Janine Love, EDI CON Event Director

EDI CON USA, the industry event that brings together RF/microwave and high speed digital design engineers and system integrators, is happy to announce its technical program co-chairs for the 2018 USA event.

The Call for Abstracts for EDI CON USA 2018 has opened; selected papers will be presented at EDI CON USA 2018, held October 17-18, 2018 at the Santa Clara Convention Center, Santa Clara, Calif.

This March 20-22, EDI CON China returns to Beijing in the China National Convention Center. Attendees return to EDI CON each year to see the latest products on the exhibition floor and to benefit from its technical conference, made up of peer-reviewed technical sessions as well as workshops, plenary keynote speeches, panels and a short course with industry-leading experts.

This year marks the first that we are running two EDI CON conferences: EDI CON China on April 19-21 in Beijing and the new EDI CON USA on September 20-22 in Boston, MA. Both conferences include an exhibition, keynotes, technical conference sessions, workshops, networking, and training opportunities.