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LPKF Laser & Electronics has announced it will be demonstrating its in-house rapid PCB prototyping equipment at the EDI CON USA 2018 exhibition, which takes place October 17-18 at the Santa Clara Convention Center in Santa Clara, Calif.
EDI CON USA announces its plenary keynote speakers—Ovi Jacob and Ransom Stephens—for the 2018 conference, which will be held in Santa Clara, Calif. October 17 and 18.
The EDI CON USA 2017 keynote speakers addressed the latest engineering trends and challenges in our industry from “in the trenches” stories of design challenges, successes and failures from “Bet Your Job” to “5G in 5 Years” look into the future to a behind the scenes look at T&M. Below are full videos of these featured talks delivered on Sept 12 in Boston.
Offering a unique combination of training, technical sessions, workshops, panels and a commercial exhibition, EDI CON USA returned to Boston for its second year in the U.S.
Smiths Interconnect will exhibit its largest range of components, assemblies and systems from 18 to 325 GHz, in Booth #423 at the EDI CON USA in Boston, and of their many new devices they’ll be featuring Ku-Band High-Power Transceivers (HPTs) and 18 to 110 GHz Circulators.
Strand Marketing is pleased to announce that they will be attending EDI CON USA 2017, a tradeshow put on by Horizon House and Microwave Journal that brings together RF, microwave, EMC/EMI and high-speed digital design engineers and system integrators for networking, training and learning opportunities.
Rohde & Schwarz is addressing the demands for characterizing wideband components and systems with the R&S FSW-B5000 option, which will be demonstrated for the first time to at EDI CON USA in Boston.
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