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Identive Group Inc. and NXP Semiconductors N.V. are providing innovative near field communication (NFC) payment tags to Yeldi Softcom Pvt Ltd to support the launch of its ‘ara eTap’ cashless payment application in India.
Infineon Technologies AG has introduced its first single-chip radar solutions for applications in industrial and commercial sensing, based on a SiGe process technology and operating in the 24 GHz ISM band.
STMicroelectronics has launched the 2012 iNEMO Design Contest. The contest invites final-year engineering students from the National University of Singapore and the Nanyang Technological University (NTU) to develop innovative applications using ST’s iNEMO® smart multi-sensor technology.
UK, multi-band, multi-standard transceiver chip firm, Lime Microsystems, has announced a partnership agreement with the strategic investment firm In-Q-Tel, an independent, non-profit organisation that identifies innovative technology solutions to support the missions of the US Intelligence Community.
Infineon Technologies has introduced its first power switching devices designed specifically for use in space and avionics applications. The new Radiation Hardened (RH) PowerMOS devices of the BUY25CSXX family are claimed to offer best-in-class performance to support design of energy-efficient power conditioning and power supply systems for space use.
Cadence Design Systems, Inc. and Samsung Electronics have collaborated to deliver a 20 nanometer design methodology that incorporates double patterning technology for joint customer deployment and internal test chips. The collaboration brings new process advances for mobile consumer electronics, enabling design at 20 nm and future process nodes.
As GaN power device technology matures and gains acceptance in the market place, suppliers who provide products using this promising technology must prove its reliability. This paper will provide an overview of the testing approaches used to establish failure rates and will provide a comparison of DC and RF based HTOL methods. The primary focus of this paper will be the high power RF HTOL test method used by M/A-COM Technology Solutions to qualify its new MAGX line of discrete GaN on SiC RF Power Transistors. An overview of the results and a comparison of the reliability of GaN with respect to older silicon based power semiconductor technologies will be discussed.
A new family of ultra-reliable mixers, developed by Mini-Circuits, combines low-temperature cofired ceramic (LTCC) circuitry and specially selected semiconductor dice in a hermetically sealed case at 1/10th the price of comparable products on the market. Fully automated, tightly-controlled, and highly repeatable processes ensure excellent performance at temperatures up to 125 degrees C.
The UK’s Nanotechnology Knowledge Transfer Network (NanoKTN) announced details of a product developed by Plessey Semiconductors, as part of a project co-funded by the Technology Strategy Board (TSB), with support from the NanoKTN and JEMI UK.
Nordic Semiconductor announced the release of its µBlue™ nRF8002 System-on-Chip (SoC) that provides a low cost, ultra-low power, easy to design-in single chip solution for Bluetooth Smart wireless tags and accessories.
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A new family of ultra-reliable mixers, developed by Mini-Circuits, combines low-temperature cofired ceramic (LTCC) circuitry and specially selected semiconductor dice in a hermetically sealed case at 1/10th the price of comparable products on the market. Fully automated, tightly-controlled, and highly repeatable processes ensure excellent performance at temperatures up to 125 degrees C.