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Leonard Pelletier is the Application Support Manager for Freescale RF in Tempe, AZ and is in charge of providing technical assistance to the amplifier design community. He has been with the company since 1995 working in this position supporting any and all RF applications. Prior to his work with RF components, Mr. Pelletier held amplifier design engineering positions with both the Motorola Cellular Infrastructure Group in Arlington Heights, IL and the Motorola RF Products Division in Torrance, CA

Leo G. Maloratsky received his MSEE degree from the Moscow Aviation Institute and his PhD degree from the Moscow Institute of Communications in 1962 and 1967, respectively. Since 1962, he has been involved in the research, development and production of RF and microwave integrated circuits at the Electrotechnical Institute, and was assistant professor at the Moscow Institute of Radioelectronics. From 1992 to 1997, he was a staff engineer at Allied Signal. From 1997 to 2008, he was a principal engineer at Rockwell Collins, where he worked on RF and microwave integrated circuits for avionics systems. He joined Aerospace Electronics Co. in 2008. He is the author of four monographs, one text-book, over 50 articles and owns 20 patents.

Randall writes about Oscillator Design and Computer Simulation using material from his recent Agilent/MWJ Webcast. Rhea also responds to several of the questions asked by attendees.

Dr. Ali Darwish received his PhD degree from the Massachusetts Institute of Technology (MIT), Cambridge, MA, in 1996. He currently works for the Army Research Laboratory. Darwish is also an adjunct faculty member at the University of Maryland, Baltimore County, MD, where he teaches a course on RF and mixed-signal circuit design. He has published over 30 technical articles, and has developed a number of short courses on microwave circuit design. He is currently conducting research on thermal effects in MMICs and innovative power amplifier topologies.

This month, we asked several of our contributing experts to "The Masters of MIMO" August cover story to respond to audience questions from our last webinar on MIMO. Below are the individual replies from repesentatives from SATIMO (Microwave Vision Group) and MI Technologies.

today’s highly integrated RFICs for digital wireless communications. Along the way, we will look at this problem from the foundry, EDA and designer perspectives to hopefully give a comprehensive picture of where we are today and what choices exist to improve RFIC verification and design for yield.

Derek considers the standing of III-V processes in the technological landscape, both now and in the future and how higher performance, higher integration and integrated options, together with more stringent requirements, have not only made III-V devices essential today but are ensuring that they will remain so for many years to come

Alain Michel of Ansoft France, a division of ANSYS Inc., discusses how to get more out of HFSS when designing antenna arrays through circuit co-simulation featuring “push” excitation capability and complete electromagnetic system simulation with HFSS HPC.