RF & Microwave Industry News

Infineon presents world’s smallest plug-and-play NFC security module for smart wearables

From fitness trackers and smart keys to chains, watches or wristbands – wearable manufacturers are challenged to equip even the smallest of devices with security and NFC technologies. The solution lies in a unique NFC security module series launched by Infineon Technologies AG in collaboration with Beijing-based Mobile Payment Solutions Co. Ltd. (MPS).


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CWS launches SiPEX, a productivity tool for RF SOI designs

Coupling Wave Solutions S.A. (CWS), a leader in solutions for interference analysis in complex chip designs incorporating RF and analog blocks, announced the availability of a new productivity tool called SiPEX. SiPEX models the silicon substrate on insulators much faster than any other tools in its class and allows radio frequency (RF) silicon-on-insulator (SOI) designers to increase the number of design iterations—including spice simulation—up to 10 times in the same time frame.


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Rogers' PES introduces new curamik CoolPerformance Plus coolers

Rogers Corp.’s Power Electronics Solutions (PES) group has introduced its latest high-performance cooling material, curamik® CoolPerformance Plus. curamik CoolPerformance Plus is an advanced liquid-cooled material designed to dissipate large amounts of heat and provide reliable thermal management of high-power laser diodes and other heat-generating optical devices.


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Cobham and RFHIC to develop new GaN solid state radar

Cobham and RFHIC will jointly develop GaN High Power Amplifier (HPA) modules that will be integrated into a prototype 175 kW solid-state transmitter. Development activities under this Memorandum of Agreement will be executed by Cobham Integrated Electronics Solutions, a business unit of CAES at its Exeter, N.H. site.


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