Remtec Inc.

Remtec Inc., a leading manufacturer of ceramic substrates, packages and submounts using PCTF (plated copper on thick film) metallization, has been acquired by Legacy Technlogies Inc. (LTI) , a major player in the field of precision glass-to-metal seals and glass-to-metal hermetic packages.

Remtec Inc., a leading manufacturer of substrates and packages using PCTF® (plated copper on thick and thin film) metallization, has expanded its Direct Copper Bond (DBC) substrate capabilities. New capabilities includesolid copper filled vias and copper bore coated holes providing front-to-back connections and thermal paths for better heat management as well as solder mask and assembly options.

Remtec Inc., a leading manufacturer of substrates and packages using PCTF® (plated copper on thick and thin film) metallization, has applied its time-proven leadless ceramic SMT substrate technology to the development of a new line of standard SMT leadless packages for electro optical circuits matching standard TO-type window lids.

Remtec Inc., the leading manufacturer of substrates and packages using Plated Copper on Thick Film (PCTF®) metallization, has appointed William F. Dinardo to the new position of business development manager.

Remtec Inc. has added a new universal finish of Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) as a standard finish to its umbrella of fabrication methods. The new finish resolves a problem of intermetalics detrimental to the reliability of solder joints (black pad formations) and wire bonding connections.