RF & Microwave Industry News

StratEdge introduces laminate packages for high power devices

StratEdge Corp., a designer and producer of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, introduces a new family of high power laminate packages at IMS2012 Booth #1625. The LL family of leaded laminate copper-moly-copper (CMC) base packages dissipates heat from high power compound semiconductor devices, such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC).


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Versatile Power announces new patent award

Versatile Power Inc. a designer and manufacturer of custom electronic subsystems, announced it has been awarded U.S. Patent Number US 8,115,366 B2, entitled “System and Method of Driving Ultrasonic Transducers” (the “Patent”), by the USPTO. This patent covers a unique method for electronically driving an ultrasonic transducer used in a variety of applications including medical, dental and many other applications requiring ultrasonic energy.


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R&S takes wireless device precompliance testing into the lab

Rohde & Schwarz has added three new options for its compact R&S DST200 RF diagnostic chamber: the R&S DST-B160 automated 3D positioner, the R&S DST-B210 cross-polarized test antenna and the R&S DST-B270 communications antenna. The new options significantly speed up precompliance testing of wireless devices, allowing automated test sequences to be performed on the lab bench so that developers no longer require constant access to large RF test chambers.  


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