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Anokiwave announced the next product in a new family of 5G-Gen 2 silicon quad core ICs that enable 3GPP compliant base stations, with the worldwide release of the 24/26 GHz AWMF-0139.
Ampleon launched the BLP25RFE001, a small, signal generator IC with a programmable frequency synthesizer able to generate a signal in the 433, 915 and 2,400 MHz ISM bands.
Qorvo® introduced the world’s highest power GaN-on-SiC RF transistor. Operating with 1.8 kW at 65 V, the QPD1025 delivers the outstanding signal integrity and extended reach essential for L-Band avionics and Identification Friend or Foe (IFF) applications.
University of Glasgow engineers have scaled up the established processes for making flexible silicon chips to the size required for delivering high-performance bendable systems.
Fujitsu Limited and Fujitsu Laboratories Ltd. announced development of the world's first technology for bonding single-crystal diamond to a SiC substrate at room temperature.
Autotalks has endorsed Anritsu Corporation’s RF calibration and validation test solution that is based on its MT8870A high-speed wireless test platform for V2X applications.
Toshiba Electronics Europe has introduced the mixed-signal TC35679IFTG IC that is compliant with Bluetooth® Low Energy core specification 4.2 for use in harsh automotive environments and extended temperature ranges.
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