EDI CON USA

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Custom MMIC has announced that President and CTO, Paul Blount, will be delivering a presentation at the Electronic Design Innovation Conference and Exhibition (EDI CON) 2017 in Boston, titled “Conquering Phase Noise in Radar and Communication Systems.”

Indium Corporation’s Brook Sandy-Smith, technical support engineer for PCB Assembly Materials, will present at the Electronic Design Innovation Conference (EDI CON) and Exhibition 2017, September 11-13 in Boston, Mass.

EDI CON USA, the first industry event to bring together RF/microwave and high-speed digital design engineers and system integrators, announced that IBIS Open Forum will hold its first, formal IBIS Summit Meeting at EDI CON USA 2017 at the Hynes Convention Center, September 11-13 in Boston, Mass.

EDI CON USA 2017 announces a new scholarship program for university students, where any student that attends can enter the drawing for a one of two $500 scholarships being given away by visiting the booths of major sponsors on September 12-13.

EDI CON USA 2017, an event that brings together engineers working on high-frequency analog and high-speed digital designs, announces a new scholarship program for university students interested in high frequency or high-speed electronics. Any student that attends EDI CON USA 2017 can enter the drawing for a one of two $500 scholarships being given away by visiting the booths of three major sponsors in the exhibition Sept 12-13.