Semiconductors / Integrated Circuits

Mitsubishi

Mitsubishi Electric Develops World's First Multi-Cell GaN-HEMT Bonded Directly to Diamond Substrate

Mitsubishi Electric Corp. announced that in collaboration with the Research Center for Ubiquitous MEMS and Micro Engineering, National Institute of AIST, it has developed a GaN-HEMT in a multi-cell structure (multiple transistors cells arranged in parallel) bonded directly to a single-crystal diamond heat-dissipating substrate with high thermal conductivity.


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Infineon to Acquire Cypress

Infineon Technologies AG and Cypress Semiconductor Corp. announced that the companies have signed a definitive agreement under which Infineon will acquire Cypress for US$23.85 per share in cash, corresponding to an enterprise value of €9 billion. 


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