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arQana Technologies and Hon Hai Technology Group, (“Foxconn”) announced the completion of the acquisition of arQana’s Wireless Telecommunications business, and a merger with AchernarTek, to enable the birth of a global RF semiconductor component supplier, with the intent to support Foxconn and third-party customers in the Wireless Telecommunications markets, including applications in Automotive and 5G Infrastructure.

Microwave Journal visited many companies at the EuMW 2021 exhibition, held April 2-7 at London’s ExCeL convention center. Here is a summary of their featured products.

Teledyne e2v announced the production release of the space qualified EV12AQ600, the most advanced and versatile quad-core, multi-channel ADC in its portfolio of high performance products with QML-Y space certification.

The U.S. Department of Defense (DOD) has awarded Verizon Public Sector three Enterprise Infrastructure Solutions task order awards worth $966.5 million.

Rohde & Schwarz's new R&S BBA300 family provides a single amplifier solution that eliminates the need to switch instruments or bands during a test. 

Uhnder will soon become the first company to mass produce a fully automotive qualified, 4D digital imaging radar-on-chip that will transform our roadways, making possible next-generation ADAS (advanced driver assistance systems), autonomous vehicles (AVs), and automated mobility applications.

Qualcomm Technologies, Inc. announced the Snapdragon X70 5G Modem-RF System, its 5th generation modem-to-antenna 5G solution, introducing the first 5G AI processor in a modem-RF system to harness the power of AI for breakthrough 5G performance.

SGS, has selected wireless connectivity testing specialist, MVG, to supply the first automotive over-the-air (OTA) test equipment compliant with the 5GAA VATM standard for its service offering of automotive testing in the APAC region.