We use cookies to provide you with a better experience. By continuing to browse the site you are agreeing to our use of cookies in accordance with our Privacy Policy.
Copper Mountain Technologies (CMT) and Compass Technology Group (CTG) are pleased to announce their new Epsilometer solution for measuring the dielectric properties of materials.
Sensera Inc. is pleased to announce it has acquired and qualified additional thin-film processing equipment including a dicing saw, a wafer bonder and an electroplating cell to meet the growing customer demand in this segment.
HRL Laboratories was awarded a $9.2 million cost-plus-fixed-fee contract from the Defense Advanced Research Projects Agency (DARPA) for a millimeter wave GaN maturation program.
II-VI Inc. announced a strategic collaboration with Sumitomo Electric Device Innovations Inc. (SEDI) to establish a vertically integrated 150 mm wafer fabrication platform to manufacture GaN on SiC HEMT devices for 5G wireless networks.
ABI Research forecasts markets for pulsed RF power devices up to 4 GHz will show continued solid growth over the next five years and exceed US$275 million by 2023.
Keysight Technologies announced that the company's 3D planar EM simulator, Momentum, has been certified for GlobalFoundries' 22 nm fully-depleted silicon-on-insulator (FD-SOI) technology, 22FDX®.
BAE Systems has signed a cooperative agreement with the Air Force Research Laboratory (AFRL) for the first phase of a technical effort to transition GaN semiconductor technology developed by the U.S. Air Force to BAE System's Advanced Microwave Products (AMP) center.
Kaga Electronics Co. Ltd. and Fujitsu Semiconductor Ltd. (FSL) announced that they have entered into a definitive agreement whereby Kaga Electronics acquires 70 percent shares in Fujitsu Electronics Inc. (FEI) from FSL.
RSS
