We use cookies to provide you with a better experience. By continuing to browse the site you are agreeing to our use of cookies in accordance with our Privacy Policy.
Ball Grid Arrays: A DC to 31.5 GHz Low Cost Packaging Solution for Microwave and mm-wave MMICs The VIA/PAK™ ball grid array (VBGA) surface-mount packaging technology for high frequency RF and mm-wave applications is described in this article. The package was developed for the frequency range from DC to...
