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Green standards are challenging power designers to deliver more energy-efficient, cost-effective, smaller, and more reliable power delivery systems. A critical building block within ac-dc and isolated dcdc power supplies is the isolated gate driver. These trends push the need for greater power efficiency and increased isolation-device integration.

Analog to digital converters (ADCs) are the critical downlink bridge between the electromagnetic world and that of advanced digital signal processing. Extending sampling frequencies and bandwidth capabilities of these system critical components into the higher microwave frequencies opens a myriad of opportunities for future communication engineers to advance the state-of-theart and to deliver greater flexibility in spectral usage.

Uncover how SIGINT has evolved into an asset capable of influencing conflict outcomes.  In today's complex battlespace, technology and information intertwine, the effective use of SIGINT is necessary for achieving a strategic advantage. Explore the advanced signal monitoring and analysis tools at the forefront of this digital warfare landscape.

5G has been rolling out for several years now but each 3GPP release is adding new capabilities to realize the full potential of the technology while companies are improving on device and system design to improve performance and cost. This eBook is part of our Nov 5G/6G and IoT themed issued focusing on 5G. The articles cover an overview of V2X technology, RF Front end design, a new cooling technology for 5G active antenna systems, new innovations in 60 NLOS technology, phase noise analysis for radar/SATCOM systems and new products in the industry.

Phase noise is caused by an RF waveform’s unintentional phase modulation, degrading the overall fidelity of a signal. In this white paper, learn phase noise fundamentals, how phase noise impacts the performance of radar and digital communications systems, and the limitations and advantages of two different phase noise measurement methods.

Simulation can be a big time-saver when designing EMI filters for DC/DC converters. Power supply control chip vendors offer various filter design tools that provide reasonable design choices for filter simulation before any hardware prototype is available. However, simulated results can differ significantly for different tools if simulated models are not accurate or do not cover all the relevant components.

The challenges that the industry is facing and the solutions that are being developed at each step of the supply chain to enable the 5G future form the basis for this eBook. The first entry dives into the 5G market, with a focus on base stations. It provides a good summary and forecast of the trends, drivers, ecosystem, technology shares and market segmentations for PAs in base station applications. The second entry describes integrating DAS networks to improve 5G coverage and article three provides and discusses the benefits of transitioning to a 5G standalone (SA) network. The fourth article gives a good overview of the importance of power amplifiers in 5G architectures and the challenges and advantages of integrating functions into PA modules. The final article discusses the benefits of Open RAN, a standardized approach to radio access network hardware and software disaggregation and how front-end reference designs can enable massive MIMO, which has become an essential. building block of the 5G future.

Microwave subsystems are complicated and have many tradeoffs in design. This is especially true with RF filter products. To help engineers navigate RF filter procurement, Q Microwave has created this comprehensive guide covering RF filter materials, configurations and packaging. This eBook reviews filter design, material selection, packaging, SWaP-C, and customization to meet unique needs.

This eBook addresses some of the challenges and best practices when designing and fabricating PCBs for RF applications. The first article gives a good overview of the fabrication process for a variety of different multilayer printed circuit boards. The second article provides insight into the reality of PCB fabrication versus the ideal models and how those differences become more important as circuits go higher in frequency. Article three acknowledges that these PCBs will operate at elevated temperatures, and it provides insight into the failure mechanisms, test methods and proper selection of substrate materials to optimize temperature performance. The fourth article provides good technical details about how to select the proper circuit board dielectric mate-rial as applications go higher in frequency. The final two articles address the finer points of the board design and manufacturing process for a microwave power amplifier and a microwave/millimeter wave patch antenna.