White Papers

Extending the Performance and Frequency Envelope for QFN Packaging Technology

“High-performance, millimeter-wave MMIC products” and “cost-effective surface mount lead-frame-based packaging” typically don’t come up in the same conversation, and for good reason. Just two or three years ago, it was difficult to conceive of operating at frequencies above 20 GHz without considering an expensive, open cavity, HTCC package or resorting to more bespoke chip and wire assemblies.


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Verifying RF Device Performance With a Blocking Test

The increasing density of devices, machines, systems and vehicles using wireless connectivity solutions can pose a great challenge for a new Wi-Fi module due to the presence of interfering signals. A wireless receiver’s ability to receive a wanted signal in the presence of an interfering signal is described by blocking characteristics.


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Over-the-Air (OTA) Testing Fundamentals Poster

Learn about the basics of OTA Testing including near-field and far-field definitions/equations, typical parameters to measure for device characterization, various methods to transform near-field to far-field for measurements, and how to perform far-field measurements at near-field distances. Download this informational poster now.


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NewSpace Terminal Testing Challenges and Considerations

NewSpace Terminal Testing Challenges and ConsiderationsToday’s satellite communication systems combine features from legacy cellular networks and emerging wireless technologies. New constellations are under development that attempt to provide ubiquitous mobility and internet networks via satellites, ground stations and user terminals.


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Design of a Complete RF Downconverter Module for Test Equipment

RF/microwave modules, often referred to as “hybrids,” integrate functional blocks used to transmit and/or receive radio signals. These hybrid circuits combine different technologies, including monolithic microwave integrated circuits (MMICs)/RFICs, discrete field-effect transistors (FETs), and passive devices attached to substrates such as alumina or FR4, which contain circuit traces and distributed components, all within a single housing or enclosure.


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