RF & Microwave Industry News

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Richardson RFPD Inc. announces immediate availability and full design support capabilities for a new SiRFstarIV™ GPS module from Maestro Wireless.

AWR Corp. announces that its customer, Marki Microwave has leveraged its high-frequency design software platform to develop a new design and manufacturing flow for successful mixer design. The revolutionary new mixer design flow combines AWR’s Microwave Office® circuit design software and Marki’s patent-pending Microlithic™ mixer manufacturing process, resulting in a 14x reduction in the size of Marki’s mixers and a 5x reduction in design time with the same industry-leading quality and performance as the former handcrafted devices.

Array Wireless Inc., a technology leader in the creation of efficient, high linearity microwave power amplifiers, announced a major financial investment in the company by Loma Vista Wireless Inc., and the addition of a seasoned management team to spur new growth initiatives. In addition to a cash infusion for new product initiatives, the company is expanding its facility size and hiring staff to accommodate increased design and production capacity.

AeroVironment Inc. announced that a recent outdoor test flight of a solar-powered prototype version of the company’s proven Puma AE™ small unmanned aircraft system (UAS), operating with the company’s newest long-endurance battery, lasted 9 hours, 11 minutes – significantly longer than the flight endurance of small UAS being used in the field today. AeroVironment is working with Alta Devices, a Sunnyvale, CA company that provides flexible, portable power that can be embedded into any other material, in the development of the solar Puma AE.

There are many companies that contribute to 3GPP technologies, including WCDMA/HSPA, LTE, and the EPC; however, only a handful of companies stand out across the board. ABI Research looked at the number of chairmanships, rapporteurships, overall contributions, approved contributions, and discussion papers for 3GPP standards. This was done for RAN1, RAN2, RAN3, RAN4, RAN5, SA1, SA2, SA3, SA4, SA5, CT1, CT3, and CT4 from 2009 through 2012.

By 2018, ABI Research expects annual home automation device shipments to exceed 351 million, growing at a CAGR of 78 percent. ZigBee dominated IEEE 802.15.4 and claimed the top share of node shipments at 4.5 million, narrowly beating out proprietary protocol offerings.

KOA Speer Electronics, a leading supplier of passive electronic components, has announced that its TLRH3AW metal plate chip current sense resistor now features an extended resistance range of 10mΩ ~ 270 mΩ with greater corrosion protection and higher temperature resistance up to +170°C.

European Microwave Week is back in Germany once again. In Nuremberg, Rohde & Schwarz will present its wide range of T&M equipment for microwave applications. Experts from Rohde & Schwarz will also be holding ten workshops and seminars as part of the event program. The following test and measurement highlights will be on display in hall 7A, booth 106 at the NCC:    

Fox Electronics, a leading global supplier of frequency control solutions and an IDT company, now offers the FTM Series of surface mount OCXOs that is ideally suited as the timing reference for network synchronization.

DuPont Circuit & Packaging Materials (DuPont) and IQLP LLC, a division of Interplex Industries Inc., announced their ongoing efforts to further develop and refine liquid crystal polymer (LCP) thin-film technology for use in high-speed circuit applications.  The development efforts are being conducted pursuant to a joint development agreement and a license agreement previously entered into by the parties.