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Tower Semiconductor and Anello Photonics announced a strategic partnership for a new low-loss Si Optical Waveguide technology and manufacturing process.
MicroWave Technology Inc, (MwT), announced three families of advanced 0.25 μm AlGaAs/InGaAs based discrete devices for wide range military microwave and commercial wireless applications.
IQE plc announced the commencement of a long-term strategic collaboration with GlobalFoundries® to develop vital on Si technologies for mobile and wireless infrastructure applications.
This year’s theme of IEEE IEDM is “Devices for a New Era of Electronics: From 2D Materials to 3D Architectures,” to be held December 11–15, 2021 at the Hilton San Francisco Union Square hotel.
The company, formerly known as Cree, Inc. (Nasdaq: CREE), officially launches under its new name, Wolfspeed, Inc., with the support of a comprehensive, multi-channel, integrated marketing campaign.
Wolfspeed’s silicon carbide devices will enable General Motors to install more efficient EV propulsion systems that will extend the range of its rapidly expanding EV portfolio.
UTAC has added state-of-the-art plasma dicing and multi-project wafer (MPW) capabilities to its range of advanced semiconductor manufacturing solutions.
Yole Développement announced a US$47.5 billion market in 2026, with a CAGR 2014-2026 of 7.4 percent. The share of advanced packaging in the total semiconductor market is increasing continuously: almost 50 percent of the market by 2026.
Veeco Instruments Inc. announced that IQM Finland OY has selected the plasma-enhanced Fiji® Atomic Layer Deposition (ALD) System to help drive the future of quantum computing.
Sivers Semiconductors AB announced the launch of the new highly integrated, state-of-art 5G NR RFICs, TRB02801 and TRB03901, together with very high-powered RFIC and antenna RF modules, BFM02801 and BFM03901, covering all licensed 5G mmWave bands.
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