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A. Bessemoulin, W. Marsetz, Y. Baeyens, R. Osorio, H. Massler, A. Hulsmann and M. Schlechtweg

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Design of Coplanar Power Amplifiers for Millimeter-wave System Applications Including Thermal Aspects

Design issues in the thermal management of coplanar MMIC power amplifiers, including transistor geometry, chip size and mounting conditions

April 1, 2001

A. Bessemoulin, W. Marsetz, Y. Baeyens, R. Osorio, H. Massler, A. Hulsmann and M. Schlechtweg

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TECHNICAL FEATURE Design of Coplanar Power Amplifiers for Millimeter-wave System Applications Including Thermal Aspects Because of the poor thermal conductivity of GaAs, successful power MMIC amplifier design in coplanar technology requires careful thermal considerations. The influences of the active device geometry and mounting conditions have been investigated theoretically and...