Semiconductors / Integrated Circuits - Page 14

GlobalFoundries and Qualcomm Sign Agreement to Deliver Advanced 5G RF Front-End Products

September 15, 2021

GlobalFoundries and Qualcomm collaborate on cutting-edge 5G solutions to deliver breakthrough coverage and ubiquitous mobility.

GlobalFoundries Unveils Innovative Solutions that Deliver New Era of More in Semiconductor Manufacturing

September 15, 2021

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New solutions announced at GlobalFoundries' GF Technology Summit include rich features essential for smart mobile devices, datacenter, IoT and automotive.

LIGENTEC and X-FAB Collaboration Creates Europe’s Largest Capacity Foundry Service for PICs

September 14, 2021

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LIGENTEC and X-FAB Silicon Foundries have announced a strategic partnership resulting in the large-scale supply of integrated photonic devices.

X-FAB Becomes First to Offer High Volume MTP Capabilities Following Licensing Agreement with X-Celeprint

September 7, 2021

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X-FAB Silicon Foundries is now able to support volume heterogeneous integration via micro-transfer printing (MTP), thanks to a licensing agreement that has just been secured with X-Celeprint.

ACM Research Launches Its First Plating Tool to Support Wafer-Level Packaging and Plating Applications

Automated system for flat or notched wafers; multiple orders to ship during third quarter of 2021

August 26, 2021

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ACM Research, Inc. announced the launch of ACM’s Ultra ECP GIII plating tool to support wafer-level packaging for compound semiconductors, with product offerings for SiC, GaN and GaAs.

Tower Semiconductor and Cadence Announce New Reference Flow

August 16, 2021

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Cadence Design Systems, Inc. and Tower Semiconductor announced the release of a silicon-validated SP4T RF SOI switch reference design flow using the Cadence® Virtuoso® Design Platform and RF Solution.

RFHIC and MaxLinear Achieve Linearization Performance for UWB 5G NR

August 10, 2021

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MaxLinear transceivers and linearization technology combine with RFHIC’s power amplifiers to exceed 3GPP requirements for 5G NR.

Element Six Selected to Join the UKRI’s Prosperity Partnership Initiative

July 22, 2021

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Element Six and University of Warwick will join forces to shape the technology of the future as part of the eight Prosperity Partnerships announced in support of the government’s ambitious new Innovation Strategy.

GlobalFoundries to Build New Fab in Upstate N.Y. in Private-Public Partnership to Support U.S. Semiconductor Manufacturing

July 19, 2021

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GlobalFoundries announced its expansion plans for its most advanced manufacturing facility in upstate New York over the coming years, including immediate investments to address the global chip shortage at its existing Fab 8 facility as well as construction of a new fab on the same campus that will double the site’s capacity.

X-FAB Introduces Analog/Mixed-Signal Reference Design Kit for Siemens’ Tanner IC Design Tools

June 29, 2021

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X-FAB Silicon Foundries SE released a reference design kit for Tanner™ analog/mixed-signal software from the EDA segment of Siemens Digital Industries Software, providing full coverage of the flow to design and simulate analog and mixed-signal ICs.

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