RF & Microwave Industry News

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Rohde & Schwarz adds the rugged, passive R&S RT ZZ80 broadband probe to its portfolio. This probe offers a bandwidth of 8 GHz. When analyzing electronic circuits, passive broadband probes such as the R&S RT-ZZ80 are a cost-efficient, rugged alternative to active, high bandwidth probes. They are well-suited for testing transmission lines with low impedance (20 Ohm to 100 Ohm).   

Skyworks Solutions Inc., an innovator of high performance analog semiconductors enabling a broad range of end markets, is ramping several antenna tuning products with leading smartphone manufacturers. Skyworks’ devices are meeting the market demand for tunable antennas which dramatically improve performance by increasing data throughput, reducing dropped calls and minimizing the antenna footprint needed for today’s multiband LTE smartphones.

RF Micro Devices Inc. announced the expansion of the company's entry solutions product portfolio to include multiple new solutions for 2G and 3G entry smartphones. The new RF solutions are designed to solve the increasingly complex RF requirements of entry-level 2G and 3G smartphones related to cost, band count, and thermal dissipation.

Coupling Wave Solutions S.A. (CWS) announced that STMicroelectronics has adopted the WaveIntegrity™ analysis tools to remove risk caused by on-chip, package and PCB parasitics. Following multiple evaluations, STMicroelectronics is deploying WaveIntegrity across multiple groups.

Richardson RFPD Inc. announced the launch of its Avionics & Radar Tech Hub, a micro-website featuring the latest news, innovations and new products related to avionics and radar applications.

What: AWR is a gold sponsor at the Electronic Design Innovations Conference (EDI CON) 2013, which runs from March 12 -14 in Beijing, China. Together with parent company National Instruments, AWR will be showcasing at Booth #255 joint hardware/software solutions, as well as the first update in 2013 of the AWR Design Environment™, inclusive of Microwave Office®/Analog Office® circuit design software, VSS™ system design software, as well as AXIEM® 3D planar EM software and Analyst™ 3D FEM EM software.

Anaren Inc. announced that its Anaren Integrated Radio (AIR) module team is partnering with Austin, Texas-based middleware developer Emmoco to create the AIR Support for BLE solution. As a guest supplier at the Premier-Farnell booth (#220, Hall 5) in the Embedded World 2013 exhibition, the AIR team will be explaining its technology concept for fast-emerging Bluetooth Low Energy (BLE) applications -- and will also be actively developing a pool for "beta-testers" for the upcoming AIR Support for BLE solution, which is scheduled for release in the spring/summer of 2013.

ZTE Corp., a global provider of telecommunications equipment and network solutions, has selected the KeyStone multicore System-on-Chips (SoCs) from Texas Instruments Inc. (TI) for its small cell base station products. TI's KeyStone SoCs are programmable multicore processors which enable ZTE to develop wireless base stations capable of concurrently supporting multiple 3G and 4G air interface standards.

Peregrine Semiconductor Corp., a fabless provider of high-performance radio frequency integrated circuits (RFICs),  announced from Mobile World Congress in Barcelona the latest version of UltraCMOS® process technology — Semiconductor Technology Platform 8 (STeP8). STeP8 technology shows a 36 percent improvement in RonCoff performance over STeP5 technology announced just one year ago — dramatically improving the linearity, insertion loss, and isolation capabilities of Peregrine’s RFIC products.

RF Micro Devices Inc., a global leader in the design and manufacture of high-performance radio frequency solutions, announced the addition of multiple new products to RFMD's industry-leading portfolio of envelope tracking (ET) power management and power amplifier (PA) solutions.