Katherine J. Herrick, Linda P.B. Katehi, Robert T. Kihm

TECHNICAL FEATURE Interconnects for a Multi-layer Three-dimensional Silicon Architecture As low cost and low volume gain increasing importance in today's technology market, the development of lateral and vertical interconnects for K- through W-band applications using silicon micromachining is a worthwhile endeavor. Thus, lateral components appropriate for multi-layer applications, such...