Arlon

ARLON ’s new MultiClad™ HF is the next generation of halogen-free, low-loss thermoset and prepreg system for high-speed and high-frequency multilayer printed circuit boards. MultiClad HF is a thermally robust, high durability system with a high Tg (205° by DSC), low Z-direction expansion (1.2 percent from 50° to 260°C)...

Arlon ’s EP2 (Advanced Polyimide) is a 4th generation polyimide technology, providing a filled, dimensionally stabilized product with improved copper peel and thermal conductivity – at a reduced cost vs. standard polyimides. A patent-pending chemistry that enhances the bond of polyimide to substrate, filler and copper is the enabling...

Arlon ’s TC600 (Tc=1.0 W/m-K) and TC350 (Tc=1.1 W/m-K) offer low loss, excellent thermal conductivity, physical and electrical stability over temperature (i.e. providing “phase stable” electrical performance) and excellent processability and plated through hole reliability, whether designing with a higher Dk material for circuit miniaturization, or on a conventional...

Arlon was on hand to display both TC350 and TC600, ceramic powder filled, woven fiberglass PTFE composites engineered to produce laminates with a nominal dielectric constant of 3.50 and 6.15, respectively. The ceramic fills and ceramic styles used in TC350 and TC600 typically reduce drill life compared to conventional...