eBooks

This eBook is part of the May 2024 issue as a special focus section on 5G/6G topics including AI in 6G, Interconnection Development for mmWave Applications, and Terabit Wireless plus product information on new DDS AWGs, MMIC filters and low phase noise oscillators. These articles are contributed from industry leading companies such as Keysight, NI, Pasternack, ETI, Marki Microwave, Quantic Wenzel and Spectrum Instrumentation. There is also a new products section.

Most every wireless and wireline communication network, along with radar systems uses a digital modulation scheme that is susceptible to noise and jitter. Many systems still use a heterodyne architecture that converts the digital signal to a higher-frequency analog signal. This architecture relies on a mixer to create these higher frequencies. Noise from any component that reaches the mixer can be re-mixed and this reduces the sensitivity and selectivity of the entire system as re-mixed signals leak into adjacent channels. Phase noise is a big contributor to this potential issue. 

Today, the 6G standard is in the early phases. Candidate technologies are being researched, prototyped, and simulated to drive the direction of the 3GPP standards development activity. Applying digital twin workflows to simulations and pairing them with a prototype as it moves through the design phase opens up innovative ways to design and identify optimizations early. Modeling software tools that leverage as much real-world data as possible have the potential to solve significant challenges early by incorporating known insights from existing 5G deployments. Research testbeds will be critical to success if 6G aims to spur collaboration alongside innovation. The ability to prototype new AI, digital twin, and software-defined tools across the wireless ecosystem will provide significant results for applying those technologies wisely. This eBook looks at the design densification and test challenges from migrating 5G communications into the 6G sub-Terahertz frequency ranges. Keysight Technologies, the sponsor of this eBook, presents end-to-end capabilities for simulating, testing, and evaluating devices, subsystems, and systems for the evolution of the 5G systems as they evolve towards 6G.

Mission-critical RF component selection has experienced remarkable advancements with breakthroughs in materials science, semiconductor technology, and design methodologies. These innovations have paved the way for the development of components capable of operating under extreme conditions, delivering unparalleled performance, and ensuring seamless interoperability within complex communication infrastructures. This eBook covers new developments in SDRs, filter topologies, semi-rigid cable assemblies, RF over fiber and a modular approach to phased arrays. These new developments will assist the design engineer in some new approaches to RF component selection for mission critical applications.

The March 2024 Cable and Connector Special Focus section contains several articles covering the RF connector market for basestations, the growing challenge of counterfeit cables, and technology innovations. There are also product articles including SMP-MAX and 65 GHz adapters plus a new products section covering products from various companies. Don’t miss this eBook covering the latest innovations in cable and connector technology.

For engineers and researchers working in the field of RF and microwave devices, the design considerations outlined in this eBook serve as a valuable resource. Practical insights and real-world applications offer a hands-on approach to implementing the latest strategies for achieving optimal amplifier linearity in communications systems. The “Impact of Amplifier Linearity on Communications Systems Performance” is a timely and indispensable guide for those seeking to stay at the forefront of technological progress in the ever-evolving world of communications. As we embrace the future of connectivity, this eBook equips its readers with the knowledge and skills needed to navigate the intricate landscape of amplifier design with confidence and

innovation.

5G has been rolling out for several years now but each 3GPP release is adding new capabilities to realize the full potential of the technology while companies are improving on device and system design to improve performance and cost. This eBook is part of our Nov 5G/6G and IoT themed issued focusing on 5G. The articles cover an overview of V2X technology, RF Front end design, a new cooling technology for 5G active antenna systems, new innovations in 60 NLOS technology, phase noise analysis for radar/SATCOM systems and new products in the industry.

The challenges that the industry is facing and the solutions that are being developed at each step of the supply chain to enable the 5G future form the basis for this eBook. The first entry dives into the 5G market, with a focus on base stations. It provides a good summary and forecast of the trends, drivers, ecosystem, technology shares and market segmentations for PAs in base station applications. The second entry describes integrating DAS networks to improve 5G coverage and article three provides and discusses the benefits of transitioning to a 5G standalone (SA) network. The fourth article gives a good overview of the importance of power amplifiers in 5G architectures and the challenges and advantages of integrating functions into PA modules. The final article discusses the benefits of Open RAN, a standardized approach to radio access network hardware and software disaggregation and how front-end reference designs can enable massive MIMO, which has become an essential. building block of the 5G future.

Microwave subsystems are complicated and have many tradeoffs in design. This is especially true with RF filter products. To help engineers navigate RF filter procurement, Q Microwave has created this comprehensive guide covering RF filter materials, configurations and packaging. This eBook reviews filter design, material selection, packaging, SWaP-C, and customization to meet unique needs.

This eBook addresses some of the challenges and best practices when designing and fabricating PCBs for RF applications. The first article gives a good overview of the fabrication process for a variety of different multilayer printed circuit boards. The second article provides insight into the reality of PCB fabrication versus the ideal models and how those differences become more important as circuits go higher in frequency. Article three acknowledges that these PCBs will operate at elevated temperatures, and it provides insight into the failure mechanisms, test methods and proper selection of substrate materials to optimize temperature performance. The fourth article provides good technical details about how to select the proper circuit board dielectric mate-rial as applications go higher in frequency. The final two articles address the finer points of the board design and manufacturing process for a microwave power amplifier and a microwave/millimeter wave patch antenna.