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Targeting power electronics applications, pure-play semiconductor foundry Sanan Integrated Circuit Company has released a 6-inch SiC process to its foundry services portfolio, following full process qualification for commercial release.
Palomar Technologies announced new epoxy die attach capabilities for silver sintering. The silver jet dispensing process is an enhancement to the already wide breadth of Palomar Technologies' solutions for the telecom and datacom markets.
At the IEEE IEDM 2018 conference, imec presents a first demonstration of 3D stacked FinFETs on 300 mm wafers using a sequential integration approach with a 45 nm fin pitch and 110 nm poly pitch technology.
Copper Mountain Technologies (CMT) and Compass Technology Group (CTG) are pleased to announce their new Epsilometer solution for measuring the dielectric properties of materials.
Sensera Inc. is pleased to announce it has acquired and qualified additional thin-film processing equipment including a dicing saw, a wafer bonder and an electroplating cell to meet the growing customer demand in this segment.
HRL Laboratories was awarded a $9.2 million cost-plus-fixed-fee contract from the Defense Advanced Research Projects Agency (DARPA) for a millimeter wave GaN maturation program.
II-VI Inc. announced a strategic collaboration with Sumitomo Electric Device Innovations Inc. (SEDI) to establish a vertically integrated 150 mm wafer fabrication platform to manufacture GaN on SiC HEMT devices for 5G wireless networks.
ABI Research forecasts markets for pulsed RF power devices up to 4 GHz will show continued solid growth over the next five years and exceed US$275 million by 2023.
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