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Chien-Cheng Wei, Chin-Ta Fan, Ta-Hsiang Chiang, Ming-Kuen Chiu and Shao-Pin Ru Tong Hsing Electronic Industries Ltd.Taipei Hsien, Taiwan

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A Comparison Study of High-frequency Characteristics for Ball and Ribbon Bonding

In many microwave applications above 10 GHz, ribbon wire bonding is usually used because of its high frequency and high power characteristics. In general, ribbon bonding with a rectangular-shaped wire will provide lower impedance and inductance at high...

June 9, 2010

Chien-Cheng Wei, Chin-Ta Fan, Ta-Hsiang Chiang, Ming-Kuen Chiu and Shao-Pin Ru Tong Hsing Electronic Industries Ltd.Taipei Hsien, Taiwan

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Wire bonding is the most common interconnect method for providing the interconnection between an integrated circuit (IC) and a printed circuit board (PCB), IC-to-IC, or PCB-to-PCB. The two main wire-bonding technologies are ball bonding and wedge bonding. Although ball bonding is faster and much more popular, wedge bonding offers...