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To aid designers of GaN power amplifiers (PA), Wolfspeed has selected several recent articles published by Microwave Journal, creating this handy eBook reference. We begin with a survey of the RF GaN market written by the consulting firm Yole Développement. “The RF GaN Device Market: A Roller-Coaster Ride.” Then “A Dive into Integrated PA Topologies for 5G mMIMO,” written by Wolfspeed, discusses the benefit of using GaN rather than LDMOS and how best to design the GaN PA. The article “Broadband, High Efficiency, Class J Power Amplifier Design Method with Compensating Drain-Source Capacitance,” written by authors from Hangzhou University and the University of Kent, describes a single-ended GaN PA design covering the cellular bands from 1.4 to 3.6 GHz that achieves approximately 10 W output power, between 60 and 68 percent drain efficiency and an adjacent channel power ratio better than −30 dBc. The next article, “Doherty Power Amplifiers Move to mmWave,” written by PRFI, describes the design of an asymmetric Doherty PA MMIC for the 28 GHz 5G band. The design was processed using Wolfspeed’s 0.15 μm GaN on SiC foundry process. The next article, “The Maximally Efficient Amplifier,” written by Rohde & Schwarz, explores the theoretical circuit approaches for maximizing a PA’s efficiency: waveform engineering, supply modulation and load modulation. The eBook concludes with “Choosing the Right Signal Source for Reliable Measurements,” a cautionary reminder from Rohde & Schwarz that the quality of the signal source causes measurement uncertainty and error.
GaN has become the dominant RF power technology in Defense applications and higher high performance commercial applications. Strategy Analytics forecasts GaN component revenue to approach $1.5 billion for Defense applications alone by 2030. Its performance characteristics support evolving battle philosophies that rely on higher operating frequencies, wider instantaneous bandwidths, better efficiency and higher linearity. This eBook takes a look at several new applications for GaN technology and some examples of optimizing GaN amplifier performance.
This eBook explores the test challenges for 5G and 6G components, beginning with “The Pillars of 5G,” discussing the two parameters that determine network performance: spectral efficiency and energy efficiency. The next article, “Virtual Cable Calibration for OTA Testing of 5G mmWave Devices,” describes over-the-air (OTA) testing methods for mmWave networks. “Design of a Multiple CATR System for Multiple Angles of Arrival Measurement of 5G mmWave Devices,” discusses a novel multiple compact antenna test range (CATR) for testing beamforming systems with scenarios involving multiple angles of arrival. “On-Wafer, Large-Signal Transistor Characterization from 70–110 GHz Using an Optimized Load-Pull Technique,” jointly written by Maury Microwave and Teledyne Technologies, describes a hybrid-active vector receiver load-pull measurement system that can present |Γ| = 1 at the device reference plane up to 110 GHz. Continuing the discussion of sub-THz measurements, “Frequency Scalable Power Control and Active Tuning for Sub-THz Large-Signal Measurements,” written by Vertigo Technologies and Technische Universiteit Delft, describes a novel approach to making large-signal measurements, by expanding the capabilities of conventional sub-THz S-parameter network analyzers to add power control, sweeps and active load-pull. Completing this comprehensive eBook, a reprint of a Rohde & Schwarz educational note by Lawrence Wilson that explains the importance of the signal generator’s performance when measuring receivers.
This eBook explores how passive components are contributing to the progress of reducing SWaP, complementing semiconductor integration. Topics covered include reducing RF Circuit SWaP with high K materials and precision thin-film microstrip technology; filter technology options for mmWave applications; compact, low loss switched filter bank using MEMS switches; and using additive manufacturing for Aerospace and Defense components including examples of antennas, amplifiers and filters.
Designing a semiconductor component is not easy: the myriad specifications, simulating performance, the cycle time through the wafer fab, packaging, designing and building the evaluation board, testing the circuit — all contributing to the total cost of development. With GaN being widely adopted for military and commercial systems, the RFIC industry has focused on the device physics, modeling and simulations tools to enable first-pass success with GaN devices. This eBook explores the topic compiling five recent articles published by Microwave Journal including simulation, device topologies, off-chip matching circuits and device models.
This eBook reviews recent advances in these areas of AI and FPGA processing that are enabling improved EW systems. The first article looks at accelerating EW system development and deployment with open hardware, firmware and software leveraging a new standard platform. The next two articles look at how AI is changing the EW landscape and the industry’s first heterogeneous processing module with integrated AI functionality. Then the eBook addresses digital RF memory testing challenges and solutions. The last two articles cover new products for RF signal recording with smaller form factors and increased capabilities.
This eBook covers some of the new advancements in VNA technology that are enabling new applications to use VNAs for characterization. The first article looks at a modular VNA architecture that presents a new alternative for S-parameter measurements by eliminating long cable runs and simplifying the test setup. The next article examines some popular choices for de-embedding techniques and experimentally looks at performance in some WR5 fixtures from 140 to 220 GHz. The third article reviews the importance of accurate dielectric constant measurement on laminate PCB materials for mmWave applications, most of which are done with a VNA. Increasingly, broadband mmWave VNA measurements are needed at higher frequencies, creating measurement challenges so the last article covers an integrated 70 kHz to 220 GHz VNA with a single connection to the DUT. Learn about all of these topics in this eBook.
This eBook from Wireless Telecom Group explores these T&M trends, beginning with a tutorial on signal generation written by Boonton. An article by CommAgility illustrates the use of T&M for simulation, in this case a satellite link being developed to support 4G/5G communications. The next two articles address phase noise, describing the development of low phase noise synthesizers. The first reports on the collaboration between Drexel University and Synergy Microwave to develop sources using optoelectronic loops. The second article, contributed by Analog Devices, assesses several synthesizer architectures, concluding a fully integrated translation loop will achieve the lowest phase noise. The concluding article, from Epirus, describes the state of high power solid-state technology and its potential use in new EMP systems. This eBook represents some of the latest technology in signal generation.
This is our second eBook on 3D printing/additive manufacturing in the last couple of months. This topic has gained popularity as many companies are finding interesting ways to design and manufacture RF devices and components using these techniques. While one of our November 2021 eBooks covered interesting components made with 3D printing/additive manufacturing, this one takes a look at the materials development that are enabling devices that could never be made before with traditional manufacturing. Additive manufacturing has the advantages of being able to produce shapes that are not possible with traditional manufacturing techniques, and this eBook shows how gradient index dielectric materials and conductive inks enable a new set of capabilities for RF components from antennas to filters. We hope this eBook will open the door in new ways to design and manufacture new RF products using these new materials and simulation techniques outlined in these articles plus inspire some new RF component ideas.
This eBook is a collection of articles on the various innovations in measurement methods and equipment that has been developed to address these higher frequencies ranging from mmWave up to 1.1 THz. The articles address both on wafer level device measurements and components in these frequency ranges. The collection of articles covers the accuracy and reliability of these measurements along with various test techniques. Several articles cover new VNA instruments operating up to 220 GHz (without frequency extenders) and load pull measurements up to 1.1 THz. Read this eBook now to find out about these latest developments.
