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Quad Industries, Agfa, imec and TNO announced that they have demonstrated a plastic 12-bit RFID tag and read-out system with screen-printed circuitry.

The Electronic Design Innovation Conference and Exhibition (EDI CON) USA, the first industry event to bring together RF/microwave and high-speed digital design engineers and system integrators, announced the addition of the European Radar Summit to its conference program at the Hynes Convention Center, September 11-13 in Boston, Mass.

Smiths Interconnect will be in Booth #1441 at the International Microwave Symposium (IMS) in Honolulu, Hawaii, and one of the many integrated microwave assemblies (IMAs) that they will be talking about includes a recently released Ku-Band High Power Transceiver (HPT).

W. L. Gore & Associates (Gore) continues to enhance the company’s microwave/RF solutions to operate at higher frequencies while performing reliably over time.

Tektronix, Inc. introduced the new 5 Series MSO mixed signal oscilloscope that redefines the midrange oscilloscope with a host of innovations delivering unprecedented flexibility and unmatched visibility into complex embedded systems.

Remtec Inc. has added gold tin plated Ceramic Combo Lids to its line of ceramic SMT packages.

SemiGen, Inc. is participating at the 2017 International Microwave Symposium (IMS) June 6–8 in Honolulu, Hawaii, in the 5G/IoT Pavilion Booth #848.

Microsemi Corporation announced a new family of wideband plastic packaged and chip MMICs: four plastic packaged low noise amplifiers, a wideband power amplifier (PA), and two plastic packaged switches.

Custom MMIC is exhibiting at the International Microwave Symposium (IMS) 2017 in Honolulu, Hawaii in Booth #1355.

Laser Services is announcing their presence at the International Microwave Symposium (IMS) this week.