EDI CON USA

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Ardent Concept's patented QUICKLINK™Connector mounts directly to the PCB with a twist-to-lock footprint design that requires only two small thru holes and a gold pad for the connector to land on. QUICKLINK™ footprints can be placed anywhere on your board to allow easy access to any channels from your device without having to solder on costly SMA or SMP surface mount receptacles.

Custom MMIC, a leading developer of performance driven monolithic microwave integrated circuits (MMICs) is pleased to announce Dr. Charles J. Trantanella, Chief Scientist at Custom MMIC, will be presenting at EDI CON USA 2016 on September 22 with his talk at 9:00 a.m. entitled, “Reaching New Heights in Mixer Linearity with GaN MMIC Technology.”

At the Smiths Microwave Subsystems Booth #721 at the EDI CON USA 2016 show in Boston, Mass., September 20-22, Millitech will be reviewing several new millimeter wave products for varied E-, W-, and V-Band applications.

Smiths Microwave Subsystems is pleased to announce that advanced surface mount technology has led TRAK to deliver the first-ever circulator that can be used in automated assembly of phased array radar assemblies. You’ll find this product and several other microwave component and assembly innovations on display at the Smiths Microwave Subsystems Booth #721 at EDI CON USA 2016.

SemiGen Inc., an ISO and ITAR registered RF/Microwave assembly, automated PCB manufacturing, and RF Supply Center, is featuring a range of products at EDI Con 2016 in Boston at Booth #505.

ARC Technologies will be showcasing its line of RF absorbers and EMI shielding materials at the Electronic Design Innovation Conference (www.ediconusa.com) exhibition scheduled for September 20-22, 2016 at the Hynes Convention Center in Boston, Mass. Representatives from ARC Technologies will be on hand at Booth #613 to show their latest solutions for noise and interference control for the RF/microwave industry, including Hot Melt and Wave-X absorbers, as well as testing capabilities.  

Pickering Interfaces will showcase their broad range of PXI and LXI RF & Microwave switching solutions, along with their soon-to-be-released 2-slot USB/LXI Modular Chassis and LXI Simulation Tool at EDI CON USA 2016, Booth 822 taking place September 20-22 in Boston, Mass.

Richardson RFPD announces participation at EDI CON USA 2016 will include  live demos, new products and Analog Devices' Radioverse™ RF wideband transceiver evaluation board giveaway at Booth #806.

MOSIS with be exhibiting EDI CON USA  2016, taking place September 20-22, at the Hynes Convention Center in Boston, Mass.  Stop by Booth #429 to learn about the company's prototype and volume-production services.

Tech-X Corp. will exhibit at EDI CON USA 2016 , taking place in Boston, Mass., September 20-22. Stop by Booth #123 to learn about Vsim finite difference time domain (FDTD) electromagnetic (EM) and particle-in-cell (PIC) simulation.  Applications include magnetron sputtering, helix traveling wave tubes (TWTs)  klystrons, gyrotrons, plasma physics and antennas.