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X-parameters® and Beyond, AWR’s Support of PHD and Nonlinear Behavioral Models

This white paper provides comprehensive information about rapidly-emerging nonlinear models and measurement systems and how AWR’s Microwave Office® high-frequency design software effectively employs them.

Analysis of Nonlinear Active Devices Incl True Balanced Differential Measurements

With continued pressure for increased 3G coverage for smart phones, increased Internet connection for Wi-Fi and WiMAX, and the imminent introduction of 4G/LTE systems, design activity for digital communication RF components has never been greater. At the forefront of the design activity is the development of power amplifiers (PA).

A Reconfigurable, Digital Multi-band SATCOM Terminal: Closer Than You Think

By Wes Littlefield, Vice President, Business Development, Hypres

Bidirectional Simulation in the RF Design Environmental Flow

by Intercept Technology Inc.

MATLAB® Toolkit for Signal Generators and Power Sensors

This application note describes the installation and use of the R&S MATLAB® Toolkit on Microsoft Windows and Linux based systems.

New Measurement-based Models Enhance Nonlinear Analysis

This white paper examines the different nonlinear models and measurement systems available today and how they can be used with Microwave Office®, a leading high-frequency design environment from AWR Corporation.

MIMO Over-The-Air Testing

By Doug Reed, Spirent Communications

VSS and TestWave Software Integrate Measurement Data into the Design Process

When simulating a complete subsystem such as a wireless communication device or radar receiver, the quality of measurement data becomes essential to ensure that the finished product meets or exceeds the demands the system will encounter in service.

Understanding Grounding Concepts in EM Simulators

This white paper, written by EM expert Dr. John Dunn, demonstrates the importance of correctly selecting and assigning “ground” within EM simulators and how it is essential for successfully predicting the performance of board, package, and their associated interconnects.