RF & Microwave Industry News

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AWR Corp. announced the availability of NXP Semiconductor 's sixth- and seventh-generation laterally-diffused metal oxide semiconductor (LDMOS) power transistor library for AWR’s Microwave Office® design software. The NXP LDMOS power transistor library is ideal for use by designers of high-power power amplifiers (PA) found within base station broadcast and...

Rogers Corp. will be showcasing its high performance, cost-effective laminate materials for antenna applications at the upcoming Antenna Systems 2010 conference and expo (October 19-20, 2010, Gaylord Texan Resort & Convention Center, Dallas, TX). Representatives from Rogers Advanced Circuit Materials (ACM) Division will be present at Booth #104 to...

Freescale Semiconductor introduces three new RF LDMOS power transistors that deliver ultra high output levels required for Doherty-type, multi-carrier power amplifiers (MCPA) used in wireless base station transceivers. Freescale’s MRF8S18260H/S, MRF8P18265H/S and MRF8S19260H/S products are the newest members of Freescale’s High Voltage Eighth Generation (HV8) family of RF power...

VIPER RF has entered into a co-marketing agreement with TriQuint , through which VIPER RF will offer design support and specialized RF expertise to help customers develop chips using TriQuint's process technologies and design tools. Specializing in microwave and RFIC design and development, VIPER RF is a UK consultancy...

Rohde & Schwarz has entered into a cooperative agreement with the Belgian company NMDG , a highly specialized provider of nonlinear network analysis solutions that will enable Rohde & Schwarz to expand its extensive network analysis portfolio of nonlinear measurement solutions. Today's advanced RF components and systems need to...

The growing recognition of the global significance of machine-to-machine (M2M) communications was demonstrated in the first meeting outside Europe of the M2M technical committee of the European Telecommunications Standards Institute (ETSI). The meeting of the committee, which defines the operation of future M2M communications and the efficient integration onto...

The predicted demise of dedicated, single-chip solutions for mobile phones has been exaggerated, according to ABI Research Vice President Kevin Burden. “The push in recent cellular handset design has also been to combine as many radios as possible on a single chip. These multi-function Combo ICs have gotten all...

Agilent Technologies Inc. announced it has begun unveiling the highly anticipated next release of its Advanced Design System (ADS) flagship RF design software. ADS 2011 delivers breakthrough capabilities for multi-technology design inherent in today’s RF System-in-Package (SiP) components. Existing Agilent customers and partners, including foundries and component vendors, are...

M/A-COM Tech Asia will showcase S-band and X-band Core Chip Solutions for military and weather radar and satellite communications applications during the European Microwave Week (EuMW) exhibition. The company's booth (#91) will display complete block diagram solutions that include a core chip, power amplifiers and low noise amplifiers. M/A-COM...

Agilent Technologies Inc. announced the Agilent N6070A series signaling conformance test for 3GPP LTE user equipment (UE), which extends the capability of the new Agilent PXT Mobile Communications Test Set to a complete signaling conformance test solution (also known as protocol conformance test or PCT). This innovative test solution...