Semiconductors / Integrated Circuits

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M/A-COM Technology Solutions Inc.(“MACOM”), a leading supplier of high-performance RF, microwave and millimeter wave products, announced that it will showcase its industry-leading portfolio of new GaN power products at EDI CON 2014 in Beijing, China, April 8-10, 2014. The company will particpate in the event as an exhibitor in Booth #612 and in the conference as a presenter in the peer-reviewed technical session, workshops and special GaN expert panel to be sponsored by Richardson RFPD.

Integrated circuits and semiconductor technology are critical to the overall performance of electronic systems, whether the application is for mobile communications, radar or satellite navigation. The design track reflects the industry’s focus on recent advances in design technology with an emphasis on specific components such as filters and power amplifiers. Doherty and class-F PA architectures along with techniques such as digital pre-distortion and envelop tracking that are garnering so much industry attention at the moment will be among the hot topics presented in the field of power amplifier design.

Peregrine Semiconductor Corp. has announced UltraCMOS^®Global 1, claimed to be the first reconfigurable RF front end (RFFE). For the first time, 4G LTE platform providers and OEMs will be able to save time and money by creating a single-SKU design for global markets.

STMicroelectronics has announced Teseo III, a single-chip standalone positioning product family capable of receiving signals from multiple satellite navigation systems, including the Chinese BeiDou, the U.S. GPS, European Galileo, Russia’s GLONASS and Japan’s QZSS.

NXP Semiconductors and Datang Telecom Technology Co. Ltd. have established a joint venture that is claimed to be the first true automotive semiconductor company in China.

UMShas announced the availability of greatly enhanced Process Design Kits leveraging the latest product innovations in Agilent’s ADS electronic design automation software.

BAE Systems’ new 45 nm ASICs for space environments pack ten times more functionality and performance into the same size as current chips, without adding significant power needs.

NXP Semiconductors N.V. announced that the first product from the RoadLINK™ range, the SAF5100 flexible software-defined radio processor for C2C and C2I communication, is available for automotive customer design-in.

Twenty one students from The University of Nottingham Ningbo Campus (UNNC), UK who have just completed a unique training course in the design of integrated circuits, have all been offered jobs by Sondrel in China.

Nujira Ltd.has selected ASE as its production packaging and test partner for its Coolteq.L family of High Accuracy Tracking Envelope Tracking ICs.