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Sonoscan announces its enhanced Digital Image Analysis Toolbox™ used for automated acoustic analysis of individual IC components, various types of bonded wafers including MEMS devices, and other devices.
Sonoscan announces its enhanced Digital Image Analysis Toolbox™ used for automated acoustic analysis of individual IC components, various types of bonded wafers including MEMS devices, and other devices.
Sonoscan has introduced its SonoSimulator™ software, which is now a standard feature on the Gen6™ C-SAM® acoustic microscope.