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Exploring the latest developments in cables, connectors and testing forms the basis for the articles in this eBook. These articles will give the reader a good understanding of techniques, tips and best practices for measurement systems and the role cables and connectors play in the evolution of these systems. The first article deals solely with connectors. It offers connector fundamentals, along with five tips to optimize connector performance and ensure long-term reliability and repeatability. Some of the remaining articles address best practices and techniques for making accurate, repeatable measurements, characterizing uncertainty, improving calibration accuracy and speed and ensuring that your measurement system remains optimized. The rest of the articles discuss the critical role that cables play in measurement. They deal with requirements, theory and practical considerations involved with high-performance cable design and selection.

Modern battlefields demand advanced systems like radar and ECM, requiring agile, cost-effective designs. High-performance testing tools, specialized software, and robust support ensure these systems meet DoD standards and diverse operational challenges.

For optimal performance in over-the-air RF systems, antennas must meet specific requirements. Performance parameters like size, wind-loading, environmental ruggedness, transmission pattern, bandwidth, and power handling capability should be considered. Methods of measuring the transmission (or reception) pattern which determines antenna gain with a VNA will be examined in this article.

The aerospace and defense industry depends on high-fidelity antennas for mission-critical electronic systems. This whitepaper explores how electromagnetic simulation optimizes antenna integration, mitigates interference, and ensures maximum signal reliability. Download the paper now to learn how Altair’s solutions enable seamless design collaboration across disciplines to enhance performance, reduce costs, and accelerate development.

Extended Reality (XR) has evolved beyond gaming, with growing business applications in simulation, training, learning, and collaboration. This White Paper explores XR use cases and technical challenges in these areas.

In a world where the internet of things (IoT) is becoming more ingrained in everyday life, customer confidence in these technologies hinges on the assurance of security. Robust cybersecurity measures are critical for fostering this trust. In response to this need, regulations from both industry and governments have ramped up the requirement for defenses against cyber threats, protecting consumer privacy and security.

Adjusting and characterizing Wideband radiofrequency converters poses significant challenges due to numerous possible configurations. The complexity arises from variable local oscillator (LO) frequencies, different sub-bands, switched filter banks, and the high number of mixers within the modules.  

Our Tech Brief presents efficient approaches that balance resource optimization with accurate performance data collection for these converters.

This whitepaper explores the role of engineered substrates in enhancing IoT by improving RF and microwave performance for efficient power use. It examines Wi-Fi and cellular protocol evolution, highlights Soitec’s innovations for IoT, and addresses challenges in cloud connectivity, offering insights and recommendations for future IoT advancements.

This paper explores various phase noise measurement methods and introduces a test solution that provides high-volume-production phase noise measurement speed and accuracy across wide frequency and dynamic ranges. The process employs cross-correlation technology to achieve low phase noise measurement levels at offset frequencies close to and far from the carrier.

Because PCBs are fundamental to electronic devices, they are used in a variety of defense, consumer electronics, telecommunications, healthcare and energy and power applications. This widespread adoption creates a significant market opportunity. However, PCB manufacturers and users must address challenges to continue to enable the mass market appeal and unique opportunities envisioned by the market forecasts and the electronics industry. These challenges and their solutions form the basis for the articles in this eBook. 

These articles will give the reader a good understanding of the fundamentals and challenges of PCB material selection, design and fabrication that must be addressed to create the solutions that the electronics industry needs to evolve. The first article investigates a new composite laminate material that uses standard/qualified PTFE-based paper and glass fabric layers to provide good dimensional stability and Z-axis CTE while also exhibiting low Dk and Df. The second and last articles look at the fabrication process. The second article offers excellent insight into the fabrication steps and what is necessary at each step to optimize circuit performance. The last article addresses considerations for high-frequency RF and high-speed digital multilayer boards. The third article discusses how new materials overcome the traditional challenges presented by high Dk/low Df materials. The fourth article addresses how to reliably bend and form PCBs in response to the emergence of applications requiring 3D solutions.