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Molex introduced its new line of radio frequency products, BNC RF Connectors and Assemblies. Designed for leading 8K High-Speed, High Definition TV (HDTV), video equipment and camera manufacturers, the new innovation from Molex yields return loss performance that exceeds SMPTE 2082-1 standards, allowing for future bandwidth expansion without needing to change connector hardware.

For applications such as reconfigurable and phased array antennas that require density and performance, Integra Devices offers services and custom substrates that allow their customers to include 8, 12 and even 20 GHz relays embedded within the printed circut boards (PCB) and signal path.

Pentek, Inc. introduced the newest member of the Jade™ family of data converter XMC modules. The Model 71851 is based on the Xilinx Kintex Ultrascale FPGA and features two 500 MHz, 12-bit A/Ds with multiband digital down converters (DDCs), one digital upconverter (DUC) and two 800 MHz 16-bit D/As.

HENSOLDT and Leonardo have signed an agreement to offer Mode-5 Identification Friend or Foe solutions satisfy diverse customer’s needs around the world on a case-by-case basis.

The SATELLITE 2017 conference, held March 6-9 in Washington, reflected the optimism of an industry chasing the promises of broadband and the IoT, fueled by the investments of wealthy entrepreneurs. To wit, Jeff Bezos, who became rich on the success of Amazon, is parlaying that success into his reusable rocket venture Blue Origin and a vision of renewed space exploration. Microwave Journal attended SATELLITE 2017 to see what role the RF/microwave industry is playing.

Today, at the IEEE Wireless Communications and Networking Conference (WCNC) in San Francisco, National Instruments (NI) publicly demonstrated a real-time, over-the-air prototype aligned with the Verizon 5G specification. The 28 GHz system uses OFDM with eight component carriers in a 2x2 downlink MU-MIMO configuration, with hybrid beamforming and a self-contained subframe, yielding a 5 Gbps peak throughput that is scalable to over 20 Gbps with eight MIMO streams.

 “The RF front end modules and components market for cellphones is highly dynamic”, asserts Claire Troadec, Activity Leader, RF Devices & Technologies at Yole Développement (Yole). And she adds:” From being worth US$10.1billion last year, it is expected to reach U$22.7 billion in 2022.” Such high growth is definitely something that players in other semiconductor markets would envy: a market that will more than double in six years! However, the growth is not evenly distributed… 

Terma has been awarded the delivery of SCANTER 5502 Surface Movement Radars to the new airport in Beijing, China opening in 2019.

5G Americas, the industry trade association and voice of 5G and LTE for the Americas, today announced that LTE continued its impressive momentum in North America, Latin America and throughout the world according to data from Ovum for the fourth quarter of 2016. As of the end of 2016, global LTE connections reached 1.9 billion and surpassed 2 billion connections by February of 2017.