RF & Microwave Industry News

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While microwave and millimeter wave high-power vacuum electron devices (VEDs) remain “below the radar” of many industry observers, the total available market (TAM) for this segment is nearly $1 billion in 2012.

M/A-COM Technology Solutions Inc., a leading supplier of high performance analog semiconductor solutions, is showcasing a broad portfolio of new products for Networks, Aerospace and Defense, and Multi-Market applications at European Microwave Week (EuMW) 2012.  Product solutions on display in M/A-COM Tech’s booth #421 include:

What: This application note addresses test challenges faced by phased array antenna engineers including:

• The need for fast wideband, high resolution sampling of IF signals post downconversion.

Worldwide handset shipments decreased 1.9 percent YoY to 387.3 million units in Q3 2012, according to new data from market intelligence firm ABI Research. Worldwide smartphone shipments increased 32.8 percent  YoY to 155.5 million over the same period. Samsung retained the lead position in both handset and smartphone shipments. Underscoring its accomplishment, Samsung shipped more than double the smartphones of second place Apple.

TriQuint Semiconductor Inc., a leading RF products manufacturer and foundry services provider, has introduced its first four high-performance Surface Acoustic Wave (SAW) GPS diplexer modules that are nearly three times smaller than ceramic diplexers. The new family can employ any TriQuint CSP5 packaged RF filter, with the first four devices focused on the low loss/high attenuation GPS needs of commercial and defense systems including communications, ECCM and navigation.

Designed for high-bandwidth applications using proprietary processes, Molex Inc.'s Temp-Flex microwave cables deliver exceptional electrical performance in military, A&D, robotics and medical markets, in addition to automatic test equipment.

Texas Instruments Inc. (TI), leading the industry with the most complete wireless connectivity portfolio for embedded applications,today announced that its Bluetooth® v4.0 technology-based CC2560 and CC2564 wireless devices are now available in easy-to-integrate QFN packages offered by TI and its distribution partners. TI also announced the availability of additional production-ready modules based on the two devices, as well as software and tools.

Richardson RFPD Inc. announces immediate availability and full design support capabilities for a new internally matched, low noise amplifier (LNA) in a small 2x2mm DFN package from TriQuint Semiconductor Inc. (TriQuint).

Teseq Holding AG, a leading developer and provider of instrumentation and systems for EMC emission and immunity testing, has acquired New York-based Instruments for Industry (IFI), a leading designer and manufacturer of solid state and traveling wave tube (TWT) amplifiers. The acquisition expands Teseq’s model range from an upper limit of 6 GHz up to an upper limit of 40 GHz and power levels from an upper limit of 1 kW to an upper limit of 10 kW.

AMCAD Engineering announced the upgrade of its PIV semiconductor device analyzer family for the next generation of High Voltage Fast Switching (HVFS) Transistors.