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EnSilica has established a new regional office and design center in Bristol to complement its existing headquarters facility in Wokingham and verification center of excellence and design center in Bangalore.
On 27 October, e2v and The University of Nottingham, UK celebrated five successful years of a major industry and academic collaboration in the field of advanced microwave technology.
STMicroelectronics and Autotalks are preparing to release their second-generation V2X chipset to meet the upcoming U.S. mandate on connected road safety.
MPI Corp.is partnering with Rohde & Schwarz to provide customers with turnkey solutions for measurements on semiconductor components in the RF and millimeter-wave ranges.
Renesas Electronics and Audi have established a strategic relationship as part of the Audi Progressive SemiConductor Program (PSCP) to accelerate automotive innovation.
NXP Semiconductors held an Extraordinary General Meeting of Shareholders and Freescale Semiconductor held a Special General Meeting on NXP’s acquisition of Freescale. Both meetings approved the merger proposal with over 99 percent of the votes cast in favor.
DelfMEMS announced that its twelve throw, RF-MEMS ohmic contact switch design has just passed the one billion test cycles milestone and is still going strong.
Infineon Technologies is working with Google’s Advanced Technology and Projects group (ATAP) to develop a sensing solution. Potential applications include wearables, IoT and automotive applications.
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