EMC/EMI (Electromagnetic Compatibility/Electromagnetic Interference) channel

4M26ProdImgx250

10 W, 32 to 40 GHz, GaAs FET Power Amplifier

Solid-State High Power Module: AMP3060

Exodus Advanced Communications has introduced its latest solid-state high power module, the AMP3060. This linear, GaAs FET hybrid, Class AB design provides 10 W output across 32 to 40 GHz, with a minimum power gain of 40 dB and 4 dB peak-to-peak maximum flatness when driven with a constant maximum input power of 0 dBm. The AMP3060 is suitable for EMI/EMC susceptibility, millimeter wave component testing, electronic warfare, Ka-Band satellite and general communications applications. 


Read More

EDI CON China 2017 Announces Keynote and Panels

EDI CON China 2017, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place April 25-27 at the Shanghai Convention Center & Exhibition Center of International Sourcing (Shanghai, China), announces the keynote speaker for this year’s event will be Peter Rabbeni, Sr. Director RF BU Product Marketing at GLOBALFOUNDRIES. Rabbeni will bring his significant insights on semiconductor technology to bear on his talk entitled, “Technologies for the Next Wave of Mobile Data.”


Read More
R&S RT-ZPR20

Rohde & Schwarz Introduces 2 GHz Bandwidth Probe

2 GHz Bandwidth Probe: RT-ZPR20

Rohde & Schwarz has introduced the R&S RT-ZPR20, extremely low-noise power rail probe with a bandwidth of 2 GHz. Its 1:1 attenuation also ensures very good sensitivity. The large offset range of ± 60 V permits analysis of the smallest disturbance signals during power integrity measurements, even on DC power supplies with a high voltage level. The probe also features an integrated high-precision DC voltmeter. The quality of the power supply is a key factor in the functionality and performance of sensitive electronic circuits.


Read More

EDI CON USA 2017 Opens Call for Abstracts

RF/Microwave and High-Speed Digital Topics Welcome

EDI CON USA 2017 announces that this year’s call for abstracts (CFA) is now open. The EDI CON USA Technical Advisory Committee, event management team, and this year’s conference chairs, Thomas Cameron, CTO for the Communications Business Unit at Analog Devices Inc. and Istvan Novak, Senior Principal Engineer at Oracle, worked in conjunction to develop the CFA. 


Read More

Keysight Technologies Addresses 400G/PAM-4 Test Challenges at DesignCon 2017

Keysight Technologies Inc. announced it will exhibit its latest high-speed digital solutions at DesignCon 2017, Booth 725, Santa Clara Convention Center, Feb. 1-2. Keysight's technical experts and application engineers will demonstrate the most advanced design and test solutions, developed for solving today's most difficult high-speed digital measurement challenges. Keysight is proud to be the host sponsor of DesignCon 2017.


Read More

EDI CON USA Announces 2017 Conference Chairs

EDI CON USA 2017, an event that brings together engineers working on high-frequency analog and high-speed digital designs, will take place at the Hynes Convention Center, September 11-13 in Boston, Mass. The event management team announced this year’s conference chairs: Thomas Cameron, CTO for the Communications Business Unit at Analog Devices Inc. will serve as the chair for the high-frequency subject areas, and Istvan Novak, senior principal engineer at Oracle, will serve as the chair for the high-speed digital areas of the conference.


Read More