Master Bond Inc.

Master Bond EP5TC-80 is a low outgassing adhesive with high thermal conductivity and electrical insulation. 

Master Bond MasterSil 323S-LO is an addition cured silicone that is both electrically and thermally conductive.

Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. 

Master Bond EP17HTS-DA is a one component epoxy that is electrically conductive and withstands high temperatures. 

Master Bond EP4G-80Med is a medical grade, electrically conductive adhesive that meets ISO cytotoxicity standards.

 Master Bond EP4S-80 is a one part, low viscosity, electrically conductive epoxy, that is NASA low outgassing approved for EMI/RFI shielding applications.

Master Bond EP3HTS-TC is a one part, NASA low outgassing rated epoxy, with an outstanding thermal conductivity of 16-17 W/(m·K).

EP4S-80 is a one component silver filled epoxy which meets NASA low outgassing requirements. It has an unlimited working life at room temperature and a moderate heat cure requirement of 80°C.

Master Bond EP4G-80Med is a one part epoxy designed for use in the assembly of medical devices. This system is formulated with a non-metallic, 

MasterSil 151S is an addition curing two part silicone system that may be used as an adhesive, sealant, coating or form-in-place gasketing material.