Presentation of the design and measurement data for a PA module using silicon RF-IC bipolar chip technology on a simple ceramic substrate
Technical Feature A High Efficiency, Low Cost Silicon Bipolar GSM Dual-band PA Module T. Johansson, P. Lundin, J. Engvall and D. Uggla Ericsson Microelectronics AB Kista, Sweden U. Hagström Ericsson Microwave Systems AB Mölndal, Sweden As the wireless communication business continues to expand, there is great demand for reducing...
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