Items Tagged with 'heat'

RFMW Ltd., announces design and sales support for MAST Technologies' line of dual use RF absorber & thermally conductive pad material. Trademarked Suppress-n-Sink, the target application is reducing harmful reflections from heat-sinks and heat-spreaders used on packaged components.

TEGAM Inc., a leading supplier of innovative RF power measurements, was recently awarded Patent No. 8,558,556, “Planar-axial thermistor for bolometry.” This patent describes a novel way to construct very small planar thermistors on a substrate with very low heat transfer. The thermistors are more thermally isolated from the environment than are commercially-produced thermistors. Both the small size and thermal isolation make them useful for measuring RF power at microwave frequencies up to 70 GHz.

Linear Technology Corp. announces the LT8309, a flyback secondary-side synchronous rectifier driver that replaces the output diode with a MOSFET, allowing up to 10A output current without the use of a heat sink. The maximum output current of a flyback power supply has been limited by the power loss and heat generated from the output diode when no heat sink is used.

Linear Technology Corp. introduces the LT4321, an ideal diode bridge controller that replaces two diode bridge rectifiers with low-loss N-channel MOSFET bridges to increase the available power and reduce heat dissipation in a Power over Ethernet Powered Device (PoE PD). IEEE 802.3 PoE specifications require PDs to accept DC supply voltages of any polarity over their Ethernet inputs.

Molex Inc. will present leading edge high-speed, high-density solutions at the 39th European Conference on Optical Communication (ECOC 2013) being held September 22-26 at the ICC London ExCEL, England.  ECOC is the largest European optical communications event for the fiber optic industry.

At SEMICON West 2013, Element Six, the world leader in synthetic diamond supermaterials and member of the De Beers Group of Companies, announced it has expanded its global manufacturing capabilities of microwave chemical vapor deposition (CVD) synthetic diamond by 60 percent compared to last year.

Following the success of the Diamond RF Resistives® product range, EMC Technology now offers CVD Diamond Heat Spreaders designed to meet today’s demanding requirements for higher power and longer life spans by keeping junction temperatures low and stable. CVD Diamond provides up to 8x the thermal conductivity of traditional materials like AlN and BeO.

Element Six, the world leader in synthetic diamond supermaterials and member of the De Beers Group of Companies, announced it has acquired the assets and intellectual property of Group4 Labs Inc. (Group4), a semiconductor wafer materials company that manufactured Gallium Nitride (GaN) on-diamond semiconductor technology for RF and high-power devices.

Nano Materials International Corp. (NMIC) announced that it has shipped its 10,000th aluminum diamond metal matrix composite (MMC) heat spreader for use in gallium nitride (GaN) RF power transistors and MMICs.

Richardson RFPD Inc. announces it has completed a distribution agreement with PriaTherm, a European-based provider of reliable and innovative solutions in the thermal management industry. With this agreement, Priatherm provides Richardson RFPD with a source to assist its European customers with fabricated heat sinks for high power RF, as well as energy and power management, applications.