We use cookies to provide you with a better experience. By continuing to browse the site you are agreeing to our use of cookies in accordance with our Privacy Policy.
In this paper, wafer scale packaging information is shown including factors that make it low cost. RF I/O design and tested performance for the wafer scale package are shown. After the discussion of the wafer scale package design, the design and performance of a broadband driver amplifier is described.
I. INTRODUCTION The availability of low-cost, high performance amplifiers is crucial to the continued development of mm-wave commercial applications from 17 to 40 GHz. Typical applications include wireless data links such as Local Multipoint Distribution Service (LMDS) and point-to-point microwave radio as well as automotive 24GHz, instrumentation, and VSAT...