RF & Microwave Industry News

LTE Forum 2010 to Feature R&S Presentation

The LTE Forum 2010 will take place in Stockholm, Sweden, on April 27 to 28. It will bring operators, vendors, end-users, regulators, experts, analysts and the media together to discuss, debate and discover trends and strategies of the Next Generation Mobile technology, LTE. According to the latest studies, the...
Read More

TDK-EPC Launches Thin-film Common Mode Filter

TDK-EPC , a group company of the TDK Corp., claims to have introduced the world’s first thin-film common mode filter (TCE1210 from TDK) with both high-speed differential transmission common mode noise suppression and ESD protection in a single component. Mass production is scheduled to begin this month (April 2010)....
Read More

Cobham Wins SDB Contracts with Boeing

Cobham 's Mission Equipment strategic business unit has been awarded further production contracts by The Boeing Co. to supply more than 500 BRU-61/A carriage systems for the Small Diameter Bomb (SDB) program. The BRU-61/A is a pneumatic multi-store system designed for carriage and release of Boeing's SDB weapon system,...
Read More

April 2010 WaveGuide

div#bottombox { background: #ffffff; width: 160px; height: 215px; color: #000000; margin: 0px 0px 0px 10px; padding: 0px 0px 0px 0px; border-top: 2px solid #2f94ab; border-right: 2px solid #2f94ab; border-bottom: 2px solid #2f94ab; border-left: 2px solid #2f94ab; } April: Warming up for MTT-S; How to Be a Good Blogger April...
Read More

Coming in May and June 2010

The underlying theme for Microwave Journal ’s editorial this year is the “microwave supply chain”. This theme is exemplified in part (at least the component and design support side) by the annual International Microwave Symposium (IMS) coming May 23-28 th in Anaheim. To preview the show and give the...
Read More

RFMD Expands Portfolio of Single-chip ISM Band Transceivers

RF Micro Devices Inc. (RFMD), a leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, announced the introduction of the ML2730, a single-chip fully integrated Frequency Shift Keyed (FSK) transceiver with integrated power amplifier (PA) and low noise amplifier (LNA). The ML2730 expands...
Read More

European Carriers Face Capacity Crunch Challenges: The Full Story

In the International Report on page 169 of the April issue of Microwave Journal, Alan Solheim, VP of product management at DragonWave, outlined the capacity crunch challenges faced by European carriers. Here he explains the background in more detail an...
The introduction of HSPA, WiMAX and LTE radio access technologies has resulted in an explosion in bandwidth requirements on the backhaul links from base stations to the core of the network. According to a recent Infonetics Research report the number of mobile broadband users has doubled over the past...
Read More