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Atomera announced the availability of an MST® solution to dramatically enhance performance of RF-SOI wafer substrates for leading-edge cellular communication products.
With its new SIPLACE CA2 hybrid placement solution, market and technology leader ASMPT combines semiconductor and SMT production in a single machine that makes it possible to integrate the production of SiPs directly into the SMT line.
The Global Semiconductor Alliance (GSA) celebrated the achievements of remarkable individuals and exceptional semiconductor companies at its annual GSA Awards Ceremony gala.
With the modern mobile device revolution, semiconductor suppliers are challenged to increase capability, integration, and performance while reducing time to market. Test needs a new approach based on an open, flexible platform at significantly lower cost. NI is bridging this gap by building on the stability and capability of the PXI platform to deliver off-the-shelf modular technology to both the characterization and production engineer.
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