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Tower Semiconductor Ltd. and its US subsidiary, Jazz Semiconductor , announced the availability of its proprietary Deep-Silicon-Via™ (DSV) technology available in its 0.18-micron SiGe BiCMOS (SBC18). The new offering provides a simpler, more innovative way to create a low-inductance ground required to reduce power consumption of power amplifiers (PA)....
Tower Semiconductor Ltd. and Applied Materials Inc. announced that they have signed a five-year contract to support all Applied Materials wafer processing systems at Tower’s Fab 2 manufacturing facility in Migdal Haemek, Israel. Through its Applied Performance Service program, the most cost-effective and flexible service offering in the semiconductor...
