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EDI CON USA Keynote Talks - Bet Your Job, 5G in 5 Years and T&M Value

Full videos of Scott McMorrow, Thomas Cameron and Faride Akretch keynote talks

September 30, 2017

Pat Hindle, Editor, Microwave Journal

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The EDI CON USA 2017 keynote speakers addressed the latest engineering trends and challenges in our industry from “in the trenches” stories of design challenges, successes and failures from “Bet Your Job” to “5G in 5 Years” look into the future to a behind the scenes look at T&M. Below are full videos of these featured talks delivered on Sept 12 in Boston.

Characterizing Wideband Converters for EW & Satcom

December 11, 2024

Adjusting and characterizing Wideband radiofrequency converters poses significant challenges due to numerous possible configurations. The complexity arises from variable local oscillator (LO) frequencies, different sub-bands, switched filter banks, and the high number of mixers within the modules.

Our Tech Brief presents efficient approaches that balance resource optimization with accurate performance data collection for these converters.

Engineered Substrates for Intelligent IoT Connectivity

December 11, 2024

This whitepaper explores the role of engineered substrates in enhancing IoT by improving RF and microwave performance for efficient power use. It examines Wi-Fi and cellular protocol evolution, highlights Soitec’s innovations for IoT, and addresses challenges in cloud connectivity, offering insights and recommendations for future IoT advancements.

Measure Phase Noise with Cross-Correlated Channels

December 11, 2024

This paper explores various phase noise measurement methods and introduces a test solution that provides high-volume-production phase noise measurement speed and accuracy across wide frequency and dynamic ranges. The process employs cross-correlation technology to achieve low phase noise measurement levels at offset frequencies close to and far from the carrier.

Optimizing PCB Designs Guidebook

December 3, 2024

Because PCBs are fundamental to electronic devices, they are used in a variety of defense, consumer electronics, telecommunications, healthcare and energy and power applications. This widespread adoption creates a significant market opportunity. However, PCB manufacturers and users must address challenges to continue to enable the mass market appeal and unique opportunities envisioned by the market forecasts and the electronics industry. These challenges and their solutions form the basis for the articles in this eBook.

These articles will give the reader a good understanding of the fundamentals and challenges of PCB material selection, design and fabrication that must be addressed to create the solutions that the electronics industry needs to evolve. The first article investigates a new composite laminate material that uses standard/qualified PTFE-based paper and glass fabric layers to provide good dimensional stability and Z-axis CTE while also exhibiting low Dk and Df. The second and last articles look at the fabrication process. The second article offers excellent insight into the fabrication steps and what is necessary at each step to optimize circuit performance. The last article addresses considerations for high-frequency RF and high-speed digital multilayer boards. The third article discusses how new materials overcome the traditional challenges presented by high Dk/low Df materials. The fourth article addresses how to reliably bend and form PCBs in response to the emergence of applications requiring 3D solutions.

RF GaN-on-Si Technology Powers the Future of Wireless

November 21, 2024

While mobile traffic is expected to increase by multiples, revenues at mobile network operators are expected to stay flat. This challenges network operators and radio manufacturers to manage a much higher data capability at the same total cost, which calls for a significant reduction in the cost per bit. Breaking these requirements down for 5G radios, the RF PAs need to support higher frequencies, significantly wider instantaneous bandwidths and high efficiency over a wide back-off range. These radios must also be capable of being linearized at levels below -50 dBc with digital predistortion. The semiconductor technologies capable of delivering those targets at a commercially viable price position are RF GaN-on-SiC and RF GaN-on-Si. Find out why in this technical article.

IoT Special Focus

November 13, 2024

This IoT Special Focus eBook covers wireless power transfer and technology outlook, new AWGs and digitizers, a new dual band patch antenna design and new products from various companies.

Fortify's 2024 Applications Guide: Improving RF System Performance with Tailored Dielectrics

November 12, 2024

Fortify has built a portfolio of high-performance low-loss gradient dielectric devices that improve antennas using Fortify’s tailored design and manufacturing technologies for gradient-refractive index components. Taking a close look at gradient-dielectric enhanced antennas and adjacent systems, this guide covers examples of upgraded devices and their applications that Fortify has either built-to-print or designed and manufactured to transform and enhance antennas systems.

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Designing for Electromagnetic Radiation Hazards Compliance

November 12, 2024

Humans are exposed to electromagnetic fields (EMF) from sources like 5G, IoT devices, and EV systems. Altair® Feko® enables engineers to evaluate EMF safety early in design—when corrections are least costly to make—helping manufacturers meet regulations efficiently. Download the paper now to explore EMF compliance solutions with Altair® Feko®.

RF GaN-on-Si Technology Powers the Future of Wireless

November 12, 2024

Mobile data traffic continues to grow. Constant video streaming is on the rise in applications like TikTok, Netflix and Instagram, but also increasingly LinkedIn and even simple websites. Ericsson estimates that mobile data traffic, excluding fixed wireless access, is going to increase by a factor of 3x by 2029.

The Next Wave: Driving Wireless Innovation With Spectrum and RF Solutions

November 12, 2024

This whitepaper provides a glimpse of the trends in mobile telecommunications spectrum allocation for 6G, how radio architectures are evolving to make the best use of this spectrum, and the innovations taking place in advancing RF Front End (RFFE) technology to make 6G possible.

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