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A Comparison Between Thin Film and Thick Film Capacitors

By Ron Demcko, AVX Fellow and Applications Engineering Manager

Advances in S-Band Radar Technology

By Integra Technologies Inc.. Reducing overall system cost through higher levels of integration.

Understanding Long-Term Evolution Fundamentals And Measurement Challenges

The Universal Mobile Telecommunication System (UMTS), the successor to GSM, is steadily increasing its penetration of the world’s wireless communications markets, and is likely over time to become the primary standard used by not just the current 85% wireless carriers, but by virtually all of them. Its most promising emerging enhancement, Long-Term Evolution (LTE), has moved further along in the standards-setting process and on to the path of initial deployment.

Microwave Integrated Circuits: New Achievements from a “Mature” Technology

For more than 60 years, microwave technology has been synonymous with Microwave Integrated Circuits (MICs). The first MICs appeared in the 1940s, just over a decade after the first microwave circuits were introduced in waveguide form. Now, even though monolithic MICs (MMICs) have revolutionized (and made possible) most of today’s wireless-enabled devices, products based on MIC fabrication techniques remain the bulk of the output of the microwave industry.

Guidelines for Choosing RF and Microwave Products: Part 1

How to specify RF and microwave filters.

Tackling the Challenges of Pulsed Signal Measurements

This Application Note describes chracterization of devices used in radar systems with pulsed signals.

Spacecraft Payload for MSC Networks

By Durban University of Technology (DUT)

Understanding Long-Term Evolution Fundamentals and Measurement Challenges

With release of the latest version of Release 8 of the 3rd Generation Partnership Project (3GPP) in June 2009, the core LTE specification has stabilized. 3GPP Release 8 also encompasses a considerable number of interim enhancements embodied in Evolved High-Speed Packet Access (eHSPA), also known as HSPA+.

Advancements in Process Residue

by Morgan Technical Ceramics