Semiconductors / Integrated Circuits - Page 20

Atomera to License MST Technology to RF Semiconductor Solution Provider for Mobile 5G Markets

November 8, 2019

Atomera Inc. announced it has reached an agreement to license Atomera’s Mears Silicon Technology (MST) technology to a leading semiconductor provider of RF products.

StratEdge Offers Assembly Services for Die Attachment on CMC Tabs

October 24, 2019

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StratEdgeis providing contract assembly services for eutectically attaching GaN and silicon high frequency and high power devices onto CoMoCu tabs.

IEEE 2019 HIR Identifies Long-Term Tech Requirements to Inspire Collaboration in Electronics

October 11, 2019

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IEEE announced the 2019 release of the Heterogeneous Integration Roadmap, outlining the future of electronics with technology requirements and potential solutions.

SMART Announces Way to Commercially Manufacture Novel Integrated Si III-V Chips

September 30, 2019

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The Singapore-MIT Alliance for Research and Technology (SMART), MIT's research enterprise in Singapore, has announced the development of a commercially viable way to manufacture silicon ICs with high performance III-V devices inserted in the design.

GLOBALFOUNDRIES Achieves More Than $1B in Design Wins

September 24, 2019

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At its annual Global Technology Conference, GLOBALFOUNDRIES (GF) announced that more than 20 clients, representing >$1 billion in design win revenue, are working with GF’s enhanced 45RFSOI platform for 5G/mmWave mobile and wireless infrastructure applications.

SOI Industry Consortium Announces Awards During Shanghai Event

September 24, 2019

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The SOI Industry Consortium announced awards to two luminaries of the semiconductor industry. Jim Cable, chairman and CTO of pSemi, a Murata Co., and Herb Huang, CEO and GM of Ninbo Semiconductor received awards for their contributions to the advancement of RF-SOI.

NI Improves Operational Efficiency with Semiconductor Test System Software Enhancements

September 20, 2019

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NI announced new STS software enhancements that deliver significant improvements to the programming and debugging experience, test execution speed, parallel test efficiency and overall equipment efficiency for the NI Semiconductor Test System (STS).

Mitsubishi Electric Develops World's First Multi-Cell GaN-HEMT Bonded Directly to Diamond Substrate

September 10, 2019

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Mitsubishi Electric Corp. announced that in collaboration with the Research Center for Ubiquitous MEMS and Micro Engineering, National Institute of AIST, it has developed a GaN-HEMT in a multi-cell structure (multiple transistors cells arranged in parallel) bonded directly to a single-crystal diamond heat-dissipating substrate with high thermal conductivity.

StratEdge Expands Packaging, Assembly Services for High Frequency, High Power Devices

August 23, 2019

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StratEdge Corp. is expanding and its facilities and capabilities for packaging RF/microwave devices, covering the gamut of packaging capabilities, from manual to fully automatic, first article prototypes to hundreds of thousands of modules, DC to above 63 GHz.

R&S, Marvin Test Solutions Create Turnkey Production Tester for 5G Beamforming ICs

July 15, 2019

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T&M companies Rohde & Schwarz and Marvin Test Solutions have cooperated to create a unique turnkey solution suited for testing the beamforming ICs used in mmWave 5G and SatCom systems.

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