMS2020 General Chair

Tim Smith, Cameron Staton and Bill Rhyne, Cubic Nuvotronics, Durham, N.C.

Times Microwave Systems

Times Microwave Systems Wallingford, Conn.

Times Microwave Systems, Wallingford, Conn.

Timo Reinhardt

Timothy Boles and Andrew Freeston - M/A-COM Technology Solutions, Lowell, MA

Tina Quach, General Chair

Ting Lang, Lin Li, Li-Li Yang and Zhi-Hao Zhang, Zhejiang Sci-Tech University, Hangzhou, China

TJ Green Associates LLC

TMD Technologies LLC

TMD Technologies Ltd.

TMYTEK

TNO

Tobias Lindström, National Physical Laboratory, U.K.

Tobias Willuhn and Goetz Mayser, Rohde & Schwarz, Munich, Germany

Todd Gillenwater, Mobile Products CTO and VP of Engineering, Qorvo, Greensboro, N.C.

Toko America Inc.

Tokyo Keiki

Tom Brinkoetter, Anritsu Company

Tom Cameron

Tom Galla

Tom Hill, Tektronix Inc., Beaverton, OR

Tom Lam, Rich Bidwell and Scott Blee, Lockheed Martin, Owego, NY

Tom McWalters, Microwave Development Labs, Needham, MA

Tom Newman

Tom Nolle

Tom Raschko, IMS 2013 General Chairman

Tom Rosa, Terabeam-HXI — Haverhill, MA

Tom Weller, David Markell, John Capwell and Vivi Cojocaru

Tomasz Waliwander, Farran, Cork, Ireland

Tommi Jamsa and Juha Ylitalo, Elektrobit

Tommi Jämsä, Anite

Tony Balistreri, R&D Manager, TriQuint Semiconductor

Tony Brown, EuRAD 2011, Conference Chairman

Tony Edridge; M2 Global Technology Ltd. San Antonio, TX

Tony Fattorini and David A. Richardson, Mimix Broadband Inc. Houston, TX

Tony Fedor, Times Microwave Systems, Wallingford, Conn.

Tony Gasseling, Amcad-Engineering, Limoges, France

Tony Lymer, Satori-Technology Ltd.

Tony Mattingly, Rogers Corp., Chandler, Ariz.

Tony Trinh, Mercury Systems, Andover, Mass.

Tore N. Anderson, Airtron Inc.

Toshiba Imaging

TotalTemp Technologies

Tower Semiconductor Ltd.

TowerJazz

TowerJazz and Presto Engineering

TowerJazz Panasonic Semiconductor Co. (TPSCo)

TowerJazz, Newport Beach, CA

Towerstream Corporation

TRAK Microwave Corp.

TRAK Microwave, Tampa, Fla.

Trans-Tech

Transline Technology Inc.

Trescal

Triad RF Systems Inc., East Brunswick, NJ

Triad Semiconductor Inc. and Kaben Wireless Silicon Inc.

Trilithic

Trilithic Inc.

Trimble

Triquint

TriQuint Semiconductor

TriQuint Semiconductor and Agilent Technologies Inc.

TriQuint Semiconductor Design Center

TriQuint Semiconductor Inc.

TriQuint Semiconductor Inc.

TriQuint Semiconductor Inc., Hillsboro, OR

TriQuint Semiconductor Inc.</

TriQuint Semiconductor, Hillsboro, Oregon

TriQuint Semiconductor, Richardson, TX

TriQuint/VIPER RF

Trisynt Technology Inc., Wilmington, Del.

TRM Microwave

TRM Microwave

Troels Emil Kolding

Tronics

TRU Corp., Peabody, MA

TS2 Satellite Technologies

Tsang-Yen Hsieh and Nai-Chueh Wang, National Central University

Daniel S. Green, U.S. Defense Advanced Research Projects Agency (DARPA), Arlington, Va.; Carl L. Dohrman, Jeffrey Demmin, Yan Zheng, Booz Allen Hamilton Inc., Arlington, Va.; Tsu-Hsi Chang, HetInTec Corp., Rockville, Md.

TT electronics

TT electronics plc

TTE Filters

Tudor Williams, Filtronic, Sedgefield, England

Tudor Williams, Randeep Saini and Simon Mathias, Mesuro UK; Andreas Henkel, Rohde & Schwarz

Tyco Electronics

U

U.L. Rohde and A.K. Poddar

U.L. Rohde and A.K. Poddar, Synergy Microwave Corp.

U.S. Air Force

U.S. Army

U.S. Department of Transportation

U.S. Navy

Ubidyne

UBIFRANCE Press Office, London

UBM Electronics

UBM Tech

UBM Tech Electronics

UC San Diego

UC San Diego

Ulf Huegel, Alejandro Garcia-Tejero, Rafal Glogowski, Eugen Willmann, Michael Pieper and Francesco Merli, HUBER+SUHNER, Herisau, Switzerland

Uli B. Koelle, Avago Technologies, San Jose, Calif.

Ulrich L. Rohde and Ajay K. Poddar, Synergy Microwave Corp., Paterson, N.J., USA

Ulrich L. Rohde and Ajay K. Poddar, Synergy Microwave Corp., Paterson, NJ

Ulrich L. Rohde and Ajay K. Poddar, Synergy Microwave, Paterson, NJ

Ulrich L. Rohde, Ajay K. Poddar and Anisha M. Apte, Synergy Microwave Corp., Paterson, NJ

Ulrich L. Rohde, Brandenburgische Technische Universitat, Cottbus, Germany; Ajay K. Poddar, Synergy Microwave, Paterson, N.J.

Ulrich L. Rohde, Brandenburgische Technische Universitat; Ajay K. Poddar, Synergy Microwave Corp.

Ulrich L. Rohde, Federal Armed Forces University, Munich, Germany ; Ajay K. Poddar, Synergy Microwave, NJ

Ulrich L. Rohde, Jerry C. Whitaker, Hans Zahnd

Ulrich L. Rohde, Synergy Microwave, Paterson, N.J., Center for Integrated Sensor Systems, Universität der Bundeswehr, Munich, Germany

Ulrich L. Rohde, Univ. der Bundeswehr, Technische Informatik Munich, Germany

Ulrich L. Rohde, Universitat der Bunderwehr and Thomas Boegl, Rohde & Schwarz, Munich, Germany

Ulrich L. Rohde, University der Bundeswehr, Department of Informatics, Microwave Systems, Munich, Germany

Ulrich L. Rohde, University of the Armed Forces Federal University, Munich, Germany

Ulrich L. Rohde, University of the Bundeswehr, Technische Informatik Munich, Germany, Thomas Boegl, Rohde & Schwarz, Munich, Germany

Ultra Electronics Command & Control Systems

UltraSource

UltraSource Inc.

UltraSource Inc. Hollis, NH

UltraSource Inc., Hollis, NH

UMS

UMS/Agilent Technologies

Umut Bulus, Antenom Antenna Technologies Inc., Ankara, Turkey

United Computer and Telecommunication Inc. (UCT)

United Microelectronics Corporation (UMC)

United Monolithic Semiconductors S.A.S.

United Monolithic Semiconductors SAS, France

United Monolithic Semiconductors, Paris, France

Unity Wireless Systems Corp.

Universal Microwave Technology

Universal Switching Corp.

University of Bristol, Bristol, UK

University of Chinese Academy of Sciences, Beijing, China

University of Chinese Academy of Sciences, Beijing, China

K.D. XU1,2, Y.H. ZHANG1, W.T. JOINES2, Q.H. LIU2 AND Y. FAN1 University of Electronic Science and Technology of China1, Chengdu, China Duke University2, Durham, NC

K.D. Xu1,2, Y.H. Zhang1, Y. Yang1, W.T. Joines2, Q.H. Liu2 and Y. Fan1, University of Electronic Science and Technology of China1, Chengdu, China, Duke University2, Durham, NC

University of Glasgow

University of Manchester

University of South Florida

University of Surrey, UK

uRAD, Navarra, Spain

Urmila Nath, Spectral Energies LLC, Dayton, Ohio

Uros Mavric and Brian Chase, Fermi National Accelerator Laboratory

USCD

UT Austin

UTAC Holdings Ltd.

Utsav Gupta, Antoinette Tan, James Liu and Whitney Lohmeyer, Olin College of Engineering, Needham, Mass.

Utsav Gupta, Antoinette Tan, James Liu and Whitney Lohmeyer, Olin College of Engineering, Needham, Mass.

UW-Madison

UW-Madison

UW-Madison

Uwe Gollor, Wolfgang Wischmann and Rüdiger Follmann, IMST GmbH, Kamp-Lintfort, Germany

Uwe Knorr

Ü

Ünal Isler, DEV Systemtechnik

V

V. Manimala, Builders Engineering College, Tamil Nadu, India

V. Rodriguez, ETS-Lindgren L.P.; S. Matitsine, Matsing Pte. Ltd. and Temasek Laboratories, National University of Singapore

V. Sambasiva Rao, PES University, Bangalore, India; M.C. Basava Raj and L. Nicholas, Formerly With Kavveri Telecom Products Ltd., Bangalore, India

Valence Semiconductor

Valeria Brunel and Eric Leclerc, UMS, France

Valpey Fisher

Valpey Fisher Corp.

Valpey Fisher Corp., Hopkinton, MA

Vanguard EMS and Tektronix Component Solutions

Anaya Vardya

Vari-L Co. Inc.

Vari-L Company Inc.

Varun Joshi, University of Colorado, Boulder, CO.

Vaunix

Vaunix Technology Corp.

Vaunix Technology Corporation

Vector Fields

Vector Fields Inc.

Vector Fields Ltd.

VectorNav Technologies

Vectria Ltd.

Vectron International

Ved Vyas Dwivedi and Y.P. Kosta, MIEEE; Shweta Srivastava and H.B. Pandya, Charotar Institute of Technology

Ved Vyas Dwivedi MIEEE, Y.P. Kosta MIEEE, Shweta Srivastava, H.B. Pandya, Charotar Institute of Technology

Venkat Nandivada and Rohit Ramnath, MasterBond Inc., Hackensack, N.J.

Verizon Communications Inc.

Verotec Inc.

Versatile Power

Versatile Power Inc.

Vertigo Technologies, Delft, The Netherlands

VI Technology

Viasat Inc.

VIAVI Solutions

Vicente Rodriguez Senior Principal Antenna Design Engineer

Vicente Rodríguez, ETS-Lindgren

Vicente Rodriguez, Senior Principal Antenna Design Engineer

Victor Fernandez, Anritsu (U.K.)

Victor Sharir, Galormic; Benny Haddad, Jaakko Juntunen, National Instruments

Victor Steel and Art Morris, WiSpry Inc.

Victor Volkov, Michael Parnes, Victor Korolkov

Vida Products

Vijay Nair, IMS2015 General Chair; Steve Goodnick, IMS2015 Vice-Chair

Viktor Bondarchuk, Jabil Software Services, Lviv, Ukraine

Vince Rodriguez, MI Technologies, Suwanee, Ga.

Vincent Kotzsch NI, Emerson Test & Measurement, Austin, Texas

Vincotech

VIPER RF/WIN Semiconductors

Virginia Diodes, Inc., Charlottesville, Va.

Vishay Intertechnology Inc.

Vishay Precision Group Inc.

Visible Assets Inc.

Vislink

Vista Research

Viswanathan Ganesan, WiMAX Application Engineer, Agilent Technologies

Vitali Penso, Noisecom, a Wireless Telecom Group company, Parsippany, NJ

Vitaly Koslov, Independent Consultant

Vito Giannini, Manju Hegde and Curtis Davis, Uhnder, Austin, Texas

Vladimir M. Gevorkyan and Yuri A. Kazantsev, Moscow Power Engineering Institute, Moscow, Russia

Vladimir Veremey and John Dunn, AWR Corp., El Segundo, CA; Alexander Sulima, AVS Microwave, Toronto, Canada

Volker Aue, AMD-Xilinx, Dresden, Germany

Volker Aue, Xilinx, Dresden, Germany

Shahin Gheitanchi1, Christophe Quindroit2, Patrick Roblin2, Naveen Naraharisetti2, Volker Mauer1 and Mike Fitton1, Altera Corp.1, The Ohio State University2

Volker Mühlhaus, Dr. Mühlhaus Consulting & Software GmbH, Witten, Germany

VPG

VRF Micro Devices Inc.

Vsevolod Tanygin Orion Science Research Institute Kiev, Ukraine

VT Networks

VTI Instruments

VTI Instruments Corp.

Vubiq Inc.

VXI Technology Inc.

David Vye

W

W. Ismail, S.A.Z. Murad, T.J. Jiat and J.S. Mandeep, Universiti Sains Malaysia, Pulau Pinang, Malaysia; P. Gardner, University of Birmingham, UK

W. L. Chen, X. Z. Liu, H.D. Wu and G. J. Wang, Nanjing University; G. P. Li, University of California

W. L. Gore & Associates

W. L. Gore & Associates Inc.

W. L. Gore and Associates (Gore)

W. Simon, J. Kassner, O. Litschke, H. Fischer and S. Holzwarth, IMST GmbH, Kamp-Lintfort, Germany

W. Xue, Y.H. Zhang, Z.J. Feng and Y. Fan, University of Electronic Science and Technology of China, Chengdu, China

W.L. Gore

W.L. Gore

W.L. Gore & Associates

W.L. Gore & Associates Inc.

W.L. Gore & Associates Inc., Landenberg, PA

W.L. Gore & Associates, Inc., Landenberg, PA

W.R. Deal, Y. Qian, T. Itoh and V. Radisc

Wael A. Al-Qaq and JianHua Gu, Ansoft Inc.; William J. Martin and Jeffrey L. Cutcher, Motorola Inc.

WAFIOS Machinery Corporation, Branford, CT / Mokena, IL

Walid Ali-Ahmad, RFIC 2018 General Chair; Stefano Pellerano and Waleed Khalil, RFIC 2018 Technical Program Co-Chairs

Walt Strickler, Boonton Electronics, Parsippany, N.J.

Walt Strickler, Boonton Electronics, Parsippany, N.J.

Walt Strickler, Wireless Telecom Group, Parsippany, N.J.

Walter A. Wohlmuth, Wayne Struble and Domingo Farías, TriQuint Semiconductor

Walter Honcharenko, MACOM

Walter R. Frei, COMSOL Inc.

Walter R. Frei, Ph.D., COMSOL, Inc.

Walter Witt, Amplifonix

WAMICON

WAMICON 2011

WAMICON 2014

Wan-Jong Kim, Kyoung-Joon Cho and Shawn P. Stapleton Simon Fraser University Burnaby, BC, Canada Jong-Heon Kim Kwangwoon University Seoul, Korea

Wan-Thai Hsu, Discera Inc.; W. Scott Best, Triangle ElectroMagnetics LLC; Héctor J. De Los Santos, NanoMEMS Research LLC

Tim Wang Lee

Judy Warner

Warren L. Stutzman and Carey G. Buxton

Watkins-Johnson Co.

Wavepia, Hwaseong, South Korea

WavePro, a Brand of Garlock | an Enpro company, Palmyra, N.Y.

WavePro®, A Garlock Brand, Palmyra, N.Y.

Wavesat Inc.

Wavesat Telecom

Wavestream

Wavestream, San Dimas, CA

Wayne A. Shiroma

Wayne A. Shiroma, General Chair, IMS 2007

Wayne Struble

Weber Shandwick

Wei Jiang, Agere System Co. Ltd.; Xiaowei Zhu, Southeast University

Wei Liu and Da Wenpen, MICable Inc., Fuzhou, Fujian, China

Wei Liu, Guang Yang and Fa-Lin Liu, University of Science and Technology of China

Wei Liu, MIcable Inc., Fuzhou, China

Wei Liu, Mitron Inc., Fuzhou, China

Wei Luo, Hongyuan Zhang, Xiaolong Weng, Haiyan Chen, Wentao He and Kai Li, University of Electronic Science and Technology of China, Chengdu, China

Wei-Ting Lee and Huey-Ru Chuang National Cheng Kung University Tainan, Taiwan, ROC, Chun-Lin Lu Kun Shan University Tainan, Taiwan, ROC

Weichen Huang, Liang Ma, Zhiqiang Yu and Jianyi Zhou, State Key Laboratory of Millimeter Waves, Southeast University Nanjing, China

Weightless SIG

Weilong Tang, Lin Peng and Shaoxin Lin, Guangdong University of Technology, Guangzhou, China

Weinschel Associates

Weinschel Associates, Gaithersburg, MD

Weinschel Corp.

Wen Phan

Wen-Chung Liu and Jiun-Kai Chen, National Formosa University Yunlin, Taiwan

Wen-Ling Chen and Guang-Ming Wang, Missile Institute of Air Force Engineering University, Shaanxi Province, P.R. China; Guo-Dong Chen, Guang-Feng Yao,

Wen-Ling Chen, Guang-Ming Wang and Yi-Na Qi, Missile Institute of Air Force Engineering University

Wen-Shan Chen and Bao-Hung Kao Southern Taiwan University of Technology Tainan Hsien, Taiwan, ROC

Wen-Shan Chen and Fu-Mao Hsieh, Southern Taiwan University of Technology

Wen-Shan Chen and Ho-Yu Lin, Southern Taiwan University of Technology

Wen-Shan Chen and Kai-Cheng Yang, Southern Taiwan University

Wen-Shan Chen and Kuang-Yuan Ku, Southern Taiwan University

Wen-Shan Chen and Kuang-Yuan Ku, Southern Taiwan University of Technology Tainan Hsien, Taiwan, ROC

Wen-Shan Chen and Mao-Kai Hsu

Wen-Shan Chen and Mao-Kai Hsu, Southern Taiwan University of Technology, Tainan Hsien, Taiwan, ROC

Wen-Shan Chen and Sheng-Che Wu Southern Taiwan University of Technology Tainan Hsien, Taiwan, ROC

Wen-Shan Chen and Shih-Hung Cheng, Southern Taiwan University, Taiwan, ROC

Wen-Shan Chen and Yen-Hao Yu, Southern Taiwan University

Wen-Shan Chen and Yu-Chen Chang, Southern Taiwan University of Technology

Wen-Shan Chen, Chi-Huang Lin and Mao-Kai Hsu

Wen-Shan Chen, Ho-Yu Lin S. Taiwan Iniversity of Technology

Wen-Shan Chen, Southern Taiwan University of Technology

Wenming Li, University of Electronic Science and Technology of China, Chengdu, China; Haiwen Liu, Institute of Optics and Electronics, Chinese Academy

Wenteq Microwave

Wenzel Associates, Austin, TX

Werlatone Inc.

Werlatone Inc., Patterson, N.Y.

Werlatone, Patterson, NY

Werner Wild

Wes Fields, Aeroflex / Metelics, Sunnyvale, CA

Wes Littlefield, Vice President, Business Development, Hypres

Wes Mickanin

West Technology Research Solutions

WEST•BOND, Anaheim, Calif.

Weston Sapia, RF Applications Engineer, Linear Technology Corp. / Now Part of Analog Devices, Inc.

White Paper

White Paper, Agilent Technologies

White Paper, AWR Corp.

White Paper, Bridgewave Communications

White Paper, Intelsat

White Paper, Peregrine Semiconductor

White Paper, Polaris Wireless

White Paper, Polaris Wireless, Inc.

White Paper, Skyworks Solutions

Whitney Q. Lohmeyer, Phillip Post, Katie Fleming, Celvi Lisy, Argyris Kriezis and Abby Omer, Olin College of Engineering, Needham, Mass.

Widad Ismail, JS Mandeep and Mohammed Saeed Jawad

Widad Ismail, JS Mandeep, Mohammed Saeed Jawad

Wide Band Systems Inc.

William B. Kuhn and Naveen K. Yanduru

William B. Sullivan

William Bazzy and Carl Sheffres

William Conley, Mercury Systems, Andover, Mass.

William Dunham, Cadence Design Systems Inc., San Jose, CA

William T. Thornton and Lawrence E. Larson

William Walsh, Quantic Wenzel, Austin, Tex.

William Webb, Neul Ltd., Cambridge, UK

William Yu and Urvashi Sengal, Mini-Circuits, Brooklyn, N.Y.

Willie L. Thompson II, Eric V. Miller and Carl White

Willtek Communications

Wilson Electronics

Wilson Electronics, Salt Lake City, Utah

WiMAX Trends

WIN Semiconductors

WIN Semiconductors and Agilent Technologies

WIN Semiconductors Corp.

WIN Semiconductors Corp., Tao Yuan Shien, Taiwan

Winchester Electronics

Winfried Simon and Andreas Lauer, IMST GmbH, Kamp-Lintfort, Germany

Winfried Simon, Aline Friedrich, Oliver Litschke, Markus Krengel, IMST GmbH, Kamp-Lintfort, Germany

Christopher F. Marki, Marki Microwave; Tim Bagwell, TB Engineering; Wing Yau, Yuefei Yang, Chung-Hsu Chen and David Wang, Global Communications Semiconductors

WIPL-D

WiQuest Communications

Wireless Gigabit Alliance

Wireless Telecom Group

Wireless Telecom Group Inc.

Wireless Telecom Group.

WiSilica

WiSpry Inc.

Wissam Saabe, AMCAD Engineering, France

WJ Communications

WJ Communications Inc.

WJ Communications Inc. San Jose, CA

WJ Communications Inc., San Jose, CA

Wolfgang Damm, Product Management Director

Wolfgang Heinrich, General Chairman; Ivar Bazzy, Horizon House Publications Inc.

Wolfgang Heinrich, President, European Microwave Association

Wolfgang Menzel

Wolfspeed

Wolfspeed, Durham, N.C.

Women in Microwave Engineering

Worcester Polytechnic Institute (WPI)

WORK Microwave

World Wireless Communications Inc. (WWC)

Ron Worman

Wurth Electronics Midcom, Inc.

Würth Elektronik

Würth Elektronik eiSos

Würth Elektronik eiSos GmbH & Co. KG

Würth Elektronik eiSos Group

Würth Elektronik iBE

Würth Elektronik IQD

Würth Group

Wurth Wireless Connectivities and Sensors

Wyatt Taylor, RF Engineer, Analog Devices

Wyman L. Williams and James M. Howell, EMS Technologies Inc.

X

X-COM Systems LLC

X-FAB Semiconductor Foundries

X-Microwave

X-Rel Semiconductor

X-Series White Paper

X. Feng, Y.H. Zhang, W. Xue, H. Zhang and Y. Fan, University of Electronic Science and Technology of China, Chengdu, China

X. Li, L. Yang, S.X. Gong, Y.J. Yang, T. Hong and X. Chen, Xidian University, Shaanxi, People’s Republic of China

X. Zhao, T. Haarakangas, J. Katajisto, M. Niemi, P. Myllylä, J. Inget and J. Alasalmi, Elektrobit (EB), Oulu, Finland

X.L. Sun, S.W. Cheung and T.I. Yuk, University of Hong Kong, Hong Kong, China

X.Q. Chen, Y.C. Guo and X.W. Shi, Xidian University

X2Y Attenuators LLC

Xerafy

Xi Wang, Zhihang Tong and Zhi Jin, Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China

Xi Yao, S.C. Jung, M.S. Kim, J.H. Van, H. Cho, S.W. Kwon, J.H. Jeong, K.H. Lim, C.S. Park and Y. Yang, Sungkyunkwan University, Suwon, Korea, H.C. Par

Xi-Zheng Ke, Xi’an University of Technology, Xi’an, China

Xiangmin Li and Zhuang Kang, Yangtze University College of Arts and Sciences, Jingzhou, China

Xianrong Zhang, Qingyuan Wang, Jinhua Cao and Anj Peng, University of Electronic Science and Technology of China, Chengdu, China

Xiao Lu, Agilent Technologies Inc.

Xiao Qun Chen, Ling Xia Wang, Chang Yun Cui and Xiao Wei Shi, Xidian University, Shaanxi, China

Xiaomi

Xiaoming Chen, BreconRidge Manufacturing Solutions

Xiaosen Dai Shanghai Radio Equipment Research Institute

Xiaowu Zhan, Zongxi Tang, Yunqiu Wu and Biao Zhang, University of Electronic Science and Technology of China, Chengdu, Sichuan, China

Xiaoxi Cui, Haihui Yu, Jiqun Jiang, First Research Institute of The Ministry of Public Security, Beijing 100048, People’s Republic of China

Xicom Technology

Xilinx Inc., San Jose, Calif.

Xin Feng, William T. Joines and Qing Huo Liu, Duke University, Durham, N.C.

Xin Feng, Yonghong Zhang, Guide Zhu and Yong Fan, University of Electronic Science and Technology of China, Chengdu, China

Xin Wang, Yuhang Lu, Junlin Wang, Zelong Wang, Tao Liu and Min Wei Inner Mongolia University, Hohhot 010021, China

Xinlin Xia, Zhichen Zhao, Fengjun Chen, Xu Cheng, Xianhu Luo and Xianjin Deng, China Academy of Engineering Physics

XIO Strategies Inc.

Xiongwen Zhao, Elektrobit (EB)

Xiufeng Ren, Zhaojun Zhu, Ke Yang and Yuxin Wang, University of Electronic Science and Technology of China, Chengdu, China

Xiuping Li, Beijing University of Posts and Telecommunications, Beijing, P.R. China; Jianjun Gao, East China Normal University, Shanghai, P.R. China;

Xiuping Li, Beijing University of Posts and Telecommunications, China, Jianjun Gao, Southeast University, Nanjing, China, Georg Boeck, Technische Univ

XL Microwave Inc.

XMA

XMA Corp.

Xpedion Design Systems Inc.

Xpedion Design Systems Inc. and Jazz Semiconductor

Xpeedic Technology, Shanghai, China

Xu Li, Ji-hui Yu, Quan-di Wang and Yong-ming Li

Xu Liang and Chia Yan Wah Michael

Xuanyu Chen, Qi Su, Ting Chen, Linlin Cai, Jiang Luo, Hao Wang,

Xudong Wang, Dawn Wang, Chris Masse and Peter Bacon

Xuhao Zhao, Yongjun Hu, Qiang Zhang, Chengwei Yuan and Jiande Zhang, National University of Defense Technology, China

Xushen Li, Yongpeng Wu and Hairong Zhang, Southern Marine Science and Engineering Guangdong Laboratory, Zhanjiang, China

Y

Y. Pennec, Y. El Hassouani, C. Li, B. Djafari Rouhani, E.H. El Boudouti, H. Larabi, A. Akjouj

Y. Sun, Utrecht T. Tieman, H. Pflung and W. Velthuis

Y. Tkachenko, Y. Zhao, C. Wei and D. Bartle

Y. Vorokhovsky, A. Nikonov, A. Kotyukov and A. Kamochkin, Morion Inc., Russia

Y. Vorokhovsky, A. Nikonov, A. Kotyukov, V. Lyaskovsky, A. Kamochkin and Y. Kolpakov, Morion Inc., Saint Petersburg, Russia

Y. Yang, P. Zampardi, M. Fredriksson, J. Xu, S Chen and G. Zhang, Skyworks Solutions Inc.; J. Sifri, Agilent Technologies / Agilent EEsof EDA

Y.C. Moon, J.R. Lee, S.W. Yun and I.S. Chang

Y.W. Yeap

Y.W. Yeap, E.C. Teh and T.W. Chua

Y.W. Yeap, L.H. Chua and S.H. Tan, Nanyang Technological University

Y.Y. Wei, P. Gale and E. Korolkiewicz

Y.Y. Yang, X.W. Shi, X.H. Wang, X.Q. Chen and D.Z. Chen, Xidian University, Shanxi, China

Yair Shemesh

Yan Christian Venot and Peter Kielhorn, EADS Defence & Security

Yan Dou, Weinan Normal University, Weinan, China and University of Electronic Science and Technology of China, Chengdu, China

Yan Zhou, Beihang University, Beijing, China

Yang Xiao, Lin Li, Gang Liu and Guan-Xing Guo, Zhejiang Sci-Tech University, China

Yang Zhang, Qualcomm Inc.

Yanmin Wang, Shandong University of Science and Technology

Yann Deval, 2010 RFIC General Chair

Yannick Zeller and Tom Beutelspacher, DEV Systemtechnik GmbH

Yanwei Wang, Jianyi Zhou and Wei Hong, Southeast University, Nanjing, PR China

Yao Li, Xiao-Wei Zhu, Ling Tian and Rui-Jia Liu, School of Information Science and Engineering, Southeast University Nanjing, China

Yao Xi, Samsung Electronics

Yao-Huang Kao, Chun-Chieh Chien

Yasin Yousefzadeh and Mohsen Hayati, Razi University, Kermashah, Iran

Yassen Mikhailov, Rohde & Schwarz, Munich, Germany

Yat Sze Choy, Department of Mechanical Engineering, The Hong Kong Polytechnic University, Hong Kong

Yavuz Erol, Department of Electrical and Electronic Engineering Firat University Elazig, Turkiye

Yavuz Erol, Department of Electrical and Electronic Engineering, Firat University, Elazig,Turkey

Ye Yuan, Yong Fan, Ziqiang Yang and Haodong Lin, University of Electronic Science and Technology of China

Yevgeniy A. Tkachenko, Dylan Bartle and Ce-Jun Wei

Yew Hui Liew, Mook Seng Leong and Jurianto Joe

Yezdi Antia, Sam Morrar and Dave Roos, Hughes Network Systems LLC, Germantown, Md.

Yijie Qiu(1,2), Yei Hwan Jung(2), Subin Lee(1,2), Juhwan Lee(2) and Ting-Yen Shih(2);

Yin Zou, Jin Pan and Xinyang Ji, University of Electronic Science and Technology of China

Yingjie Xu, Jingqi Wang and Xiaowei Zhu, Southeast University, Nanjing, China

Yinjin Sun, Xiaowei Zhu and Fan Meng, Southeast University, China

Yitong Xiong and Xiaoping Zeng, Chongqing University, Chongqing, China

YOKOWO Co. Ltd., Tokyo, Japan

Yole Developement

Yong Liao, Institute of Applied Electronics, China Academy of Engineering Physics, Mianyang, China

Yong Liu, Philips Research China; Philips (China) Investment Co. Ltd., Shanghai, China

Yong Zhang and Dafu Lu; University of Electronics Science and Technology of China, Chengdu, China

Yong-Chae Jeong

Yong-Chae Jeong and Sang-Young Yun

Yong-Chae Jeong, Chonbuk National University; Si-Gyun Jeong, Samsung Electronics; Jong-Sik Lim, Korean Intellectual Property Office; and Chul-Dong Kim

Yong-Chae Jeong, Chonbuk National University; Young Kim, Kumoh National Institute of Technology; Chul D. Kim, Sewon Teletech Inc.

Yong-Chae Jeong, Dal Ahn, Chul-Dong Kim, Ik-Soo Chang

Yong-Chae Jeong, Do-Kyeong Hwang and Jong-Sik Lim; Soonchunhyang University, Chonbuk National University and ACE Technology

Yong-Chae Jeong, Young-Jean Song, In-Ju Oh and Chul-Dong Kim

Yong-Qin Liu, Xi’an University of Technology, Xi’an, China, Weinan Normal University, Weinan, China

Yong-Woong Jang

Yong-Woong Jang Keukdong College Chungbuk, Korea Hyun-Chul Go AMC Centurion Korea Co. Ltd. Seoul, Korea

Yong-Woong Jang, Ho-Sub Shin

Yong-Woong Jang, Jeong-Chull Yoon and Ho-Sub Shin

Yong-Woong Jang, Keukdong College

Yong-Woong Jang, Keukdong College; Hyun-Chul Go, Hankook Antenna Co. Ltd.; Sang-Woo Lee, Mokpo Maritime University

Yong-Woong Jang, Keukdong College; Sang Woo Lee, Mokpo National Maritime University

Yong-Woong Jang, Keukdong College; Sang-Woo Lee, Hankook Antenna Co. Ltd.

Yong-Woong Jang, Sang-Woo Lee and Jeong-Hye Kwon

Yong-Woong Jang, Sang-Woo Lee, Jeong-Hye Kwon

Yongin Han and Ihn S. Kim

Yongxi Qian, Roberto Coccioli, Dan Sievenpiper, Vesna Radisic, Eli Yablonovitch and Tatsu Itoh

Yongzhen Gao, ZongXin Tang, Biao Zhang and YunQiu Wu, University of Electronic Science and Technology of China, Chengdu, China

Yongzhong Zhu, Dan Li, Yongjun Xie and Rui Yang, Xidian University

Yongzhong Zhu, Dan Li, Yongjun Xie and Rui Yang, Xidian University, Xian Shaanxi, China

Yorgos Stratakos and Panayotis Betzios, National Technical University

Yoshihisa Amano, Atsushi Yamada, Eiji Suematsu, Hiroya Sato

Young Bin Cho, Kye Suk Jun and Ihn S. Kim, Kyung Hee University; Byung Soo Kim, Shinsung College

Young Kim, Ik-Soo Chang, Yong-Chae Jeong

Young Kim, Ki-Kyung Jeon, Ell-Kou Kim and Byung-Chul Kim, Kumoh National Institute of Technology, Gumi, South Korea

Young Yun

Young Yun and Jang-Hyeon Jeong, Korea Maritime University, Busan, Korea

Young Yun Woo, Youngoo Yang, Jaehyok Yi, Joongjin Nam, Jeonghyeon Cha and Bumman Kim

Young Yun, In-Ho Kang and Ji-Won Jung, Korea Maritime University

Young Yun, Jang-Hyeon Jeong, Hong-Seung Kim and Nak-Won Jang, Korea Maritime and Ocean University, Busan, Korea

Young Yun, Jang-Hyeon Jeong, Hong-Seung Kim and Nak-Won Jang, Korea Maritime University

Young Yun, Korea Maritime University, Busan, Korea

Young Yun, Young-Bae Park, Suk-Youb Kang, In-Ho Kang and Ji-Won Jung, Korea Maritime University Busan, Republic of Korea; Kyu-Ho Park, Korea Electroni

Young-Bae Park, Young Yun, Suk-Youb Kang, In-Ho Kang, Ji-Won Jung and Kyu-Ho Park, Korea Maritime University, Busan, Korea; Kwang-Ho Anh, Korea Electr

Nam-Shin Park, Don-Yong Lee, Byung-Chul Kim, Jung-Hee Won, In-Ho Na, Geon-Ho Jang, Young-Ho Cho, Xu-Guang Wang and Sang-Won Yun, Sogang University, Republic of Korea

Young-Kil Kwag, Korea Aerospace University, Seoul, Republic of Korea

Youngoo Yang, Jaehyok Yi, Joongjin Nam and Bumman Kim

Youngoo Yang, Jaehyok Yi, Young Yun Woo and Bumman Kim

Younkyu Chung, Dal Ahn and Tatsuo Itoh; California Institute of Technology, Soonchunhyang University and University of California

Yu Qian, Keysight Technologies Inc., formerly Agilent Technologies electronic measurement business, Santa Rosa, Calif.

Yu Zhu, Jason Gerber and Qian Cai

Yu Zhu, Kaijun Song, Shunyong Hu and Yong Fan, University of Electronic Science and Technology of China, Chengdu

Yu-Han Chang, Technology Analyst at IDTechEx

Yuan-Kai Chu and Huey-Ru Chuang

Yuan-Kai Chu and Huey-Ru Chuang, National Cheng Kung University

Yuehang Xu, UESTC

Yuehang Xu, University of Electronic Science and Technology of China, Chengdu, China

Yuehang Xu(1), Ruimin Xu(1) and Weigan Lin(1); Justin C. Williams(2),

Yuenie Lau, OML Inc.

Yuhua Qi, Zhao Shen and Rulong He, Naval University of Engineering, Wuhan, China

Yuji Komatsuzaki, Koji Yamanaka and Shintaro Shinjo, Mitsubishi Electric Corporation, Kamakura, Japan

Yuming Zhang, Hongliang Lu and Yimen Zhang, Xidian University, Key Laboratory of Wide Band-Gap Semiconductor Materials and Devices, Xi’an, China

Yuming Zhang, Hongliang Lu and Yimen Zhang, Xidian University, Xi’an, China

Yun Keun Park, Sanghyo Kang and Jae-Bok Lee, Erangtek, Hwaseong 18423, Republic of Korea

Yung-Ming Chiu and Huey-Ru Chuang, Institute of Computer and Communication Engineering, National Cheng Kung University

Yuping Toh

Yuri A. Pashkin, Lancaster University, U.K.

Yuriy Kitaev, Voronezh State University; Aleksey Shulga, Voronezh Institute of Communications

Yuriy Shlepnev, Simberian Inc.

Yusuke Tajima Auriga Measurement Systems LLC Lowell, MA

Yvan Droinet

Z

Z-Communications

Z-Communications Inc., Boulder, Colo.

Z-Communications Inc., Poway, Calif.

Z-Wave Alliance

Z.D. Tan, J.S. Mandeep, S.I.S. Hassan and M.F. Ain School of Electrical and Electronic Engineering, Universiti Sains Malaysi

Z.D. Tan, J.S. Mandeep, S.I.S. Hassan and M.F. Ain, Universiti Sains Malaysia

Z.J. Zhu, C.L. Wei and B.F. Jia, University of Electronic Science and Technology of China, Chengdu, China

Zach Donathan and Mike McCulley, Benchmark

Zacharia Ouardirhi and Tony Gasseling, AMCAD Engineering, Canada

Zadar Labs, San Jose, Calif.

Bill Zalud

Zarko Novicic , Vikram Venkataramanan and Tamara Moskaliuk, Per Vices

Zeland Software Inc.

Zentech Manufacturing, Inc.

Zhancang Wang Nokia; Damon Holmes, Freescale Semiconductor; Mustafa Acar, Robin Wesson and Mark P. van der Heijden, NXP Semiconductors

Zhanyi Qian, Huizhou Wireless Technology Co. Ltd., Huizhou, China

Zhao Hua, Yao Hongfei, Jin Zhi and Liu Xinyu, Institute of Microelectronics, Chinese Academy of Sciences

Zhaolong Li and Xuping Zhang, Nanjing University, Nanjing, P. R. China, Ke Wu and Xiaoping Chen, École Polytechnique de Montreal, Canada

Zhe Chen, Wei Hong, Jianyi Zhou, Jixin Chen and Chen Yu, Southeast University, Nanjing, China

Zhen Li, P.F. Maccarini, O.A. Arabe, V. Stakhursky, W.T. Joines and P.R. Stauffer, Duke University; M. Vogel and D. Crawford, Ansoft Corp.

Zhenfeng Yin, Nanjing Electronic Equipment Research Institute, Nanjing, China

Zheng Haitao, Zhao Guoqiang, Cheng Hang, Yu Liechen, Li Zhangfenga and Li Shiyong, Beijing Institute of Technology, Beijing, China

Zheng Liang Lv and Shuxi Gong, Xidian University; Shiwei Zhao and Xiang Zhang, Shanghai Radio Equipment Research Institute

Zhengbo Jiang, Wei Hong, Nianzu Zhang and Chao Yu, Southeast University, Nanjing, China

Zhi-Hao Zhang, Lin Li, Li-Li Yang, Ting Lang and Xue Cao, Zhejiang Sci-Tech University, Hangzhou, Zhejiang Province, China

Zhiqiang Yu, Jianyi Zhou, Jianing Zhao, Teng Zhao and Wei Hong, Southeast University, Nanjing, China

Zhiqun Cheng, Hangzhou Dianzi University, Hangzhou, China, Chinese Academy of Sciences, Suzhou, China

Zhiqun Cheng, Hangzhou Dianzi University, Hangzhou, China, Suzhou Institute of Nano-Tech and Nano-Bionics, Suzhou, China

Zhiwei Zhang, Chen Li and Guohua Liu, Hangzhou Dianzi University, Hangzhou, China

Zhiwei Zhang, Zhiqun Cheng and Guohua Liu, Hangzhou Dianzi University, Hangzhou, China

Zhong Yin Xiao, Shan Gao, De Chen Ma and Liang Liang Xiang, Shanghai University, Shanghai, China

ZigBee Alliance

Ziptronix

Ziyang Zhao, Zongxi Tang, Yunqiu Wu and Biao Zhang, University of Electronic Science and Technology of China, Chengdu, China

Zoltan J. Cendes, Ansoft Corp.

Zoltan J. Cendes, Ansoft Corporation

Zong Si Wu and Jenq Shiou Leu, National Taiwan University of Science and Technology (NTUST), Department of Electronic and Computer Engineering

Ping Su, Shiwei Zhao, Shanghai Radio Equipment Research Institute, Shanghai, China; Zongxi Tang, University of Electronic Science and Technology of China, Chengdu, China

Zoran Golubicic, Sasa Dragas and Zoran Cvetkovic, TTI Technologías de Telecomunicaciones y de la Informacíon

Zord Gabor Laszlo

Zoubiri Bachir, Division Telecom, Center for Development of Advanced Technologies (CDTA), Algeria

Zoya Popovic, Sébastien Rondineau and Dejan Filipovic, University of Colorado; David Sherrer, Chris Nicholas, Jean-Marc Rollin and Ken Vanhille, Rohm

ZTE

ZTEC Instruments