Semiconductors / Integrated Circuits

RSS

arQana Technologies and Hon Hai Technology Group, (“Foxconn”) announced the completion of the acquisition of arQana’s Wireless Telecommunications business, and a merger with AchernarTek, to enable the birth of a global RF semiconductor component supplier, with the intent to support Foxconn and third-party customers in the Wireless Telecommunications markets, including applications in Automotive and 5G Infrastructure.

X-FAB Silicon Foundries SE has expanded the scope of its SubstrateXtractor tool, via which unwanted substrate coupling effects can be examined. 

Altum RF announced three new GaAs pHEMT MMIC amplifiers targeting applications covering Q-, V- and E-Bands. Using WIN Semiconductors’ next-generation PP10-20 GaAs pHEMT technology, these compact die amplifiers achieve high gain and low noise.

IDTechEx’s latest research report on “Thermal Management for 5G 2022-2032” finds that GaN has a significant opportunity within the 5G market and this creates a downstream effect on other components such as die attach materials.

Infineon Technologies AG is strengthening its market leadership in power semiconductors by adding significant manufacturing capacities in the field of wide bandgap (SiC and GaN) semiconductors. 

BAE Systems has been awarded a $60 million contract from the Army Contracting Command – Rock Island under the Cornerstone Other Transaction Authority to develop certain types of next-generation, RHBD microelectronics, leveraging Intel Foundry Services.