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The U.S. Army selected Northrop Grumman Corporation’s Highly Adaptable Multi-Mission Radar (HAMMR) to demonstrate its multi-mission capability at the 2017 counter-rocket, artillery and mortar (C-RAM) test at the Yuma Proving Ground earlier this year. HAMMR is a multi-mission sensor that supports situational awareness, counter-fire operations, air defense, early warning and airspace management.

V2X leaders u-blox, Commsignia Inc and NXP Semiconductors announced a strategic collaboration, in order to address the rapidly growing demand for reliable Vehicle to Vehicle (V2V) and Vehicle to Infrastructure (V2I) technology.

Pasternack has expanded its offering of broadband limiting amplifiers which are commonly used in electronic warfare, microwave receivers and broadband communications systems.

Quintech Electronics & Communications, Inc. announced that its XTREME 80 port matrix switch has been selected by a U.S. Government Intelligence Agency to expand network capabilities.

Anritsu Company expands its broad mobile device test portfolio with the introduction of CTIA battery life test capability for its Signaling Tester MD8475B.

Mercury Systems, Inc. announced that systems using ANSI/VITA 48.7 Air Flow-By™ standard cooling technology have passed flight tests in multiple manned and unmanned airborne platforms, some in their final mission configuration, thereby achieving technology readiness level 8 (TRL-8).

Mitsubishi Electric US, Inc. will present a hands-on mini lab showcasing its high efficiency, wideband GaN Doherty Amplifier in Booth #1827 at the International Microwave Symposium.

Analog Devices, Inc., which recently acquired Linear Technology Corporation, announces the LTC5553, a double balanced mixer providing best-in-class matched bandwidth capability from 3 to 20 GHz. The mixer can be used either as an up- or downconverter. In addition, the LTC5553 delivers outstanding linearity of 23.9 dBm IIP3 at 14 GHz, and 21.5 dBm at 17 GHz. The device integrates an LO buffer requiring only 0 dBm input drive, effectively eliminating an external high power LO amplifier circuit. 

3D Smith Chart Tools S.R.L. has released a revolutionary and powerful learning, analysis and design tool for RF/microwave engineers: the 3D Smith Chart. The 3D Smith Chart is the first commercially available software tool that enables new capabilities for RF/microwave design that were not available using the original Smith chart, introduced in 1939.